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  Exceeding Productivity Demands
for Heavy Wire Bonding
PiQCNew white paper focuses on the cycle time for wedge bonding. To achieve an increase in productivity, each element of the wire bonding equipment in relation to optimizing the wire bonding process must be questioned. Learn more…
Hesse & Knipps, Inc.
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F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
F&K Delvotec




PCD Technology Improves Dispensing
PCD TechnologyVolumetric dispensing improves throughput and dispense quality. PCD technology is compatible with a wide range of viscosities from water to thick pastes. Increase throughput 2–4 times with this new technology, learn more…
GPD Global
  Corporate News Index
August 12, 2009

IMAPS, IEEE/CPMT, and ACerS summer social meeting

The San Diego Joint Chapters of IMAPS, IEEE/CPMT, and ACerS will hold its summer social meeting at Karl Strauss brewery restaurant in Sorrento Mesa on Wednesday, August 19th.

The restaurant is hidden in the woods behind the parking lot at 9675 Scranton Road. The meeting begins at 5:00. Come out to see old friends and participate in stimulating conversations about packaging, ceramics, and microelectronics.

A $20 pre-registration feeis required and itentitles you to a tasty dinner.

Go to http://sdchapters.org/ for more details.

Space is limited so do not delay.

Contact:
San Diego Chapters

Casey Krawiec
http://sdchapters.org

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Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
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