December 12, 2012 - Event Calendar
LED Packaging
In the future, solid state lighting manufacturers will focus on the development of high-power, high brightness LEDs. Since LED packaging ...
Semitracks
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July 11, 2012 - Event Calendar
Reliability Challenges
Semiconductor reliability is at a crossroads. In the past, reliability meant discovering, characterizing and modeling failure mechanisms and ...
Semitracks
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May 7, 2012 - Event Calendar
Copper Wire Bonding Technology and Challenges
The drive to reduce costs in semiconductor and integrated circuits remains a key challenge for the industry. For example, many of today's ICs use ...
Semitracks
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March 13, 2012 - Event Calendar
Polymers and FTIR Course
This 2-day course offers detailed instruction on the technology issues associated with polymers in semiconductor packages and electronics. We ...
Semitracks
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March 12, 2012 - Event Calendar
Semiconductor Reliability Course
Semiconductor Reliability is a 3-day course that offers detailed instruction on a variety of subjects pertaining to semiconductor reliability.
Semitracks
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March 12, 2012 - Event Calendar
Wafer Fab Processing Course
This course offers an in-depth look into the semiconductor manufacturing process and individual processing technologies. We place special ....
Semitracks
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February 13, 2012 - Event Calendar
Failure Analysis
This multi-day course covers effective analysis tools and presents systematic process flows that simplify defect localization and ...
Semitracks
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February 9, 2012 - Event Calendar
EOS/ESD and How to Differentiate
Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. ...
Semitracks
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February 6, 2012 - Industry News
Novellus Sees China, Wafer-Level Packaging, 3D NAND as Market Drivers
Wafer-level packaging and 3D NAND are two market drivers that will propel revenues at the combined Lam-Novellus operation this year and next, chief ...
Semiconductor Manufacturing & Design
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February 2, 2012 - Top Story News
Microsoft Touts DFM for Systems and Chip Design
Chip scaling is expected to continue for the next decade, but systems houses face a number of challenges in semiconductor production and design-for-manufacturing (DFM). "I believe we still have ten years in the pipeline to continue Moore's Law," ...
Semiconductor Manufacturing & Design
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February 2, 2012 - Industry News
Firms Mull New Mobile DRAM Standard Amid 3D Concerns
Amid the cost and manufacturing uncertainties for 3D-based Wide I/O DRAMs, the memory community has intensified the discussions about the development ...
Semiconductor Manufacturing & Design
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February 1, 2012 - Corporate News
Touchstone Semiconductor Launches the Touchstone Video Channe
Touchstone Semiconductor announced it has launched the new Touchstone Video Channel featuring application videos to help design engineers in applying ...
Touchstone Semiconductor
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January 31, 2012 - Industry News
Lithography Vendors Expand Immersion Roadmaps
At one time, there was a prevailing thought that 193nm immersion lithography would soon run out of gas, possibly at the 32nm node or so. Then, at ...
Semiconductor Manufacturing & Design
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January 30, 2012 - Industry News
Samsung Raises Semi Capex to $13.4 Billion
Heading into 2012, most predicated that semiconductor capital spending would be down this year amid sluggish IC demand. Suddenly, capital spending ...
Semiconductor Manufacturing & Design
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January 30, 2012 - Industry News
Lithography Vendors Expand Immersion Roadmaps
At one time, there was a prevailing thought that 193nm immersion lithography would soon run out of gas, possibly at the 32nm node or so. Then, at ...
Semiconductor Manufacturing & Design
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January 30, 2012 - Exclusive Articles/Announcements
2012 IC Market Forecast
We were invited to attend an IC Insights seminar on the "The McClean Report" last week in Boston. The seminar was hosted by Bill McClean and Trevor Yancey for IC Insights and provided an excellent update on the semiconductor markets for 2012. The presentation included over 100 slides with analysis and forecast for the IC industry. I've summarized the highlights ...
Semiconductor Packagning News
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January 27, 2012 - Top Story News
Order Resurgence as Foundries Ramp
KLA-Tencor executives said their company enjoyed a record burst of orders in recent weeks and is scrambling to fill them. "The big story in December is that we saw a resurgence in bookings, up 95% compared with the September quarter ...
Semiconductor Manufacturing & Design
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January 24, 2012 - Industry News
Semi Equipment Industry Posts December 2011 Book-to-Bill Ratio of 0.88
North America-based manufacturers of semiconductor equipment posted $1.16 billion in orders in December 2011 and a book-to-bill ratio of 0.88 ...
SEMI
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January 24, 2012 - Industry News
Collaboration, Coordination And Consolidation
By anyone's standards, the ability of the semiconductor industry to reduce costs is the pinnacle of industrial automation. The dollar that bought a ...
Semiconductor Manufacturing & Design
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January 23, 2012 - Industry News
Micron Technology to Make Deal with Elpida
There are more rumors that Micron Technology Inc. will make a bid for debt-ridden Elpida Memory Inc. As reported, there has been speculation about ...
Semiconductor Manufacturing & Design
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January 23, 2012 - Corporate News
Touchstone Semiconductor Launches the New TS6001A
Touchstone Semiconductor announced the newest member of its voltage reference family, the TS6001A, a low-power, low-dropout precision SOT-23 voltage ...
Touchstone Semiconductor
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January 23, 2012 - Industry News
Intel Ups 2012 Capex Budget to $12.5 Billion
Intel Corp. said its capital spending for 2012 is expected to be $12.5 billion, plus or minus $400 million, with "more than a third" of the 2012 ...
Semiconductor Manufacturing & Design
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January 20, 2012 - Industry News
3D packaging or general chip shot
To enable high-volume production readiness of 3D-based products, SEMATECH's 3D Interconnect and Manufacturability programs will be conducting ...
EuroAsia Semiconductor
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January 20, 2012 - Industry News
December 2011 SEMI Book-to-Bill Rescheduled
The December 2011 SEMI Book-to-Bill press release, originally scheduled for January 19, 2012, has been rescheduled pending completion of data ...
SEMI
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January 19, 2012 - Top Story News
Tool Vendors Want More Say in 450mm
The 450mm era recently celebrated its first milestone with the announcement of a new and major consortium. While the new group -- dubbed the Global 450 Consortium or G450C -- has gotten the ball rolling in 450mm, the fab tool community has suddenly ...
Semiconductor Manufacturing & Design
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