January 27, 2012 - Industry News
Huge Capex Raises Questions Over Fablessness
Huge 2012 capex budgets at Intel, Samsung and TMC will skew the industry to make it extremely challenging, and in some cases impossible, for smaller ...
Electronics Weekly
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January 26, 2012 - Industry News
Huge Capex Raises Questions Over Fablessness.
Huge 2012 capex budgets at Intel, Samsung and TMC will skew the industry to make it extremely challenging, and in some cases impossible, for smaller ...
Electronics Weekly
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January 9, 2012 - Industry News
Fab-lite exports brains, says Harvard professor
American semiconductor companies are exporting their brains, says the author of the Innovators Dilemma, Harvard Business School professor Clayton Christensen ...
Electronics Weekly
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January 6, 2012 - Industry News
Silicon oscillators can take on crystals, says IDT
Fuelled by consumer and industry demand for smaller, faster designs with greater levels of innovative functionality, semiconductor technology is ...
Electronics Weekly
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December 28, 2011 - Industry News
TSMC Reiterates 2013-14 450mm Trial Production Plan
According to DigiTimes, TSMC has reiterated its intention start trial production on 450mm wafers in 2013-14 and to be in volume production in ...
Electronics Weekly
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December 27, 2011 - Industry News
TSMC reiterates 2013-14 450mm plan
According to DigiTimes, TSMC has reiterated its intention to start trial production on 450mm wafers in 2013-14 and to be in volume production in ...
Electronics Weekly
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December 20, 2011 - Industry News
Taiwan IC output 10% down on the year
The value of Taiwan's IC production is expected to fall 10% this year, reports The China Post, quoting Hung Chun-hui, of the Market Intelligence ...
Electronics Weekly
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December 20, 2011 - Industry News
Start-ups need more support, says Mentor Graphics director
Although 2011 has been a strong year for Mentor Graphics it has been a tough time for microelectronics startups. This matters because they fuel innovation ...
Electronics Weekly
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December 12, 2011 - Industry News
TSMC starts to build 20nm fab
TSMC has started on Phase 3 of its Fab 15 GigaFab in Taichung which is being built for 20nm processing. "We hope that our leadership will make Taiwan a ...
Electronics Weekly
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December 7, 2011 - Industry News
Singapore duo to streamline interposer production
In Singapore, the A*STAR Institute of Microelectronics (IME) and 3D wafer-stacking firm Tezzaron Semiconductor will jointly develop and exploit ...
Electronics Weekly
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November 28, 2011 - Industry News
SEMI invites suggestions on EU semi funding
Heinz Kundert, CEO of SEMI Europe, has written to semiconductor industry CEOs and EC officials asking for their views on how the EC might most efficiently ...
Electronics Weekly
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November 23, 2011 - Industry News
Let's not talk ourselves into a crisis - McAneny
Chris McAneny director of strategic business development at Future Electronics (EMEA) tells Electronics Weekly there is a real danger that ...
ElectronicsWeekly
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November 22, 2011 - Industry News
ARM, TSMC Moving Fast To 20nm
ARM and TSMC are moving fast to get Cortex A-15 out on a 20nm process. A chip has already been taped out and an ARM process team has been set up in Taiwan ...
Electronics Weekly
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November 15, 2011 - Industry News
Recession or inventory? That is the question.
The European chip market is still on course for a growth year. But the wind is changing. The first half was growth, but the worry is there was a ...
Electronics Weekly
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November 15, 2011 - Industry News
IBM and ARM lead way for very low power SOI chips
IBM and ARM are leading a group of semiconductor companies developing plans to port bulk CMOS designs to fabricate ICs on fully depleted silicon- ...
Electronics Weekly
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November 14, 2011 - Top Story News
TSMC 20nm Looking Promising
TSMC's 20nm process is demonstrating some promising properties. Going from 28nm to 20nm delivers, says TSMC's President for Europe, Maria Marced, 25% improvement in power consumption ...
Electronics Weekly
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November 11, 2011 - Top Story News
450mm Could Cost $40bn, Says CEA-LETI
The 450mm wafer transition could cost $40bn says CEA-LET's Michel Brillouet. SEMI puts the cost at $25-40bn with much of it centred at the Global 450 Consortium. Tom Jefferson, 450 ...
Electronics Weekly
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November 7, 2011 - Industry News
TSMC ramping 28nm 3x faster than 40nm.
TSMC is ramping its 28nm process three times as fast as the company ramped the 40nm node. "I've been there for the launch of the 65nm and 40nm ...
Electronics Weekly
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November 3, 2011 - Industry News
3D TV commoditises, LED and smart TVs are the new must haves
3D TV is not the 'must-have' TV, says IC Insights, the must-haves which are driving the market are LED TVs and smart TVs which get content from the ...
Electronics Weekly
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November 2, 2011 - Industry News
Star Trek -- The Great Predictor
Where did you first see voice-activated computers, touch-screen controls, motion control, 3D displays, remote sensing, non-invasive diagnostics, ...
Electronics Weekly
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October 24, 2011 - Industry News
TSV on chip interconnection promising for 3D chip design
Through-silicon via (TSV) on chip interconnection of memory, processor and sensor elements looks the most likely route for 3D chip design, writes ...
Electronics Weekly
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October 21, 2011 - Industry News
Is China RoHS moving nearer?
The Certification and Accreditation Administration of China has published implementation rules on the Voluntary Certification on the Pollution ...
Electronics Weekly
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October 20, 2011 - Industry News
The 450mm Dog's Dinner
450mm is the most divisive issue ever to hit the semiconductor industry. For many years there was a stand-off between the device manufacturers and ...
Electronics Weekly
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October 20, 2011 - Top Story News
TSV Technology Revolutionizes Chips
Through-silicon via (TSV) on chip interconnection of memory, processor and sensor elements looks the most likely route for 3D chip design. As the complexity of system-on-chip ...
Electronics Weekly
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October 19, 2011 - Industry News
Through-silicon via technology revolutionises chips
Through-silicon via (TSV) on chip interconnection of memory, processor and sensor elements looks the most likely route for 3D chip design, writes ...
Electronics Weekly
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