the Ultra 850G at Semicon West 2009

Carlsbad, CA: Machine Vision Products today announced it would be demonstrating the Ultra 850G Semiconductor, Packaging and MicroElectronics AOI solution at the Semicon West 2009 exhibition at the Moscone Center in San Francisco between 14^th and 16^th July at booth 743 in the South Hall.

The Ultra 850G is the latest addition to MVP's industry-leading line of Automated Optical Inspection tools, asserting its position as a total solution provider. The Ultra 850G is configurable to be deployed in all aspects of the packaging processes from Paste/Flux through the C4 assembly process, Die attach and finally at the Underfill process.

The Ultra 850G can also provide inspection for both Wire Bond and Wire Loop Height. The system can be configured to provide resolutions to 1um pixel size for inspection of Wire Bond at the sub 1 mil range.

With the Ultra 850G MVP integrates the company's easy-to-use programming tools and analytical process control tools in this platform. This convergence of technology from Machine Vision Products, Inc. delivers the best available combination of defect detection capabilities, metrology for process control and inspection throughput at a low cost of ownership.

Machine Vision Products, Inc is exhibiting the Ultra 850G platform at the Semicon West Exhibition at the Moscone Center, San Francisco, California during July 14-16, 2008 in the South Hall, booth 743.