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July 2, 2009


PacTech's SB2-Jet
Laser Solder Jetting System
PacTech's SB2Sequential high speed soldering using laser-reflow with high substrate design and solder ball size flexibility. Fluxless, contactless at low thermal stress—ideal for flip-chip, MEMS, 3D-packaging and CSP/BGA's re-balling. Learn more…
PacTech

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Exceeding Productivity Demands
for Heavy Wire Bonding
PiQCNew white paper focuses on the cycle time for wedge bonding. To achieve an increase in productivity, each element of the wire bonding equipment in relation to optimizing the wire bonding process must be questioned. Learn more…
Hesse & Knipps, Inc.
Letters Submit

Microelectronics & Semiconductor Package
AOI with Flexible Material Handling
Machine Vision ProductsMVP's Ultra 850G platform provides 2D & 3D metrology capabilities for backend semiconductor & microelectronics devices to 1µm resolution. Tray, Strip, In-Line, Magazine and custom handling solutions are available for any module or package style. Learn more…
Machine Vision Products, Inc.
Top Story  
IC market 'surge' at hand, says analyst
The second half of 2009 will bring welcome relief to the semiconductor and capital equipment industries, according to market research firm IC ...
EETimes

Ultra Precision Micro Assembly
and High Performance Dispensing
Air-Vac DRS24Unique Benchtop or Cell Systems with flexible design, can be configured to your specific application requirements, learn more…
Air-Vac Engineering
Industry News  
Analysts see upbeat third quarter in store for chips
Despite lingering concerns about the tech market, chip manufacturers are poised for a generally upbeat third quarter. The positive outlook coming ...
Market Watch
Foxconn says it's not quitting the channel
Speculations about Foxconn quitting the channel are false says the company's sales team, hitting back as rumours of the firm's channel demise ...
The Inquirer
NEC Electronics Expects Orders to Climb Next Quarter
NEC Electronics Corp.’s semiconductor orders will increase "several percent" next quarter, helped by demand for chips used in cars and ...
Bloomberg
SIA Supports Call For Caution In Changes To Int'l Tax Rules
The Semiconductor Industry Association gave strong support to the New Democrat Coalition’s call to avoid tax changes that could damage the ...
Semiconductor Industry Association
New Greenpeace guide lauds Apple, attacks PC makers
Large PC builders are dragging their feet when it comes to environmental promises, claims Greenpeace. The activist group has once again updated ...
Electronista
Rambus claims 'world's fastest memory'
Rambus, a technology licensing companies specialising in high-speed memory architectures, has demonstrated its XDR memory system running at data ...
Electronics News
Is FPGA startup CSwitch dead?
FPGA startup CSwitch Corp. appears to have closed its doors, according to several industry sources, including one of the third-party sales ...
EETimes
Small-size driver IC price likely to be raised in July
Taiwan small-size driver IC makers have said they may raise product prices in July at the earliest to reflect the costs. The backend production ...
Digitimes
Taiwan market: Government imposes quality inspection on PND devices after MStar outage
The Taiwan government has imposed a quality inspection measure on all GPS PND devices for sale in Taiwan, according to sources at the Bureau of ...
Digitimes
Intel entry-level G31 chipset in tight supply
The supply of Intel's entry-level G31 IGP chipset, which currently accounts for 50% in Intel's total shipments to the channel, has fallen far short ...
Digitimes
Report: 3D IC Technology
Research and Markets has announced the addition of Frost & Sullivan's new report "3D IC Technology - An Assessment" to their offering. This Frost ...
Research and Markets
New Report Just Published Global and China MEMS Industry Report, 2008-2009
Reportlinker.com announces that a new market research report related to the Microelectronics industry is available in its catalogue. ...
Live-PR
China's Huawei needs makeover to win big markets
The meteoric rise of China's Huawei to challenge the world's top telecom gear makers has been mainly in secondary markets, but a serious push ...
EETimes
Foxconn says not quitting own-brand motherboard business
Foxconn Electronics has said it will maintain its own-brand marketing staff for motherboards but will transfer some staff to support other ...
DigiTimes

cyberTECHNOLOGIES extends lead in surface metrology for PV applications
Track JobExpanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more…
cyberTECHNOLOGIES
Technology News  
Low-Power Design Site Aids Green Engineering
Off-Chip Communications LLC has launched the online engineering magazine, blog and forum http://www.low-powerdesign.com, a portal catering to the ...
PR Newswire
New family of LED drivers support small LCD screens
Diodes Incorporated has introduced a family of three new LED drivers that provide a cost-effective and small form factor solution for small ...
EETimes
QuantaSol touts efficiency of single-junction solar cell
QuantaSol Ltd., a developer quantum-well based photovoltaic technology and spinoff from Imperial College, London, has developed what it says is ...
EETimes
University of Houston To Offer New Nanoengineering Minor This Fall
The University of Houston is expanding its nanoscience and nanotechnology offerings this fall with the launch of a unique program intended to ...
Nanotechwire
Siemens sprays organic photodiodes
Researchers from Siemens Corporate Technology (CT) have developed a cost-effective production process for organic large-area photo ...
EETimes
Canon forced to 're-size' chip equipment factory
Canon has issued a statement in response to press reports that it is to slash 700 jobs at a Japanese factory that makes equipment used to ...
Amateur Photographer

1µ Placement Accuracy
TRESKY High Accuracy Bonder
M-System1Advanced, highly accurate assembly solutions with an easy-to-use platform for micro-electronics assembly. Ideal for Flip-Chip, Thermosonic, MEMS, Optical Components. Learn more…
Dr Tresky AG

Corporate News Submit
DEK Solar adds another bright spark to its global Alternative Energies team
DEK Solar continues its commitment to illuminating the solar energy sector following the announcement that Robin Bancroft has joined its ...
DEK Solar
Today's Sponsor

"Which valve do I use" answered by PCD Dispense Technology
PCD TechnologyNo matter the material the PCD dispense technology will deliver volumetric, repeatable results without calibration. Ease of setup and compatibility over a wide range of viscosities ensures repeatable day-to-day operations. Learn more…
GPD Global

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F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
F&K Delvotec

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MEPTEC/SMTA Presents
2010 Medical Electronics Symposium
Medical Electronics SymposiumJoin MEPTEC & SMTA on September 22-23, 2010, at Arizona State University for Successful Strategies for the Medical Electronics Sector: Steady Growth Keeps the Momentum Moving Forward. Learn more…
MEPTEC


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