July 2, 2009
PacTech's SB2-Jet
Laser Solder Jetting System
 Sequential high speed soldering using laser-reflow with high substrate design and solder ball size flexibility. Fluxless, contactless at low thermal stress—ideal for flip-chip, MEMS, 3D-packaging and CSP/BGA's re-balling. Learn more…
PacTech
Exceeding Productivity Demands
for Heavy Wire Bonding
 New white paper focuses on the cycle time for wedge bonding. To achieve an increase in productivity, each element of the wire bonding equipment in relation to optimizing the wire bonding process must be questioned. Learn more…
Hesse & Knipps, Inc.
Microelectronics & Semiconductor Package
AOI with Flexible Material Handling
 MVP's Ultra 850G platform provides 2D & 3D metrology capabilities for backend semiconductor & microelectronics devices to 1µm resolution. Tray, Strip, In-Line, Magazine and custom handling solutions are available for any module or package style. Learn more…
Machine Vision Products, Inc.
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Ultra Precision Micro Assembly
and High Performance Dispensing
 Unique Benchtop or Cell Systems with flexible design, can be configured to your specific application requirements, learn more…
Air-Vac Engineering
Analysts see upbeat third quarter in store for chips
Despite lingering concerns about the tech market, chip manufacturers are poised for a generally upbeat third quarter. The positive outlook coming ...
Market Watch
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Foxconn says it's not quitting the channel
Speculations about Foxconn quitting the channel are false says the company's sales team, hitting back as rumours of the firm's channel demise ...
The Inquirer
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NEC Electronics Expects Orders to Climb Next Quarter
NEC Electronics Corp.’s semiconductor orders will increase "several percent" next quarter, helped by demand for chips used in cars and ...
Bloomberg
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SIA Supports Call For Caution In Changes To Int'l Tax Rules
The Semiconductor Industry Association gave strong support to the New Democrat Coalition’s call to avoid tax changes that could damage the ...
Semiconductor Industry Association
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New Greenpeace guide lauds Apple, attacks PC makers
Large PC builders are dragging their feet when it comes to environmental promises, claims Greenpeace. The activist group has once again updated ...
Electronista
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Rambus claims 'world's fastest memory'
Rambus, a technology licensing companies specialising in high-speed memory architectures, has demonstrated its XDR memory system running at data ...
Electronics News
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Is FPGA startup CSwitch dead?
FPGA startup CSwitch Corp. appears to have closed its doors, according to several industry sources, including one of the third-party sales ...
EETimes
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Small-size driver IC price likely to be raised in July
Taiwan small-size driver IC makers have said they may raise product prices in July at the earliest to reflect the costs. The backend production ...
Digitimes
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Taiwan market: Government imposes quality inspection on PND devices after MStar outage
The Taiwan government has imposed a quality inspection measure on all GPS PND devices for sale in Taiwan, according to sources at the Bureau of ...
Digitimes
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Intel entry-level G31 chipset in tight supply
The supply of Intel's entry-level G31 IGP chipset, which currently accounts for 50% in Intel's total shipments to the channel, has fallen far short ...
Digitimes
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Report: 3D IC Technology
Research and Markets has announced the addition of Frost & Sullivan's new report "3D IC Technology - An Assessment" to their offering. This Frost ...
Research and Markets
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New Report Just Published Global and China MEMS Industry Report, 2008-2009
Reportlinker.com announces that a new market research report related to the Microelectronics industry is available in its catalogue. ...
Live-PR
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China's Huawei needs makeover to win big markets
The meteoric rise of China's Huawei to challenge the world's top telecom gear makers has been mainly in secondary markets, but a serious push ...
EETimes
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Foxconn says not quitting own-brand motherboard business
Foxconn Electronics has said it will maintain its own-brand marketing staff for motherboards but will transfer some staff to support other ...
DigiTimes
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cyberTECHNOLOGIES extends lead in surface metrology for PV applications
 Expanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more…
cyberTECHNOLOGIES
1µ Placement Accuracy
TRESKY High Accuracy Bonder
 Advanced, highly accurate assembly solutions with an easy-to-use platform for micro-electronics assembly. Ideal for Flip-Chip, Thermosonic, MEMS, Optical Components. Learn more…
Dr Tresky AG
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