February 2, 2012 - Industry News
Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs
Palomar Technologies announced a precision eutectic process development for direct attach light emitting diodes (LEDs). "Direct-attach LEDs are the next...
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January 30, 2012 - Industry News
A Record Year for FRT
"Highly satisfied" - is the conclusion at Fries Research & Technology (FRT). "2011 was a record year for us", according to the managing director, Dr. Thomas ...
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December 16, 2011 - Industry News
Quik-Pak Announces Copper Wire Bonding Capability
Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today they fully support copper wire ...
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June 22, 2011 - Industry News
National Remembers Legendary Analog Expert Bob Pease
National Semiconductor looked back on the accomplishments of legendary design engineer Bob Pease, who died June 18. During his 33 years at National ...
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May 17, 2011 - Industry News
Spansion and SMIC Expand Foundry Agreement
Spansion Inc. and Semiconductor Manufacturing International Corporation announced they will extend their current foundry arrangement to expand ...
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February 18, 2011 - Industry News
Semi Industry Praises President's Long-Term Support for Increased Science Research Funding
The Semiconductor Industry Association (SIA), representing US leadership in semiconductor manufacturing and design, announced that it strongly ...
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December 2, 2010 - Industry News
New Wafer-Level Microlens Molding Process From EV Group
EV Group (EVG) announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution wafer ...
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November 30, 2010 - Industry News
German Scientists Break Record, Draw High-Tech Investments
Dresden-based Heliatek recently broke the efficiency record for organic photovoltaic cells, posting a new efficiency level of 8.3%. Organic LEDs ...
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September 29, 2010 - Industry News
Danaher to Acquire Keithley Instruments
Danaher Corporation and Keithley Instruments, Inc. announced that they have entered into a definitive merger agreement pursuant to which Danaher ...
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September 1, 2010 - Industry News
TI completes acquisition of Spansion Japan wafer fabrication facility
Texas Instruments Incorporated has completed its acquisition of two wafer fabs and equipment in Aizu-Wakamatsu, Japan, cost-effectively increasing ...
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August 6, 2010 - Industry News
SMIC 65-nm Technology Successfully Moves to Volume Production
Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI and HKSE: 981), a world leading semiconductor foundry and the most ...
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July 9, 2010 - Industry News
EV Group and IME Partner to Advance TSV Process Development
EV Group (EVG) and the Institute of of Microelectronics (IME) announced that they have entered into a two-year cooperation agreement to advance ....
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June 9, 2010 - Industry News
Camtek Joins Industry Alliance to Develop Advanced 3D Semi Packaging
Camtek Ltd. announced it has entered into a joint development agreement (JDA) with IBM Corporation and will be joining a new industry alliance ...
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May 26, 2010 - Technology News
Integra Announces Development of GaN Technology
Integra Technologies, Inc. (ITI) announced the development of High Voltage Gallium Nitride on Silicon technology. Leveraging a world class ...
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May 25, 2010 - Technology News
National Semiconductor Introduces Industry's Fastest 12-bit ADC
National Semiconductor Corp. introduced the Industry's fastest 12-bit analog-to-digital converter (ADC). At 3.6 Giga-samples per second (GSPS) ...
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May 13, 2010 - Industry News
Camtek Announces First Quarter 2010 Results
Camtek Ltd. announced its financial results for the quarter ended March 31, 2010. Results for the three months ended March 31, 2010 on a non-GAAP ...
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May 12, 2010 - Industry News
SMIC Reports Results for the Three Months Ended March 31, 2010
Set out below is a copy of the full text of the press release by the Company on May 11, 2010, in relation to its results for the three months ...
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March 9, 2010 - Technology News
Novellus Develops Advanced Copper Seed Technology for TSV Packaging
Novellus Systems announced that it has developed a new, advanced copper barrier-seed physical vapor deposition (PVD) process for the emerging ...
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January 8, 2010 - Industry News
Advanced Semiconductor Engineering Announces Monthly Revenues
Advanced Semiconductor Engineering, Inc. announces its unaudited consolidated net revenues for December and 4th quarter of 2009 ...
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November 30, 2009 - Technology News
STMicroelectronics Set To Spur the Growth of MEMS Microphone Market
High-performance MEMS microphones enable improved sound quality and additional features at reduced size and cost. STMicroelectronics ...
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October 28, 2009 - Technology News
SMIC Announces Successful Qualification of a MEMS Chip for Microstaq
New Ventilum chip is latest advancement in super-efficient fluid control technology. Semiconductor Manufacturing International Corporation ...
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September 29, 2009 - Technology News
National Semiconductor Introduces Industry's First 65 MHz, 24-Bit Color SerDes Family for Infotainment Displays
National Semiconductor Corp. introduced the industry's first serializer and deserializer (SerDes) chipsets capable of driving high-resolution, 24-bit ...
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August 13, 2009 - Industry News
Tower Semiconductor Reports Second Quarter 2009 Financial Results
Tower Semiconductor Ltd. announced financial results for the second quarter ending June 30. Second quarter 2009 revenue was towards the upper-end of ...
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August 6, 2009 - Technology News
BeSang Demonstrates Multi-Layer 3D IC Technology
BeSang Inc., a fabless semiconductor company based in Beaverton, OR, has successfully developed a multi-layer stacked three-dimensional ...
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July 14, 2009 - Technology News
Soitec Leverages Core Technologies to Address Wafer-Level 3D Integration
Company's Extensive and Flexible Platform is Ideally Suited for Maximizing 3D Integration's Advantages in IC Performance, Power, Size ...
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