We search for industry news, so you don't need to.   Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map New Fully Automatic Heavy Wire Bonder Increases Productivity by 30% Process aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more… Hesse & Knipps, Inc. Jetting Systems Technology New white paper Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more… Nordson ASYMTEK   Industry and Technology News Index July 2, 2009  -  Click the title to read the full article. Rambus claims 'world's fastest memory' Rambus, a technology licensing companies specialising in high-speed memory architectures, has demonstrated its XDR memory system running at data ... Electronics News We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Electronics News March 22, 2010 - Industry News US Chip Industry Works to Level Global Playing Field The chairman of the Semiconductor Industry Association, John Daane, addressed Washington in a "State of the Industry" presentation to ... Electronics News February 17, 2010 - Industry News Asia-Pacific chip sales leading indicator up Economic research firm e-forecasting.com announced that the Asia-Pacific semiconductor chip sales leading indicator went up in December by 3.4 ... Electronics News November 18, 2009 - Industry News Worldwide semiconductor revenue to end the year on a high Worldwide semiconductor revenue is on pace to total $226 billion in 2009, an 11.4 percent decline from 2008 revenue of $255 billion, according to ... Electronics News November 16, 2009 - Technology News 3-axis MEMS gyroscope STMicroelectronics announced a single-package analogue gyroscope that measures angular rates along three orthogonal axes. The company's three-axis ... Electronics News November 12, 2009 - Technology News Samsung pushes foundry logic process development Samsung Electronics announced that its new Semiconductor Research & Development Centre has started advanced logic process development, ... Electronics News November 5, 2009 - Technology News PLX Technology completes design on 40nm process PLX Technology announced it completed a design on 40nm process technology at Taiwan Semiconductor Corp. The company is taking advantage of the 40nm ... Electronics News July 14, 2009 - Technology News Firms partner to develop ultra-fine pitch 3D interconnects Optomec and Vertical Circuits Incorporated (VCI) say they are collaborating in the development of a high density 3-dimensional ... Electronics News July 2, 2009 - Industry News Rambus claims 'world's fastest memory' Rambus, a technology licensing companies specialising in high-speed memory architectures, has demonstrated its XDR memory system running at data ... Electronics News May 26, 2009 - Technology News Chips 'reduce electricity consumption' Adoption of new technologies for the production, distribution and use of electricity could lower total US energy consumption by 2030, according ... Electronics News May 11, 2009 - Technology News Cypress claims first SRAM at 65 nm Cypress Semiconductor (distributed in Australia by Future Electronics) says it is sampling the industry’s first Quad Data Rate (QDR) and Double ... Electronics News May 5, 2009 - Industry News Technology collaboration aims for 28 nm node An alliance of IBM, Chartered Semiconductor, Infineon Technologies, Samsung and STMicroelectronics says it has defined and is jointly developing a ... Electronics News November 25, 2008 - Industry News Freescale and Samsung collaborate on LED displays Freescale Semiconductor and Samsung Electronics say they are to collaborate to address the burgeoning market for energy-saving and ... Electronics News October 30, 2008 - Technology News STMicroelectronics MEMS accelerometer The new device is qualified to AEC-Q100 for automotive applications, fully leveraging its proven 200mm-wafer MEMS fabrication facility to ... Electronics News March 2, 2007 - Technology News Two lasers boost euv power Laser developer Powerlase and research partner University of Central Florida have made what they believe to be a major development in extreme ultraviolet lithography (euv). For the first ... News Electronics June 22, 2006 - Industry News China Gets Semi IP Trading Center Collaborative plans for the construction of a new semiconductor intellectual property (SIP) trading center in greater China have been announced ... Electronics News To find more articles from Electronics News, use the search form below. PacTech's Low-Cost Wafer Bumping Services Quick-turn prototyping and mass-production Low-cost electroless Ni/Au UBM, solder stencil or ball attach wafer bumping up to 300mm — Lead-free soldering for flip-chip, WLCSP, Ni/Pd/Au top metal for Au and Cu wire bonding. 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