February 6, 2012 - Industry News
Chip demand picking up, say Taiwan IC designers
Taiwan-based fabless IC firms have recently landed an influx of short lead-time orders from clients that had been keeping inventory lean due ...
Digitimes
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January 4, 2012 - Industry News
Elpida, Toshiba reportedly in integration talks
Rumors spread recently that memory chipmakers Elpida Memory and Toshiba are in talks to integrate business operations, with the Japan government ...
Digitimes
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December 15, 2011 - Industry News
Global DRAM oversupply expected to fall to 13% in 1H12
The global DRAM oversupply of DRAM is expected to drop from 17% currently to 13% in the first half of 2012 due to reduced in production by the major ...
Digitimes
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December 9, 2011 - Industry News
ASE revenues down 5% in November
Advanced Semiconductor Engineering (ASE) has reported its core ATM (assembly test and material) division generated revenues of NT$10.7 ...
Digitimes
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December 1, 2011 - Industry News
TSMC to report lower revenues
Despite reports of brisk retail sales in the US during the Thanksgiving weekend, Taiwan's fabless IC companies and contract manufacturers do not ...
Digitimes
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November 30, 2011 - Industry News
Copper pillar bump penetration of FC packaging to rise
Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% ...
Digitimes
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November 29, 2011 - Industry News
Copper pillar bump penetration of FC packaging to rise
Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in ...
Digitimes
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November 16, 2011 - Industry News
Chip equipment makers conservative about 4Q11 business
Taiwan-based semiconductor equipment suppliers generally hold a conservative business outlook for the fourth quarter of 2011, citing seasonal effects as ...
Digitimes
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November 15, 2011 - Industry News
STATS ChipPAC to Open Wafer-level Packaging Plant in Taiwan
STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern ...
Digitimes
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November 2, 2011 - Industry News
IC orders for smartphones, tablets growing
Qualcomm, MediaTek, Nvidia and Spreadtrum Communications have all increased their wafer starts at Taiwan Semiconductor Manufacturing Company ...
Digitimes
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October 31, 2011 - Industry News
ASE to see lower 4Q11 shipments, flat margin
IC packager Advanced Semiconductor Engineering (ASE) has forecast shipments for the fourth quarter of 2011 will decrease 3-4% sequentially ...
Digitimes
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October 25, 2011 - Industry News
Integration a must for packaging and testing industry
If an industry like the semiconductor packaging and testing sector has more than 10 companies involved, only 3-4 of them can actually generate profits ...
Digitimes
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October 24, 2011 - Industry News
Integration a Must for Packaging and Testing Industry
If an industry like the semiconductor packaging and testing sector has more than 10 companies involved, only 3-4 of them can actually generate profits ...
Digitimes
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October 21, 2011 - Industry News
Packaging and testing firms see flat growth in 4Q11
The global semiconductor packaging and testing industry will only see flat sequential growth in the fourth quarter of 2011, as it continues ...
Digitimes
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October 17, 2011 - Industry News
Flooding in Thailand may cause global short supply of HDDs in December
Suppliers of hard disk drives (HDDs) have lowered inventory levels from 20-25 days to 10-15 days due to weak demand, according to industry sources ...
Digitimes
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October 7, 2011 - Industry News
ASE, Amkor expanding to compete for IDM orders
In view of increased outsourcing demand by IDM companies, IC packagers Advanced Semiconductor Engineering (ASE) and Amkor Technology has been ...
Digitimes
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October 6, 2011 - Industry News
STATS ChipPAC intros new fan-out WLP offering
STATS ChipPAC has announced that its next-generation fan-out type wafer level packaging (FO-WLP) offers the technology to support a broad range ...
Digitimes
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September 27, 2011 - Industry News
Taiwan-based IC design houses upbeat for 4Q11 and 2012 outlook
Taiwan-based IC design houses are positive about the outlook for the fourth quarter of 2011 as well as for 2012 due to increasing popularity of ...
Digitimes
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September 26, 2011 - Industry News
ASE looks to expand
IC packaging and testing service provider Advanced Semiconductor Engineering (ASE) expects its consolidated revenues to top US$30 billion ...
Digitimes
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September 26, 2011 - Industry News
Taiwan-based IC design houses upbeat for 4Q11 and 2012 outlook
Taiwan-based IC design houses are positive about the outlook for the fourth quarter of 2011 as well as for 2012 due to increasing popularity ...
Digitimes
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September 23, 2011 - Industry News
ASE looks to expand
IC packaging and testing service provider Advanced Semiconductor Engineering (ASE) is eyeing a 30% global market share and expects its ...
Digitimes
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September 22, 2011 - Industry News
Apple reportedly increases memory purchases from Japan
Apple has increased its purchases of DRAM and NAND flash from Japan, according to industry sources, adding that Toshiba and Elpida Memory are ...
Digitimes
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September 21, 2011 - Industry News
Japan fab-tool book-to-bill continues slide in August
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.76 in August 2011, compared to 0.84 in July and 0.96 in ...
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September 20, 2011 - Industry News
TSMC to cut 2012 capex 19%
Taiwan Semiconductor Manufacturing Company is expected to drop its capital spending 19%. TSMC's capex for 2012 will be mainly focused on expanding ...
Digitimes
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September 16, 2011 - Industry News
Apple said to have contracted with TSMC
Apple has recently signed a foundry partnership agreement with Taiwan Semiconductor Manufacturing Company (TSMC), industry sources have ...
Digitimes
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