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F&K Delvotec introduces World's ONLY Rotary Head Ball Bonder
F&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more
F&K Delvotec
Exclusive
Green Compliance is Profitable
Today we find ourselves in the era when consumer electronics have become the main driver in an industry that touches everyone on the planet in some way. REACH and ROHS are being implemented across the consumer electronics spectrum and are now affecting every aspect of the Electronics Industry from IC's ...
Steve DeCollibus, Managing Editor
Semiconductor Packaging News
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China Software Filter Delay Is Boon to PC Makers
China's decision to delay implementation of a controversial Web-filtering scheme is good news for PC makers, which faced big challenges in ...
The Wall Street Journal
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Chipmakers' Claims Of Long Battery Life Pass The Sniff Test?
Often, the cooler an electronic gadget runs, the hotter it sells. Devices that are coolest use less energy. The less energy they use in ...
Investor's Business Daily
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Canon to cut 700 jobs at chip gear operations
Japan's Canon Inc said it would cut about 700 jobs at its chip equipment operations, underscoring a bleak outlook for the sector as the global ...
Reuters
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MEMS tool market on the rebound
MEMS device demand has held steadier than the overall semiconductor market, but the market for equipment to make MEMS devices has struggled like ...
Small Times
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Sony reveals $2,000 netbook
Leave it to Sony to decide that the main thing missing from the actually quite healthy netbook market is a four-digit price tag. ...
Examiner
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Global chip sales seen ticking up in May
Global chip sales in May are believed to have increased by a seasonally adjusted 2 percent on the previous month, according to analysts at ...
EETimes
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SMIC readies 45-nm process
Don't look now, but Chinese foundry provider Semiconductor Manufacturing International Corp. (SMIC) could be gaining on its rivals. ...
EETimes
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Singapore launches 3-D packaging consortium
Singapore's Institute of Microelectronics (IME), a research group, has launched a consortium in 3-D packaging. The so-called 10th Electronic ...
EETimes
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Sole Power Tile Makes Adding Solar Easy
Ask around to homeowners who have looked into capturing solar energy on their roof, and they will likely tell you there are several problems ...
Fast Company
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Sematech Seeks EUV Mask Tool Funding
Few commercial suppliers are stepping up to develop the EUV mask inspection tools that will be needed for 22 nm EUV patterning, said Bryan Rice, ...
Semiconductor International
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Micron puts 34-nm NAND chips in mass production
Micron Technology Inc. announced mass production of NAND flash memory chips using 34-nanometer (nm) process technology. Micron also said Lexar ...
EETimes
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Amkor's founder to step down as CEO
Amkor Technology Inc. President and Chief Operating Officer Ken Joyce will assume the role of CEO of the company effective Oct. 1, Amkor said ...
EETimes
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Broadcom ups bid for Emulex to $912M, drops lawsuit
Broadcom is now offering $11 per share for fibre channel storage networking company Emulex, but says it will move on, considering other ...
EDN
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Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified ...
Digitimes
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Lithium ion battery demand down 15% in 1Q09, says TSR
According to a recent report from Japan-based Techno Systems Research (TSR), global lithium ion battery demand totalled 577.5 million cells ...
Digitimes
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Elpida Memory Will Get Aid, Loans From Japan, Taiwan
Elpida Memory Inc. said it will receive aid and loans from the Japanese government, its Taiwanese partner and financial institutions after falling ...
Bloomberg
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Productivity gains drive innovation
Everyone is more productive these days. This has been a consistent trend for at least the past decade, where productivity gains have been ...
VatorNews
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Virage Logic Sees Strong Adoption of Company's Broad 40nm IP Product Portfolio
Virage Logic Corporation announced that since being named TSMC's 40-namomenter (nm) early development partner in 2007, the company has seen ...
Business Wire
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Research and Markets: New Report: MEMS Accelerometer
Research and Markets has announced the addition of the "MEMS Accelerometer, Gyroscope & IMU Market 2008-2013" report to their offering ...
Business Wire
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Fit For A Queen
With a sensing element etched from a silicon wafer, it is sensitive enough to detect the Earth's rotation … and win the Queen’s approval. ...
Product Design & Development
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MEPTEC/SMTA Presents 2010 Medical Electronics Symposium
Join MEPTEC & SMTA on September 22-23, 2010, at Arizona State University for Successful Strategies for the Medical Electronics Sector: Steady Growth Keeps the Momentum Moving Forward. Learn more
MEPTEC
Integrated optical trap holds particles for on-chip analysis
A new type of optical particle trap can be used to manipulate bacteria, viruses and other particles on a chip as part of an integrated ...
UC Santa Cruz
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MEMS oscillators set frequencies
Discera's programmable DSC8002 MEMS oscillators can now be programmed easily anywhere, as the company unveils the Dragonfly portable ...
EETimes Asia
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Intel, Micron, Samsung start NAND scaling race
The NAND flash memory scaling race is off and running--again. The Intel-Micron duo, Samsung and Toshiba are racing each other for bragging ...
EETimes
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Micron Prepares Improved 34nm Flash for Better SSDs
New SSDs should be faster, more power efficient, and smaller thanks to die shrink. Die shrinks can be a wonderful thing. A die shrink to 40 nm is ...
DailyTech
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Touchscreens 101: Understanding touchscreen technology and design
Touchscreens (sometimes spelled as touch screen) are everywhere: they are embedded in phones, office equipment, speakers, digital photo frames, ...
Embedded
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Samsung breaks Netbook mold with Nvidia chip
Nvidia on Monday confirmed that Samsung will bring out a Netbook based on the graphics chipmaker's Ion chipset, another design that breaks the ...
CNET News
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Printed polymeric artificial muscles in Nature Materials
Researchers from Polymer Technology have fabricated plastic 'artificial muscles' that move under the influence of light. The artificial muscles ...
Insciences Organisation
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Green pressure sensors tap quartz MEMS
Pressure sensors got greener recently when Epson Toyocom (El Segundo, Calif.) announced a quartz microelectromechanical system (QMEMS) ...
EETimes
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Metallization Lines by ASYS
Over 8 GW installed Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Visit us at Solar Power International, Booth # 421 or call us today at +1 866 GO 4 ASYS
ASYS Group Americas Inc.
James Kim to Become Exec. Chairman, Ken Joyce Appointed CEO
Amkor Technology, Inc. announced a succession plan for senior management. Under the plan, James Kim, Founder, Chairman and Chief Executive ...
Amkor Technology, Inc.
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Torrey Hills Technologies, LLC Announces Appearance at Intersolar
Torrey Hills Technologies, LLC announced appearance at Intersolar North America Trade Show 2009, the most diverse international business-to ...
Torrey Hills Technologies, LLC
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Today's Sponsor
PacTech's Low-Cost Wafer Bumping Services Quick-turn prototyping and mass-production
Low-cost electroless Ni/Au UBM, solder stencil or ball attach wafer bumping up to 300mm Lead-free soldering for flip-chip, WLCSP, Ni/Pd/Au top metal for Au and Cu wire bonding. Learn more
PacTech
Exceeding Productivity Demands for Heavy Wire Bonding
New white paper focuses on the cycle time for wedge bonding. To achieve an increase in productivity, each element of the wire bonding equipment in relation to optimizing the wire bonding process must be questioned. Learn more
Hesse & Knipps, Inc.
Advances in Micro-electronics Inspection Provides High Resolution and High UPH,
MVP's Ultra 850G platform provides high resolution inspection for backend semiconductor and microelectronics processes. Using 2D/3D inspection techniques, the Ultra 850G provides metrology capabilities for wire bond, die, surface damage, underfill, BGA/Bump and other processes. Learn more
Machine Vision Products, Inc.
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