We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers July 1, 2009 ShinEtsu Photoresists, perfect for: 3D packaging, WLP, TSV and wafer bonding For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. Learn more… ShinEtsu Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Letters Submit Dynaloy Solutions for WLP Advanced Packaging Applications Dynaloy offers Dynastrip™ DL88 for improved safety and better cleaning in Wafer Level CSP applications. See Dynaloy's advanced solutions for Flip Chip Bumping, Cu Pillar, Micro Pillar, Fan-out, WLCSP, and other challenging packaging cleaning processes. Learn more… Dynaloy LLC Top Story   Sales of iPhone to Benefit Taiwanese IC Chip Industry Because Apple`s latest iPhone 3GS smartphone is unexpectedly popular with consumers, the firm`s related handset IC suppliers have recently ... Taiwan Economic News Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Exclusive   Green Compliance is Profitable Today we find ourselves in the era when consumer electronics have become the main driver in an industry that touches everyone on the planet in some way. REACH and ROHS are being implemented across the consumer electronics spectrum and are now affecting every aspect of the Electronics Industry from IC's ... Steve DeCollibus, Managing Editor Semiconductor Packaging News Industry News   China Software Filter Delay Is Boon to PC Makers China's decision to delay implementation of a controversial Web-filtering scheme is good news for PC makers, which faced big challenges in ... The Wall Street Journal Chipmakers' Claims Of Long Battery Life Pass The Sniff Test? Often, the cooler an electronic gadget runs, the hotter it sells. Devices that are coolest use less energy. The less energy they use in ... Investor's Business Daily Canon to cut 700 jobs at chip gear operations Japan's Canon Inc said it would cut about 700 jobs at its chip equipment operations, underscoring a bleak outlook for the sector as the global ... Reuters MEMS tool market on the rebound MEMS device demand has held steadier than the overall semiconductor market, but the market for equipment to make MEMS devices has struggled like ... Small Times Sony reveals $2,000 netbook Leave it to Sony to decide that the main thing missing from the actually quite healthy netbook market is a four-digit price tag. ... Examiner Global chip sales seen ticking up in May Global chip sales in May are believed to have increased by a seasonally adjusted 2 percent on the previous month, according to analysts at ... EETimes SMIC readies 45-nm process Don't look now, but Chinese foundry provider Semiconductor Manufacturing International Corp. (SMIC) could be gaining on its rivals. ... EETimes Singapore launches 3-D packaging consortium Singapore's Institute of Microelectronics (IME), a research group, has launched a consortium in 3-D packaging. The so-called 10th Electronic ... EETimes Sole Power Tile Makes Adding Solar Easy Ask around to homeowners who have looked into capturing solar energy on their roof, and they will likely tell you there are several problems ... Fast Company Sematech Seeks EUV Mask Tool Funding Few commercial suppliers are stepping up to develop the EUV mask inspection tools that will be needed for 22 nm EUV patterning, said Bryan Rice, ... Semiconductor International Micron puts 34-nm NAND chips in mass production Micron Technology Inc. announced mass production of NAND flash memory chips using 34-nanometer (nm) process technology. Micron also said Lexar ... EETimes Amkor's founder to step down as CEO Amkor Technology Inc. President and Chief Operating Officer Ken Joyce will assume the role of CEO of the company effective Oct. 1, Amkor said ... EETimes Broadcom ups bid for Emulex to $912M, drops lawsuit Broadcom is now offering $11 per share for fibre channel storage networking company Emulex, but says it will move on, considering other ... EDN Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified ... Digitimes Lithium ion battery demand down 15% in 1Q09, says TSR According to a recent report from Japan-based Techno Systems Research (TSR), global lithium ion battery demand totalled 577.5 million cells ... Digitimes Elpida Memory Will Get Aid, Loans From Japan, Taiwan Elpida Memory Inc. said it will receive aid and loans from the Japanese government, its Taiwanese partner and financial institutions after falling ... Bloomberg Productivity gains drive innovation Everyone is more productive these days. This has been a consistent trend for at least the past decade, where productivity gains have been ... VatorNews Virage Logic Sees Strong Adoption of Company's Broad 40nm IP Product Portfolio Virage Logic Corporation announced that since being named TSMC's 40-namomenter (nm) early development partner in 2007, the company has seen ... Business Wire Research and Markets: New Report: MEMS Accelerometer Research and Markets has announced the addition of the "MEMS Accelerometer, Gyroscope & IMU Market 2008-2013" report to their offering ... Business Wire Fit For A Queen With a sensing element etched from a silicon wafer, it is sensitive enough to detect the Earth's rotation … and win the Queen’s approval. ... Product Design & Development Can One Adhesive Do All That? Yes, with Versatile Master Bond One-part Epoxy Silver filled Supreme 10HTS is both cryogenically and high temperature serviceable (4°K-400°F). Low resistance and vacuum compatible, this one part epoxy requires oven curing at 250°–300°F. Learn more… Master Bond Technology News   Integrated optical trap holds particles for on-chip analysis A new type of optical particle trap can be used to manipulate bacteria, viruses and other particles on a chip as part of an integrated ... UC Santa Cruz MEMS oscillators set frequencies Discera's programmable DSC8002 MEMS oscillators can now be programmed easily anywhere, as the company unveils the Dragonfly portable ... EETimes Asia Intel, Micron, Samsung start NAND scaling race The NAND flash memory scaling race is off and running--again. The Intel-Micron duo, Samsung and Toshiba are racing each other for bragging ... EETimes Micron Prepares Improved 34nm Flash for Better SSDs New SSDs should be faster, more power efficient, and smaller thanks to die shrink. Die shrinks can be a wonderful thing. A die shrink to 40 nm is ... DailyTech Touchscreens 101: Understanding touchscreen technology and design Touchscreens (sometimes spelled as touch screen) are everywhere: they are embedded in phones, office equipment, speakers, digital photo frames, ... Embedded Samsung breaks Netbook mold with Nvidia chip Nvidia on Monday confirmed that Samsung will bring out a Netbook based on the graphics chipmaker's Ion chipset, another design that breaks the ... CNET News Printed polymeric artificial muscles in Nature Materials Researchers from Polymer Technology have fabricated plastic 'artificial muscles' that move under the influence of light. The artificial muscles ... Insciences Organisation Green pressure sensors tap quartz MEMS Pressure sensors got greener recently when Epson Toyocom (El Segundo, Calif.) announced a quartz microelectromechanical system (QMEMS) ... EETimes PacTech's SB2-Jet Laser Solder Jetting System Sequential high speed soldering using laser-reflow with high substrate design and solder ball size flexibility. Fluxless, contactless at low thermal stress—ideal for flip-chip, MEMS, 3D-packaging and CSP/BGA's re-balling. Learn more… PacTech Corporate News Submit James Kim to Become Exec. Chairman, Ken Joyce Appointed CEO Amkor Technology, Inc. announced a succession plan for senior management. Under the plan, James Kim, Founder, Chairman and Chief Executive ... Amkor Technology, Inc. Torrey Hills Technologies, LLC Announces Appearance at Intersolar Torrey Hills Technologies, LLC announced appearance at Intersolar North America Trade Show 2009, the most diverse international business-to ... Torrey Hills Technologies, LLC Today's Sponsor 3 µm Semiconductor Automated Optical Inspection The REVEAL MEMS Series Provides solutions for the Semiconductor industry with high reliability automated inspection capabilities at production speeds. This in-line inspection machine for MEMS packaging processes increases yield & reduces manufacturing costs. Learn more… Vi TECHNOLOGY F&K Delvotec receives two recognitions VLSI "highest rated wire bonder maker 2009" VLSI recognized F&K Delvotec with two major awards. Not only did F&K Delvotec make the VLSI's 10 Best List but they also stated "F&K Delvotec, the highest rated wire bonder maker." Learn more… F&K Delvotec Webcast: Silicon Interposers with TSVs and Thin-Film Capacitors The evolution of silicon interposers without Through Silicon Vias (TSVs) to interposers with TSVs. Webcast on March 17, will discuss mechanical benefits of attaching ICs to silicon and electrical benefits of passive and active elements including Implementation & reliability data. Learn more… ALLVIA, Inc. Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2009 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.