July 1, 2009
ShinEtsu Photoresists, perfect for: 3D packaging, WLP, TSV and wafer bonding
For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. Learn more
ShinEtsu
Improve Your Uptime High Precision Dispense Tips
The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology
Dynaloy Solutions for WLP Advanced Packaging Applications
Dynaloy offers Dynastrip DL88 for improved safety and better cleaning in Wafer Level CSP applications. See Dynaloy's advanced solutions for Flip Chip Bumping, Cu Pillar, Micro Pillar, Fan-out, WLCSP, and other challenging packaging cleaning processes. Learn more
Dynaloy LLC
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Solar wafer coating - White paper USI has developed Nozzle-less
Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more
Ultrasonic Systems, Inc.
Exclusive
Green Compliance is Profitable
Today we find ourselves in the era when consumer electronics have become the main driver in an industry that touches everyone on the planet in some way. REACH and ROHS are being implemented across the consumer electronics spectrum and are now affecting every aspect of the Electronics Industry from IC's ...
Steve DeCollibus, Managing Editor
Semiconductor Packaging News
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China Software Filter Delay Is Boon to PC Makers
China's decision to delay implementation of a controversial Web-filtering scheme is good news for PC makers, which faced big challenges in ...
The Wall Street Journal
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Chipmakers' Claims Of Long Battery Life Pass The Sniff Test?
Often, the cooler an electronic gadget runs, the hotter it sells. Devices that are coolest use less energy. The less energy they use in ...
Investor's Business Daily
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Canon to cut 700 jobs at chip gear operations
Japan's Canon Inc said it would cut about 700 jobs at its chip equipment operations, underscoring a bleak outlook for the sector as the global ...
Reuters
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MEMS tool market on the rebound
MEMS device demand has held steadier than the overall semiconductor market, but the market for equipment to make MEMS devices has struggled like ...
Small Times
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Sony reveals $2,000 netbook
Leave it to Sony to decide that the main thing missing from the actually quite healthy netbook market is a four-digit price tag. ...
Examiner
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Global chip sales seen ticking up in May
Global chip sales in May are believed to have increased by a seasonally adjusted 2 percent on the previous month, according to analysts at ...
EETimes
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SMIC readies 45-nm process
Don't look now, but Chinese foundry provider Semiconductor Manufacturing International Corp. (SMIC) could be gaining on its rivals. ...
EETimes
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Singapore launches 3-D packaging consortium
Singapore's Institute of Microelectronics (IME), a research group, has launched a consortium in 3-D packaging. The so-called 10th Electronic ...
EETimes
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Sole Power Tile Makes Adding Solar Easy
Ask around to homeowners who have looked into capturing solar energy on their roof, and they will likely tell you there are several problems ...
Fast Company
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Sematech Seeks EUV Mask Tool Funding
Few commercial suppliers are stepping up to develop the EUV mask inspection tools that will be needed for 22 nm EUV patterning, said Bryan Rice, ...
Semiconductor International
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Micron puts 34-nm NAND chips in mass production
Micron Technology Inc. announced mass production of NAND flash memory chips using 34-nanometer (nm) process technology. Micron also said Lexar ...
EETimes
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Amkor's founder to step down as CEO
Amkor Technology Inc. President and Chief Operating Officer Ken Joyce will assume the role of CEO of the company effective Oct. 1, Amkor said ...
EETimes
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Broadcom ups bid for Emulex to $912M, drops lawsuit
Broadcom is now offering $11 per share for fibre channel storage networking company Emulex, but says it will move on, considering other ...
EDN
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Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified ...
Digitimes
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Lithium ion battery demand down 15% in 1Q09, says TSR
According to a recent report from Japan-based Techno Systems Research (TSR), global lithium ion battery demand totalled 577.5 million cells ...
Digitimes
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Elpida Memory Will Get Aid, Loans From Japan, Taiwan
Elpida Memory Inc. said it will receive aid and loans from the Japanese government, its Taiwanese partner and financial institutions after falling ...
Bloomberg
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Productivity gains drive innovation
Everyone is more productive these days. This has been a consistent trend for at least the past decade, where productivity gains have been ...
VatorNews
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Virage Logic Sees Strong Adoption of Company's Broad 40nm IP Product Portfolio
Virage Logic Corporation announced that since being named TSMC's 40-namomenter (nm) early development partner in 2007, the company has seen ...
Business Wire
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Research and Markets: New Report: MEMS Accelerometer
Research and Markets has announced the addition of the "MEMS Accelerometer, Gyroscope & IMU Market 2008-2013" report to their offering ...
Business Wire
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Fit For A Queen
With a sensing element etched from a silicon wafer, it is sensitive enough to detect the Earth's rotation … and win the Queen’s approval. ...
Product Design & Development
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Can One Adhesive Do All That? Yes, with Versatile Master Bond One-part Epoxy
Silver filled Supreme 10HTS is both cryogenically and high temperature serviceable (4°K-400°F). Low resistance and vacuum compatible, this one part epoxy requires oven curing at 250°300°F. Learn more
Master Bond
Integrated optical trap holds particles for on-chip analysis
A new type of optical particle trap can be used to manipulate bacteria, viruses and other particles on a chip as part of an integrated ...
UC Santa Cruz
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MEMS oscillators set frequencies
Discera's programmable DSC8002 MEMS oscillators can now be programmed easily anywhere, as the company unveils the Dragonfly portable ...
EETimes Asia
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Intel, Micron, Samsung start NAND scaling race
The NAND flash memory scaling race is off and running--again. The Intel-Micron duo, Samsung and Toshiba are racing each other for bragging ...
EETimes
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Micron Prepares Improved 34nm Flash for Better SSDs
New SSDs should be faster, more power efficient, and smaller thanks to die shrink. Die shrinks can be a wonderful thing. A die shrink to 40 nm is ...
DailyTech
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Touchscreens 101: Understanding touchscreen technology and design
Touchscreens (sometimes spelled as touch screen) are everywhere: they are embedded in phones, office equipment, speakers, digital photo frames, ...
Embedded
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Samsung breaks Netbook mold with Nvidia chip
Nvidia on Monday confirmed that Samsung will bring out a Netbook based on the graphics chipmaker's Ion chipset, another design that breaks the ...
CNET News
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Printed polymeric artificial muscles in Nature Materials
Researchers from Polymer Technology have fabricated plastic 'artificial muscles' that move under the influence of light. The artificial muscles ...
Insciences Organisation
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Green pressure sensors tap quartz MEMS
Pressure sensors got greener recently when Epson Toyocom (El Segundo, Calif.) announced a quartz microelectromechanical system (QMEMS) ...
EETimes
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PacTech's SB2-Jet Laser Solder Jetting System
Sequential high speed soldering using laser-reflow with high substrate design and solder ball size flexibility. Fluxless, contactless at low thermal stressideal for flip-chip, MEMS, 3D-packaging and CSP/BGA's re-balling. Learn more
PacTech
James Kim to Become Exec. Chairman, Ken Joyce Appointed CEO
Amkor Technology, Inc. announced a succession plan for senior management. Under the plan, James Kim, Founder, Chairman and Chief Executive ...
Amkor Technology, Inc.
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Torrey Hills Technologies, LLC Announces Appearance at Intersolar
Torrey Hills Technologies, LLC announced appearance at Intersolar North America Trade Show 2009, the most diverse international business-to ...
Torrey Hills Technologies, LLC
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