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  Solar wafer coating - White paper
USI has developed Nozzle-less
Solar wafer coatingUltrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more…
Ultrasonic Systems, Inc.
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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




Online Auction of Qimonda Portugal Back-End Equipment
PCD TechnologyA large selection of Wafer Testers, Dicers, Die & Wire Bonders, Burn-in Ovens and more will be sold by Online Auction closing 04 August 2010 from Europe's largest Memory Chips Assembly & Test facility. Bid now…
GoIndustry DoveBid
  Industry and Technology News Index
July 1, 2009  -  Click the title to read the full article.

Sales of iPhone to Benefit Taiwanese IC Chip Industry
Because Apple`s latest iPhone 3GS smartphone is unexpectedly popular with consumers, the firm`s related handset IC suppliers have recently ...
Taiwan Economic News
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More from Taiwan Economic News
July 28, 2010 - Industry News
Taiwan's LED Industry to See Production Value Surge 43%
With the growing popularity of LED-backlit LCD TVs fueling sales growth, the production value of Taiwan`s LED industry is estimated to sharply ...
Taiwan Economic News
July 26, 2010 - Industry News
Pre-Xmas Orders Drive Q3 Shipment of Taiwan's 4 NB Contractors
Due to pre-Xmas orders placed early, Taiwan's four large contract manufacturers of NB PCs, namely, Quanta Computer Inc., Compal Electronics ...
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July 26, 2010 - Top Story News
Semi Book to Bill strong in June
Based on a three-month average, North American manufacturers of semiconductor equipment scored US$1.68 billion in orders and a book-to-bill ...
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July 20, 2010 - Industry News
Analog IC Design Houses Accept Foundry Price Hikes
Fearing contracts from integrated device manufacturers will crowd out their contracts from silicon foundry suppliers in the brisk second-half ...
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July 19, 2010 - Industry News
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Taiwan Semiconductor Manufacturing Co. (TSMC) Chairman and Chief Executive Morris Chang will personally break ground tomorrow for the ...
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July 16, 2010 - Industry News
Taiwan's Notebook PC Shipments Will Top 100 M. in Second Half
Global shipments of notebook PCs (including traditional notebook PCs, netbooks, and slate PCs) declined 11.2% quarter-on-quarter (QoQ) in the ...
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July 16, 2010 - Industry News
TSMC to Start Construction of Mega Fab
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July 13, 2010 - Industry News
TSMC Reports Shining Monthly and Quarterly Sales
Taiwan Semiconductor Manufacturing Co, (TSMC) saw its consolidated net sales for June hit a new high and its consolidated net sales for the ...
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July 9, 2010 - Industry News
ASE Sees Revenues Set New Highs
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Taiwan Economic News
July 7, 2010 - Industry News
VISC Ends Memory Foundry to Focus on Logic IC Contracts
Impressed by the excessive demand in the logic-chip market, Vanguard International Semiconductor Corp. (VISC) will be completely dedicated to ...
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July 2, 2010 - Industry News
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Taiwan Economic News
July 1, 2010 - Industry News
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With emergence of LED-backlit LCD TVs and lightings spurring more need for LED chips worldwide, Taiwan`s top three LED chip makers, namely ...
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June 30, 2010 - Industry News
UMC, Elpida, Powertech Team Up on 3D IC
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Taiwan Economic News
June 30, 2010 - Industry News
TSMC Approved to Hold Stakes in SMIC
Investment Commission of the Ministry of Economic Affairs (MOEA) recently approved an application filed by Taiwan Semiconductor Manufacturing Co. ...
Taiwan Economic News
June 29, 2010 - Industry News
Taiwan's LED Chipmakers Actively Expanding Output
Facing severe LED supply shortages, Taiwan's major LED chipmakers are moving to carry out capital increment plans to finance output expansion ...
Taiwan Economic News
June 28, 2010 - Industry News
TSMC's 2010 Capital Expense May Exceed Intel's
Industry executives estimate Taiwan Semiconductor Manufacturing Co. (TSMC) will spend more capital on expansion than Intel does this year ...
Taiwan Economic News
June 24, 2010 - Top Story News
Chip Assemblers Launch Desperate Expansions
Flooding orders are forcing Taiwan's top-six chip assemblers to develop aggressive expansion plans which are to cost an estimated US$1.87 ...
Taiwan Economic News
June 23, 2010 - Industry News
Taiwanese DRAM Makers Strive to Keep Up in Global Race
Driven by strong global demand, Taiwanese DRAM (dynamic random access memory) manufacturers are now enjoying a vigorous business upturn ...
Taiwan Economic News
June 22, 2010 - Industry News
Copper Process Contracts Swarming Into ASE
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Taiwan Economic News
June 21, 2010 - Top Story News
Chip Assemblers Scramble to Expand Capacity
ASE reported at a conference in early May that his company was busy boosting capacity to cope with a deluge of orders that stretched his ...
Taiwan Economic News
June 18, 2010 - Top Story News
TSMC Raises Forecast of Semi Market Growth
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Taiwan Economic News
June 17, 2010 - Industry News
TSMC Said to Win AMD CPU Contracts
Advanced Micro Devices (AMD) is likely to farm out production of its Ontario microprocessors to Taiwan Semiconductor Manufacturing Co. (TSMC) ...
Taiwan Economic News
June 15, 2010 - Industry News
Elpida to Tap Mainland China Market With Taiwans DRAM Chipmakers
Elpida Memory Inc. will team up with a Taiwan's DRAM chipmaker to tap mainland China market by opening a factory there in 2012 at the earliest ...
Taiwan Economic News
June 14, 2010 - Industry News
Elpida to Tap Mainland China Market With Taiwan's DRAM Chipmakers
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Taiwan Economic News
June 10, 2010 - Industry News
UMC's May Revenue Hits 30-month High of US$315M.
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Taiwan Economic News
To find more articles from Taiwan Economic News, use the search form below.


Advances in Micro-electronics Inspection
Provides High Resolution and High UPH,
Machine Vision ProductsMVP's Ultra 850G platform provides high resolution inspection for backend semiconductor and microelectronics processes. Using 2D/3D inspection techniques, the Ultra 850G provides metrology capabilities for wire bond, die, surface damage, underfill, BGA/Bump and other processes. Learn more…
Machine Vision Products, Inc.




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