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  White paper on die attach
Going Beyond Bulk Properties:
Full Wafer Die Attach White PaperEver wondered what's really going on with Die Attach thermal performance? Henkel unlocks the mystery…
Henkel Corporation
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Dynaloy Solutions for WLP
Advanced Packaging Applications
Dynaloy Solutions for WLPDynaloy offers Dynastrip™ DL88 for improved safety and better cleaning in Wafer Level CSP applications. See Dynaloy's advanced solutions for Flip Chip Bumping, Cu Pillar, Micro Pillar, Fan-out, WLCSP, and other challenging packaging cleaning processes. Learn more…
Dynaloy LLC




F&K Delvotec receives two recognitions
VLSI "highest rated wire bonder maker 2009"
Two AwardsVLSI recognized F&K Delvotec with two major awards. Not only did F&K Delvotec make the VLSI's 10 Best List but they also stated "F&K Delvotec, the highest rated wire bonder maker." Learn more…
F&K Delvotec
  Corporate News Index
July 2, 2009

DEK Solar adds another bright spark to its global Alternative Energies team

DEK Solar continues its commitment to illuminating the solar energy sector following the announcement that Robin Bancroft has joined its team. Newly appointed as Alternative Energies Business Development Manager for Western Europe, Robin’s extensive experience will reinforce DEK’s proven photovoltaic expertise as it meets the fast-growing demand for its services in this region.

Robin joins DEK on the back of a highly successful career to date selling capital equipment to the electronics industry, where he most recently worked as the European Agent for Baccini’s solar and thick film products. As such, DEK Solar’s new recruit brings considerable knowledge and experience to the post, an impressive skills set that will benefit the solar specialist’s customers in Western Europe and beyond.

Commenting on the new appointment, DEK’s Alternative Energy Business Manager, Darren Brown, explains: “I’m delighted to welcome Robin to the team and am confident that his experience in the solar energy sector will prove invaluable at DEK. With the advance of progressive process technologies such as print-on-print for example, customers around the world are realising the importance of printing with both accuracy and repeatability. Here at DEK, our PV1200 and PV3000 solar metallization solutions are the enabling platforms manufacturers need to achieve this – which is why we’re seeing unprecedented demand for our expertise right now. Robin’s appointment will help us continue to deliver the true technology leadership our customers expect and deserve.”

DEK’s solar metallization lines feature impressive credentials including six-sigma process rating, 12.5 micron resolution and advanced handling capabilities. Currently garnering attention industry-wide, the newly introduced high-accuracy, high throughput PV3000 line deploys multiple print heads in parallel to achieve peak run rates of 3600 wafers per hour. Both metallization lines leverage DEK’s 40 years of experience developing mass imaging platform products. Combined with proven technical advantages, the DEK Solar lines are also backed by a worldwide network of support resources, spares hubs, applications expertise and field service technicians. DEK Solar is also the only screen printing solutions provider with in-house screens capabilities, developing the precision technologies critical to the metallization process in a state-of-the-art Class 10,000 clean room manufacturing facility.

Contact:
DEK Solar

Karen Moore-Watts
http://www.deksolar.com/

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August 31, 2009
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DEK Solar adds another bright spark to its global Alternative Energies team
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Thermally Conductive Underfill Epoxy
Features 5–10 Minute Cure
Ultra-fast UV Curing Glob TopEP3RR-1 thermally conductive epoxy has excellent toughness. A one part epoxy, requiring oven curing at 250°–300°F, it is used in electronic packaging. Excellent flow, temperature range to 400°F. For more information…
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