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  Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




NEW Hesse & Knipps BONDJET BJ915L
for your leadframe applications
Bond Jet BJ920Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more…
Hesse & Knipps
  Corporate News Index
July 1, 2009  -  Click the title to read the full article.

James Kim to Become Exec. Chairman, Ken Joyce Appointed CEO
Amkor Technology, Inc. announced a succession plan for senior management. Under the plan, James Kim, Founder, Chairman and Chief Executive ...
Amkor Technology, Inc.

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More from Amkor Technology, Inc.
February 23, 2010
ITC Remands Investigation to ALJ in Amkor Patent Case against Carsem
Amkor Technology, Inc. announced that the International Trade Commission has reversed a finding by the Administrative Law Judge on the issue of ...
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February 12, 2010
Amkor Corrects EPS Guidance for the First Quarter of 2010
Amkor Technology, Inc. reported its financial results for the quarter and year ended December 31, 2009. Fourth quarter net sales of $668 million ...
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December 23, 2009
Amkor Raises Business Outlook for Fourth Quarter 2009
Amkor Technology, Inc. updated its outlook for certain financial information for the fourth quarter ended December 31, 2009. "Due to ...
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November 3, 2009
ITC Reaffirms Ruling that Carsem Infringes Amkor MLF Patent
Amkor Technology, Inc. announced that the Administrative Law Judge in Amkor's patent infringement case against Carsem in the International ...
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September 18, 2009
Nakaya, Amkor, Toshiba Provide Update on System LSI Joint Venture
Nakaya Microdevices Corporation, Amkor Technology, Inc. and Toshiba Corporation announced that they are continuing their negotiations of ...
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September 3, 2009
Amkor to Present at Citi Technology Conference
Amkor Technology announced that Joanne Solomon, CFO, and Jim Fusaro, EVP for assembly and test business, will participate in the Citi Investment ...
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August 11, 2009
Amkor Commences Arbitration Proceeding Against Tessera
Amkor Technology announced that it has filed a request for arbitration in the International Court of Arbitration of the International Chamber of ...
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July 30, 2009
Amkor Reports Second Quarter 2009 Results
Amkor Technology, Inc. reported its financial results for the quarter ended June 30, 2009. Second quarter net sales were up 30% sequentially ...
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July 27, 2009
Amkor Appoints Executives
Amkor Technology, Inc. announced that Jim Fusaro has been appointed as Executive Vice President to lead an integrated Assembly and Test Business ...
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July 1, 2009
James Kim to Become Exec. Chairman, Ken Joyce Appointed CEO
Amkor Technology, Inc. announced a succession plan for senior management. Under the plan, James Kim, Founder, Chairman and Chief Executive ...
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March 26, 2009
Amkor Provides Update on Certain 1st Qtr 2009 Financial Information
Amkor Technology, Inc. updated certain financial information regarding the first quarter ending March 31, 2009. Amkor reported that first...
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March 13, 2009
Amkor Names Stephen G. Newberry to Board of Directors
Amkor Technology, Inc. announced that Stephen G. Newberry has been appointed as a new member of the Company’s Board of Directors. With ...
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March 6, 2009
Amkor to Introduce Next Generation Package on Package Technology at IMAPS
Amkor Technology, Inc. announced it will introduce its highly anticipated next generation package on package (PoP) platform at the IMAPS Device ...
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February 27, 2009
Amkor to Present at Morgan Stanley Technology Conference
Amkor Technology, Inc. announced that Joanne Solomon, chief financial officer, and Jim Fusaro, corporate vice president, wirebond products, ...
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January 16, 2009
Amkor Announces Final Award in Tessera Arbitration
Amkor Technology, Inc. announced that the Arbitration Panel from the International Chamber of Commerce has issued the final award in the ...
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December 12, 2008
Amkor Announces Agreement to Settle Class Action Securities Litigation
Amkor Technology, Inc. announced that it has entered into a memorandum of understanding with plaintiffs to settle the securities class action ...
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November 11, 2008
Amkor Announces FusionQuad(R) Technology Licensed to ASAT
Amkor Technology, Inc. announced ASAT Holdings Limited has entered into an agreement to license Amkor’s FusionQuad® package technology. This ...
Amkor Technology, Inc.
July 8, 2008
Amkor Announces New Flip Chip Packaging Technology at SEMICON West
Amkor Technology, Inc.announced the introduction of a new flip chip packaging technology to be featured at SEMICON West2008 July 15 - 17...
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May 15, 2008
Amkor to Present at JP Morgan Technology Conference
Amkor Technology, Inc. announced that Joanne Solomon and Jim Fusaro will participate in the JP Morgan 36th Annual Technology Conference in ...
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May 6, 2008
Ken Joyce Named President of Amkor Technology
Amkor Technology, Inc. announced that Ken Joyce has been appointed President of the company. Joyce, 61, will also continue as Chief ...
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March 4, 2008
Amkor Technology Introduces FusionQuad(TM)
Amkor Technology, Inc. announced the introduction of FusionQuad™, a novel package technology designed for applications that demand ...
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July 18, 2007
AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging
Amkor Technology, Inc. and IMEC announced that they have entered into a 2-year collaboration agreement to develop cost-effective, 3D ...
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Case Study & Application Note
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