We search for industry news, so you don't need to.   New Photovoltaic Coating System Precision coating of solar wafers To apply a thin, uniform layer of phosphoric acid or phosphoric oxide based dopants and other proprietary coatings for the production of solar cells, USI has Technology for every application. Learn more… Ultrasonic Systems, Inc. Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map Online Auction of Qimonda Portugal Back-End Equipment A large selection of Wafer Testers, Dicers, Die & Wire Bonders, Burn-in Ovens and more will be sold by Online Auction closing 04 August 2010 from Europe's largest Memory Chips Assembly & Test facility. Bid now… GoIndustry DoveBid Advances in Micro-electronics Inspection Provides High Resolution and High UPH, MVP's Ultra 850G platform provides high resolution inspection for backend semiconductor and microelectronics processes. Using 2D/3D inspection techniques, the Ultra 850G provides metrology capabilities for wire bond, die, surface damage, underfill, BGA/Bump and other processes. Learn more… Machine Vision Products, Inc.   Industry and Technology News Index July 1, 2009  -  Click the title to read the full article. Integrated optical trap holds particles for on-chip analysis A new type of optical particle trap can be used to manipulate bacteria, viruses and other particles on a chip as part of an integrated ... UC Santa Cruz We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from UC Santa Cruz July 1, 2009 - Technology News Integrated optical trap holds particles for on-chip analysis A new type of optical particle trap can be used to manipulate bacteria, viruses and other particles on a chip as part of an integrated ... UC Santa Cruz To find more articles from UC Santa Cruz, use the search form below. Die attach, flip chip placement, & SMT in one machine The CX-1 placement machine is capable of handling a wide range of components, including SiP and MCM doing the work of two machines, saving capital investment and simplifying operations & maintenance. Learn more… Juki Automation Systems Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2009 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.