January 11, 2012 - Industry News
JEDEC Publishes Breakthrough Standard for Wide I/O mobile DRAM
JEDEC announced the availability of a new standard for Wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate (SDR). Widely anticipated by the industry ...
Business Wire
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August 2, 2011 - Industry News
Kulicke & Soffa 3Q11 Results Exceed High-End of Guidance
Kulicke & Soffa Industries, Inc. announced results for its third fiscal quarter. For its third quarter of fiscal 2011, the Company reported net ...
Business Wire
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July 22, 2011 - Top Story News
Worldwide Semi Growth Through 2015
International Data Corporation (IDC) forecasts worldwide semiconductor revenues will grow 5% year over year in 2012 and will achieve a compound annual growth rate of 6% ...
Business Wire
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July 12, 2011 - Industry News
CEA-Leti and Entegris to Study Cross-Molecular Contamination
CEA-Leti and Entegris have signed a two-year agreement to study cross-molecular contamination to and from semiconductor wafers and containers ...
Business Wire
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June 20, 2011 - Industry News
Taiwanese Desktop PC Industry's Shipment Volume Will Rebound In 2Q11
Research and Markets has announced the addition of the "The Taiwanese Desktop PC Industry, 2Q 2011" report to their offering. This research report ...
Business Wire
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May 3, 2011 - Industry News
Kulicke & Soffa Fiscal 2Q 2011 Results Exceed High-End of Guidance
Kulicke & Soffa Industries, Inc. announced results for its second fiscal quarter ended April 2, 2011. For its second quarter of fiscal 2011, the ...
Business Wire
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March 17, 2011 - Industry News
Kulicke & Soffa Appoints Alan Schindler as Senior Vice President
Kulicke & Soffa Industries, Inc. announced the appointment of Alan Schindler as the Senior Vice President, Global Operations, effective ...
Business Wire
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January 13, 2011 - Industry News
IBM, Samsung Announce Joint Research into New Semi Technology
IBM and Samsung today announced they will collaborate on basic research into new semiconductor materials, manufacturing processes and other ...
Business Wire
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December 9, 2010 - Industry News
Semtech and IBM Join Forces to Develop Platform Using 3D TSV Technology
Semtech Corp. announced it is working with IBM Corp. and its innovative 3D through-silicon via (TSV) technology to develop a high-performance ...
Business Wire
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November 11, 2010 - Industry News
Kulicke & Soffa Reports Results for its Fourth Quarter
Kulicke & Soffa Industries, Inc. announced results for its fourth fiscal quarter and year. The Company reported net revenue of $259.3 million ...
Business Wire
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November 3, 2010 - Industry News
Optomec's 3D Semi Packaging Solution Profiled in Chip Scale Review
Optomec announced that Chip Scale Review Magazine published an article titled "Jetting Your Way to Fine-pitch 3D Interconnects" in their ...
Business Wire
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August 30, 2010 - Industry News
Foton Motor and Freescale Semi Announce Automotive Joint Lab
During Foton Motor's 14th anniversary celebration, Foton and Freescale Semiconductor announced the establishment of the Automotive Joint Lab ...
Business Wire
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August 16, 2010 - Industry News
Electronic Component Orders Dip in July
Electronic component orders dipped in July after reaching a two-year high in June, according to the monthly order index compiled by the Electronic ...
Business Wire
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July 21, 2010 - Industry News
Applied Materials Restructures Solar Segment
Applied Materials, Inc. announced plans to restructure its Energy and Environmental Solutions (EES) segment to put a primary emphasis on ...
Business Wire
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July 20, 2010 - Industry News
Brian Toohey Takes Office as President of the SIA
Brian C. Toohey took office as president of the Semiconductor Industry Association (SIA). Toohey, 42, succeeds George Scalise, who has ...
Business Wire
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April 23, 2010 - Industry News
Semiconductor Industry Leaders Form DA5 Consortium to Explore Lead-Free Solutions
Bosch, Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics announced that they have formed a consortium to ...
Business Wire
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April 22, 2010 - Technology News
SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D ...
Business Wire
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April 1, 2010 - Industry News
GSA Announces Results of 2010 BOD Elections
The Global Semiconductor Alliance (GSA) announces the results of its 2010 Board of Directors' member election and one new board appointment. The ...
Business Wire
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January 29, 2010 - Industry News
Tessera Technologies Announces Fourth Quarter 2009 Results
Fourth quarter 2009 Micro-electronics revenue was comprised entirely of Royalties and License Fees. Micro-electronics did not have Products and ...
Business Wire
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January 15, 2010 - Technology News
Peregrine Semi Boosts Performance of Test, Measurement Equipment
Peregrine Semiconductor Corporation announced the new PE42556 SPDT (single pole double throw) RF switch. The PE42556, designed on Peregrine's ...
Wireless Business & Technology
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January 12, 2010 - Industry News
Tessera Technologies Announces Preliminary 4Q09 Revenue
Tessera Technologies, Inc. announced preliminary total revenues of approximately $56.0 million for the fourth quarter ended Dec. 31, 2009 ...
Business Wire
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January 5, 2010 - Industry News
Tessera Announces New Chairman of the Board
Tessera Technologies, Inc. announced that President and CEO Henry R. Nothhaft was appointed Chairman of the Board effective January 1, 2010 ...
Business Wire
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December 8, 2009 - Industry News
Advantest and STATS ChipPAC Expand Global Partnership with Silicon Valley Installation
Advantest Corporation announced that STATS ChipPAC Ltd. has installed a T2000 SoC test system in its facility in Milpitas, California. The ...
Business Wire
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September 23, 2009 - Technology News
MEMS in Bio/Medical, Consumer Electronics, Wireless, Energy and Automotive – What's New?
MEMS devices—tiny microelectromechanical systems that provide intelligent sensing, motion control, light reflection and switching, and even energy ...
Business Wire
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August 7, 2009 - Technology News
Strategy Analytics: GaAs and InP Underpin High Growth Fiber Optic Networks
In the growing fiber optic analog IC market, silicon, SiGe, GaAs and InP technologies all have different strengths with compound semiconductor ...
Business Wire
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