We search for industry news, so you don't need to.   Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map Microelectronics & Semiconductor Package AOI with Flexible Material Handling MVP's Ultra 850G platform provides 2D & 3D metrology capabilities for backend semiconductor & microelectronics devices to 1µm resolution. Tray, Strip, In-Line, Magazine and custom handling solutions are available for any module or package style. Learn more… Machine Vision Products, Inc. Die attach, flip chip placement, & SMT in one machine The CX-1 placement machine is capable of handling a wide range of components, including SiP and MCM doing the work of two machines, saving capital investment and simplifying operations & maintenance. Learn more… Juki Automation Systems   Industry and Technology News Index July 1, 2009  -  Click the title to read the full article. Virage Logic Sees Strong Adoption of Company's Broad 40nm IP Product Portfolio Virage Logic Corporation announced that since being named TSMC's 40-namomenter (nm) early development partner in 2007, the company has seen ... Business Wire We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Business Wire July 21, 2010 - Industry News Applied Materials Restructures Solar Segment Applied Materials, Inc. announced plans to restructure its Energy and Environmental Solutions (EES) segment to put a primary emphasis on ... Business Wire July 20, 2010 - Industry News Brian Toohey Takes Office as President of the SIA Brian C. Toohey took office as president of the Semiconductor Industry Association (SIA). Toohey, 42, succeeds George Scalise, who has ... Business Wire April 23, 2010 - Industry News Semiconductor Industry Leaders Form DA5 Consortium to Explore Lead-Free Solutions Bosch, Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics announced that they have formed a consortium to ... Business Wire April 22, 2010 - Technology News SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D ... Business Wire April 1, 2010 - Industry News GSA Announces Results of 2010 BOD Elections The Global Semiconductor Alliance (GSA) announces the results of its 2010 Board of Directors' member election and one new board appointment. The ... Business Wire January 29, 2010 - Industry News Tessera Technologies Announces Fourth Quarter 2009 Results Fourth quarter 2009 Micro-electronics revenue was comprised entirely of Royalties and License Fees. Micro-electronics did not have Products and ... Business Wire January 15, 2010 - Technology News Peregrine Semi Boosts Performance of Test, Measurement Equipment Peregrine Semiconductor Corporation announced the new PE42556 SPDT (single pole double throw) RF switch. The PE42556, designed on Peregrine's ... Wireless Business & Technology January 12, 2010 - Industry News Tessera Technologies Announces Preliminary 4Q09 Revenue Tessera Technologies, Inc. announced preliminary total revenues of approximately $56.0 million for the fourth quarter ended Dec. 31, 2009 ... Business Wire January 5, 2010 - Industry News Tessera Announces New Chairman of the Board Tessera Technologies, Inc. announced that President and CEO Henry R. Nothhaft was appointed Chairman of the Board effective January 1, 2010 ... Business Wire December 8, 2009 - Industry News Advantest and STATS ChipPAC Expand Global Partnership with Silicon Valley Installation Advantest Corporation announced that STATS ChipPAC Ltd. has installed a T2000 SoC test system in its facility in Milpitas, California. The ... Business Wire September 23, 2009 - Technology News MEMS in Bio/Medical, Consumer Electronics, Wireless, Energy and Automotive – What's New? MEMS devices—tiny microelectromechanical systems that provide intelligent sensing, motion control, light reflection and switching, and even energy ... Business Wire August 7, 2009 - Technology News Strategy Analytics: GaAs and InP Underpin High Growth Fiber Optic Networks In the growing fiber optic analog IC market, silicon, SiGe, GaAs and InP technologies all have different strengths with compound semiconductor ... Business Wire July 16, 2009 - Technology News Semiconductor Research Corporation and National Science Foundation Fund Search for New Transistors Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductors and related technologies, today ... Business Wire July 15, 2009 - Technology News Applied Materials Sees Innovation and Industry Collaboration as Vital to Keeping Moore's Law Alive While the current economic environment is imposing severe constraints on the semiconductor equipment industry, the primary driver for increasing ... Business Wire July 14, 2009 - Technology News Chartered Offers 65nm RF Platform to Enable Single-Chip Wireless Applications Chartered Semiconductor Manufacturing (Nasdaq:CHRT) (SGX:CHARTEREDSC), one of the world’s top dedicated foundries, today announced a robust ... Business Wire July 8, 2009 - Industry News Intellon Corporation Surpasses 30 Million Shipment Milestone for HomePlug-based Powerline ICs Intellon Corporation (Nasdaq:ITLN), a leading provider of HomePlug®-compatible integrated circuits (ICs) for home networking, networked ... Business Wire July 1, 2009 - Industry News Virage Logic Sees Strong Adoption of Company's Broad 40nm IP Product Portfolio Virage Logic Corporation announced that since being named TSMC's 40-namomenter (nm) early development partner in 2007, the company has seen ... Business Wire July 1, 2009 - Industry News Research and Markets: New Report: MEMS Accelerometer Research and Markets has announced the addition of the "MEMS Accelerometer, Gyroscope & IMU Market 2008-2013" report to their offering ... Business Wire June 23, 2009 - Industry News Freescale Ships One Billionth Sensor, Nears 30 Years of Sensor Innovation Freescale Semiconductor’s sensor technology innovation has helped global customers differentiate their automotive, consumer, industrial and ... Business Wire June 16, 2009 - Industry News Freescale Speeds Embedded Multicore Adoption with New VortiQa Software Products and an Expanded Ecosystem Optimized for QorIQ and PowerQUICC Communications Platforms, Production-Ready VortiQa Software Shortens Development Cycles and ... Business Wire June 5, 2009 - Technology News Technologists Investigate Challenges for 3D Interconnect Metrology at SEMATECH Workshop During SEMICON West To gain a better understanding of how new and existing wafer metrology technologies can be used, modified, or enhanced to measure and improve ... Business Wire June 2, 2009 - Industry News NetLogic Microsystems Announces Definitive Agreement to Merge with RMI Corporation NetLogic Microsystems, Inc. and RMI Corporation announced that they have entered into a definitive agreement to merge. RMI's portfolio of high ... Business Wire May 28, 2009 - Industry News Irdeto Selects S3's StormTestTM to Automate Testing of End-To-End Conditional Access System S3, a leading provider of products, services and IP to the Digital TV industry, today announced that Irdeto has selected their StormTestTM ... Business Wire May 20, 2009 - Technology News Unity Semiconductor Exits Stealth Mode Unity Semiconductor Corp., a Silicon Valley start-up that will serve the semiconductor data storage memory market as a designer, developer and ... Business Wire May 20, 2009 - Industry News Tower and Jazz Semiconductor Announce Industry's First Scalable Rdson Design Tool for Growing Power Management Market Tower Semiconductor, Ltd. and Jazz Semiconductor, Inc. announced an industry first scalable Rdson versus breakdown voltage design kit technology ... Business Wire To find more articles from Business Wire, use the search form below. PCD Technology Improves Dispensing Volumetric dispensing improves throughput and dispense quality. PCD technology is compatible with a wide range of viscosities from water to thick pastes. Increase throughput 2–4 times with this new technology, learn more… GPD Global Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2009 Circuitnet.    All rights reserved. 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