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  Photo Resist Coating System
Featuring Ultrasonic Technology
Photo Resist Coating SystemUSI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more…
Ultrasonic Systems, Inc.
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Online Auction of Qimonda Portugal Back-End Equipment
PCD TechnologyA large selection of Wafer Testers, Dicers, Die & Wire Bonders, Burn-in Ovens and more will be sold by Online Auction closing 04 August 2010 from Europe's largest Memory Chips Assembly & Test facility. Bid now…
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Advances in Micro-electronics Inspection
Provides High Resolution and High UPH,
Machine Vision ProductsMVP's Ultra 850G platform provides high resolution inspection for backend semiconductor and microelectronics processes. Using 2D/3D inspection techniques, the Ultra 850G provides metrology capabilities for wire bond, die, surface damage, underfill, BGA/Bump and other processes. Learn more…
Machine Vision Products, Inc.
  Industry and Technology News Index
July 1, 2009  -  Click the title to read the full article.

Fit For A Queen
With a sensing element etched from a silicon wafer, it is sensitive enough to detect the Earth's rotation … and win the Queen’s approval. ...
Product Design & Development
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February 10, 2010 - Industry News
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Packaging Equipment: Heating Up Electronic Packaging
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As electronic devices become increasingly smaller, lighter, thinner and more powerful, the demand for more precise and faster packaging technology has increased. Despite the difference in ...

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Die attach, flip chip placement, & SMT in one machine
CX-1The CX-1 placement machine is capable of handling a wide range of components, including SiP and MCM doing the work of two machines, saving capital investment and simplifying operations & maintenance. Learn more…
Juki Automation Systems




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