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  mBGA Flux deposition
with ultrasonic coating technology
mBGAUSI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more...
Ultrasonic Systems, Inc.
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Lead-Free package level alloys
New White Paper
Full Wafer Die Attach White PaperNot all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications. A new breakthrough package level lead-free alloy addresses board-level alloy challenges. Click to download paper…
Henkel Corporation




F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
F&K Delvotec
  Industry and Technology News Index
July 1, 2009  -  Click the title to read the full article.

Broadcom ups bid for Emulex to $912M, drops lawsuit
Broadcom is now offering $11 per share for fibre channel storage networking company Emulex, but says it will move on, considering other ...
EDN
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July 29, 2010 - Industry News
Intel says light beams can replace electronic signals for future computers
The company said it has developed a research prototype employing extremely thin and light optical fibers and representing the world's ...
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July 23, 2010 - Industry News
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Apple is expected to become the world's second largest OEM semiconductor buyer in 2011 and could become the top semiconductor spender in 2012, ...
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July 23, 2010 - Industry News
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The past 12 consecutive months of book-to-bill ratios over 1.0 indicate the consistent customer demand for North America-based manufacturers of ...
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July 22, 2010 - Industry News
CEO on Mentor's role in IC and system design plus test
In a wide-ranging interview at Semicon West, Walden C Rhines, chairman and CEO of Mentor Graphics, addressed the challenges the EDA and ...
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July 16, 2010 - Top Story News
The Time Is Now for 3-D Stacked Die
As the semiconductor industry moves from "more Moore" to "more than Moore," 3-D-stacked-die implementations will become critical for implementing ...
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July 13, 2010 - Top Story News
Semi Equipment Sales Expect 96% Growth in 2010
The recovery is well under way and secure in the semiconductor equipment market, according to the latest data from VLSI Research Inc. The research ...
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July 7, 2010 - Industry News
Hon Hai plans on becoming LCD powerhouse
The soaring shipments of flat-panel TVs have LCD panel suppliers, EMS companies, and OEMs moving to tighten electronics supply chains in ...
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June 28, 2010 - Industry News
Electronics supply chain inventory leaner than current levels indicate
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June 28, 2010 - Industry News
Path-specific derating to reduce timing pessimism: a proposal
Reducing your pessimism about timing uncertainty as the design progresses can speed timing closure. This article proposes few methods to speed the ...
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June 25, 2010 - Industry News
Samsung on pace for at least $30B semiconductor sales in 2010
IC Insights Inc has high expectations for Samsung in 2010. The market research company reported Thursday that Samsung is on pace for at least ...
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June 24, 2010 - Industry News
Electronics supply chain inventory leaner than levels indicate
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June 23, 2010 - Industry News
EUV lithography cannot come soon enough
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June 22, 2010 - Industry News
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June 14, 2010 - Industry News
ON Semi buys medical-focused Sound Design Technologies
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June 11, 2010 - Technology News
Altering the SOC-design flow
SOC (system-on-chip)-design teams at the leading edge of their markets say that "business as usual" is no longer the case. Powerful technical and ...
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June 10, 2010 - Industry News
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June 8, 2010 - Industry News
ON Semi to expand Idaho fab, adding jobs, capacity
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May 28, 2010 - Industry News
IBM analyst sees continued growth for consumer electronics, but ...
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May 25, 2010 - Industry News
Microchip sells certain SST assets to Greenliant
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May 20, 2010 - Technology News
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May 19, 2010 - Industry News
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May 18, 2010 - Industry News
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May 14, 2010 - Industry News
Overall power-supply efficiency depends on sweating the small stuff
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May 13, 2010 - Industry News
Foundry Revenue Gains to Outperform Semi industry Gains in 2010
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May 13, 2010 - Industry News
NEDA, ECA merge, target counterfeit components
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To find more articles from EDN, use the search form below.


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Evaluate before you buy
Sub-micron Die Bonder...not after, it's too late then. Don't rely on unproven claims, seeing is believing. Demand a full demo with your samples – we'll do it! Make the smart choice. Learn more…
Finetech




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