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  mBGA Flux deposition
with ultrasonic coating technology
mBGAUSI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more...
Ultrasonic Systems, Inc.
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See wire bonding in action
Wire bonding demonstration videos
wire bonding in actionExperts demonstrate programming for consistent loop height and wire length, 45° and 89° deep access, loop and wire deformation parameters and ribbon bonding on one platform. Learn more…
Hesse & Knipps, Inc.




Jetting Systems Technology
New white paper
Dispensejet DJ-100 Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more…
Nordson ASYMTEK
  Industry and Technology News Index
July 1, 2009  -  Click the title to read the full article.

Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified ...
Digitimes
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More from Digitimes
July 30, 2010 - Industry News
SPIL on copper wirebonder buying spree
Siliconware Precision Industries (SPIL) has revealed that another 600 copper wirebonders will be installed at its production sites in China ...
Digitimes
July 29, 2010 - Industry News
SPIL on copper wirebonder buying spree
Siliconware Precision Industries (SPIL) has revealed that another 600 copper wirebonders will be installed at its production sites in China ...
Digitimes
July 29, 2010 - Industry News
Global pico projector shipments reach 437,000 units in 1H10
Global shipments of pico projectors in the first half of 2010 totaled 437,791 units, of which 46% were LCoS-based handset models offered by ...
Digitimes
July 29, 2010 - Industry News
Macronix to spend NT$30 billion on 12-inch fab over two years
Macronix International will invest in its recently-acquired 12-inch wafer fab at the Hsinchu Science Park (HSP), northern Taiwan in 2010 and 2011 ...
Digitimes
July 28, 2010 - Industry News
Global e-book reader shipments fall short of forecast in 2Q10
A total of 1.35 million e-book readers were shipped to the global market in the second quarter of 2010, 33.2% fewer than the originally projected ...
Digitimes
July 27, 2010 - Industry News
Equipment providers see strong 3Q10 amid capacity expansions
Gallant Precision Machining (GPM) expects sales of equipment for panels, solar energy products and semiconductors to account for 40%, 25% and ...
Digitimes
July 27, 2010 - Industry News
Acer encourages Foxconn chairman to stay committed to Taiwan
Commenting on Foxconn Electronics chairman Terry Guo's thoughts about reconsidering his commitment to Taiwan and that he would consider ...
Digitimes
July 20, 2010 - Industry News
Capacity utilization rates at foundry houses likely to fall in 4Q10
While most Taiwan-based wafer foundry houses will be still running at full capacity in the third quarter, some industry watchers are skeptical ...
Digitimes
July 19, 2010 - Industry News
Capacity utilization rates at foundry houses likely to fall in 4Q10
While most Taiwan-based wafer foundry houses will be still running at full capacity in the third quarter, some industry watchers are ...
Digitimes
July 16, 2010 - Industry News
IC packaging and testing houses turn conservative over outlook
Taiwan-based IC packaging and testing companies are conservative about the outlook for the third quarter after Intel projected a moderate revenue ...
Digitimes
July 16, 2010 - Industry News
Chin-Poon posts all-time high consolidated revenues in June
PCB maker Chin-Poon Industrial has posted consolidated revenues for June 2010, the company's highest monthly record. Second-quarter revenues ...
Digitimes
July 14, 2010 - Industry News
TSMC to break ground for new 12-inch fab on July 16
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground soon for the construction of Fab 15 at the Central Taiwan Science Park ...
Digitimes
July 14, 2010 - Industry News
Foundry quotes for mature processes rise 10-15%, says paper
Taiwan-based analog IC designers including Richtek Technology, Global Mixed-code Technology (GMT), Anpec Technology and Leadtrend Technology ...
Digitimes
July 13, 2010 - Industry News
UAT tripling wafer bumping capacity
Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity ...
Digitimes
July 12, 2010 - Industry News
TSMC 2Q10 revenues top guidance
Taiwan Semiconductor Manufacturing Company (TSMC) saw consolidated revenues amount higher than its target. TSMC posted consolidated sales ...
Digitimes
July 9, 2010 - Industry News
Chip equipment market grows 43% in 1Q10, says VLSI Research
The semiconductor equipment market reached US$10.36 billion in the first quarter of 2010, growing 43% from US$7.24 billion in the prior quarter, ...
Digitimes
July 9, 2010 - Industry News
Taiwan networking IC vendors look to strong sales in 3Q-4Q10
Taiwan-based networking IC vendors are looking to strong sales in the third and fourth quarters due to increasing demand for Ethernet, Gigabit ...
Digitimes
July 8, 2010 - Industry News
Taiwan passive component makers reach 2Q10 sales target
Passive component makers Yageo and Holy Stone posted declines in June revenues but both companies still reached their second-quarter sales ...
Digitimes
July 7, 2010 - Industry News
ASE posts monthly sales record in June
Chip packager Advanced Semiconductor Engineering (ASE) posted consolidated revenues in June 2010, up 4.9% sequentially and hitting a ...
Digitimes
July 6, 2010 - Industry News
ASE, SPIL to feel constrained by capacity crunch
Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) are likely to see constraints in fab capacity limit their ...
Digitimes
July 6, 2010 - Industry News
National Semi could become top performing analog IC vendor
National is the second ranked power management IC vendor, nearly one-half of its total US$$1.4 billion revenues comes from power management. ...
Digitimes
July 2, 2010 - Industry News
ITRI sets up 3D IC experimental lab
The Taiwan government-backed Industrial Technology Research Institute (ITRI) has announced the establishment of an experimental lab, which ...
Digitimes
July 1, 2010 - Industry News
ITRI sets up 3D IC experimental lab
The Taiwan government-backed Industrial Technology Research Institute (ITRI) has announced the establishment of an experimental lab, which ...
Digitimes
June 30, 2010 - Industry News
ASE to invest US$124 million in China operations
Advanced Semiconductor Engineering (ASE) has announced plans to spend a total of US$124 million on operation expansions in China. The investment ...
Digitimes
June 29, 2010 - Industry News
Chipbond to buy new testers; 2010 capex to reach NT$2 billion
Chipbond Technology has announced it plans to spend US$62 million in capex this year, an upward revision from its originally-planned ...
Digitimes
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PacTech's SB2-Jet
Laser Solder Jetting System
PacTech's SB2Sequential high speed soldering using laser-reflow with high substrate design and solder ball size flexibility. Fluxless, contactless at low thermal stress—ideal for flip-chip, MEMS, 3D-packaging and CSP/BGA's re-balling. Learn more…
PacTech




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