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June 30, 2009


1µ Placement Accuracy
TRESKY High Accuracy Bonder
M-System1Advanced, highly accurate assembly solutions with an easy-to-use platform for micro-electronics assembly. Ideal for Flip-Chip, Thermosonic, MEMS, Optical Components. Learn more…
Dr Tresky AG

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"Which valve do I use" answered by PCD Dispense Technology
PCD TechnologyNo matter the material the PCD dispense technology will deliver volumetric, repeatable results without calibration. Ease of setup and compatibility over a wide range of viscosities ensures repeatable day-to-day operations. Learn more…
GPD Global
Letters Submit

F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
F&K Delvotec
Top Story  
Teardown reveals thin profit margin on Mac Mini
Apple may rake in stunning profits on its iPods and iPhones, but as far as computers are concerned, the company cannot break out of the common ...
TG Daily

MEPTEC/SMTA Presents
2010 Medical Electronics Symposium
Medical Electronics SymposiumJoin MEPTEC & SMTA on September 22-23, 2010, at Arizona State University for Successful Strategies for the Medical Electronics Sector: Steady Growth Keeps the Momentum Moving Forward. Learn more…
MEPTEC
Industry News  
Amkor’s James Kim to leave CEO role, Ken Joyce to take over
Amkor Technology Inc. will have a new CEO beginning in October as Ken Joyce takes over from current company head James Kim. Kim, the company's ...
Phoenix Business Journal
Jobs back at Apple after 5 1/2-month leave
After a 5 1/2-month medical leave, Apple CEO Steve Jobs resumed control of a company that hasn't skipped a beat in his absence, but faces more ...
San Francisco Chronicle
Semico projects five-fold netbook growth
As many as 59 million netbooks will ship in 2013, nearly 22 percent of the mobile PC market and up almost five-fold from 2008, according to a ...
EETimes
Five enablers for future chip scaling
IC scaling remains a challenge. To enable chip scaling, there is always brute-force lithography. During a presentation, chip-making consortium ...
EETimes
Nokia plots latest foray into North America
The success of Nokia Corp.'s latest effort to build a stronger foothold in the U.S. hinges on how well the company exploits assets it plans to ...
Market Watch
Apple and Intel Share market in Chip market
Apparently, Apple and Intel are investing a large sum of cash into a company in the United Kingdom that designs chips which are becoming ...
Phones Review
Singapore pumps S$16 million into training 150 integrated circuit designers over 5 years
The Singapore Economic Development Board (EDB) is investing S$16 million into a new initiative to encourage postgraduate students to specialize ...
Nanowerk LLC
Alchimer's new TSV process: When less really is more
Alchimer recently announced it had enhanced its eG ViaCoat process -- a wet deposition process for the copper seed metallization of through-silicon ...
Solid State Technology
Just When Will the Semiconductor Equipment Market Turn Around?
SEMI reported last week that North America-based manufacturers of semiconductor equipment shipped about $391.9 worth of equipment in May ...
Seeking Alpha
Taiwan government launches program to strengthen MEMS supply chain
Taiwan's Science Park Administration has proposed a program, the SoC Innovative Product Partnership (SIPP), inviting players from the local ...
Digitimes
FPCB shipments for LED light bars rising
Flexium Interconnect and Career Technology have indicated that demand for flexible PCBs (FPCBs) used in LED light bars is increasing as almost ...
Digitimes
Intel urges SMEs: Don't delay PC refresh
Chip giant Intel has urged small and medium-sized enterprises to avoid lengthening their PC refresh cycles as a cost-cutting measure during the ...
ZDNet
CopperGate Shipped Over 10 Million HomePNA Chips for Home Networking
CopperGate Communications Ltd., the Everywire Home Networking Company™, has shipped over 10 million HomePNA chipsets. ...
SYS-CON
Silicon Labs Introduces the Highest Performance Single-Chip Hybrid TV Tuner
Silicon Laboratories Inc. announced the Si2170, a complete, globally-compliant hybrid TV tuner with analog TV demodulator in a single CMOS ...
Silicon Laboratories Inc.
Exar Launches Industry’s Fastest Universal Asynchronous Receiver Transmitter (UART) Series with USB 2.0 Compliant Bus Interface
Exar Corporation announced the industry’s fastest Full-Speed USB UART with up to 12Mbps serial data rate. The series is composed of three devices ...
PressReleasePoint
Silicon Labs' new TV chip could double company's revenue in five years
Deep inside even the latest and greatest flat-screen television sets resides an electronic anachronism. In the industry, it's known as the ...
Austin-American Statesman
IDT Completes Acquisition of Tundra Semiconductor
IDT® announced the closing of its acquisition of all of the shares of Tundra® Semiconductor Corporation for aggregate cash consideration ...
EarthTimes
Amkor Announces Management Succession Plan
Amkor Technology, Inc. announced a succession plan for senior management. Under the plan, James Kim, Founder, Chairman and CEO will become Executive ...
PressReleasePoint
Percentage of semis consumed by top OEMs increased in 2008, expected to decrease in 2009
At 79%, the percentage of semiconductors bought by the top 100 OEMs was up in 2008 from 2007's 76%, but at $202 billion, total value of the units ...
EDN

Metallization Lines by ASYS
Metallization LinesOver 8 GW installed
Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Visit us at Solar Power International, Booth # 421 or call us today at +1 866 GO 4 ASYS …
ASYS Group Americas Inc.
Technology News  
New Silicon Run Film, MEMS: Making Micro Machines, Provides Inside Look at MEMS Manufacturing
Filmmaker Ruth Carranza has done more to document semiconductor and computer manufacturing than almost anyone in the business. With a ...
Centre Daily Times
New solar airplane unveiled in Switzerland
After a six-year effort, the prototype of a new solar-powered aircraft was unveiled at a Swiss airfield on Friday by its future pilots and ...
CNet News
Memcon panel explores readiness of DDR3
Chips are shipping, but questions remain about the ramp of the new DRAM standard. DDR3 DRAM is upon us, whether or not we—and it—are entirely ...
EDN

PacTech's Ultra-SB2 WLR
Volume Solder Ball Placement
PacTech's Ultra-SB2 WLRWafer level solder ball rework system for 6- to 12-inch wafers and substrates with solder ball sizes down to 60µm for flip-chip WLSCP applications. Integrated 2D-Inspection and reflow. Learn more …
PacTech

Corporate News Submit
Christopher Assoc. to introduce automated photovoltaic module soldering technology at Intersolar
Christopher Associates Inc. will introduce the XE-1000 Series robotic soldering systems for attaching tabbing and bus ribbon to crystalline ...
Christopher Associates Inc.
Today's Sponsor

New Fully Automatic Heavy Wire Bonder
Increases Productivity by 30%
wire bonding in actionProcess aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more…
Hesse & Knipps, Inc.

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Microelectronics & Semiconductor Package
AOI with Flexible Material Handling
Machine Vision ProductsMVP's Ultra 850G platform provides 2D & 3D metrology capabilities for backend semiconductor & microelectronics devices to 1µm resolution. Tray, Strip, In-Line, Magazine and custom handling solutions are available for any module or package style. Learn more…
Machine Vision Products, Inc.

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5 Micron Placement Capable!
Small Footprint, Low Cost
Air-Vac Onyx500The new ONYX500 Benchtop is the ultimate precision, multifunctional system with a wide range of applications including MEMS with automatic pick, place, dispense and assembly. Learn more…
Air-Vac Engineering


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