We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers June 30, 2009 Thermally Conductive Underfill Epoxy Features 5–10 Minute Cure EP3RR-1 thermally conductive epoxy has excellent toughness. A one part epoxy, requiring oven curing at 250°–300°F, it is used in electronic packaging. Excellent flow, temperature range to 400°F. For more information… Master Bond New Photovoltaic Coating System Precision coating of solar wafers To apply a thin, uniform layer of phosphoric acid or phosphoric oxide based dopants and other proprietary coatings for the production of solar cells, USI has Technology for every application. Learn more… Ultrasonic Systems, Inc. Letters Submit 3 µm Semiconductor Automated Optical Inspection The REVEAL MEMS Series Provides solutions for the Semiconductor industry with high reliability automated inspection capabilities at production speeds. This in-line inspection machine for MEMS packaging processes increases yield & reduces manufacturing costs. Learn more… Vi TECHNOLOGY Top Story   Teardown reveals thin profit margin on Mac Mini Apple may rake in stunning profits on its iPods and iPhones, but as far as computers are concerned, the company cannot break out of the common ... TG Daily Dynaloy Solutions for WLP Advanced Packaging Applications Dynaloy offers Dynastrip™ DL88 for improved safety and better cleaning in Wafer Level CSP applications. See Dynaloy's advanced solutions for Flip Chip Bumping, Cu Pillar, Micro Pillar, Fan-out, WLCSP, and other challenging packaging cleaning processes. Learn more… Dynaloy LLC Industry News   Amkor’s James Kim to leave CEO role, Ken Joyce to take over Amkor Technology Inc. will have a new CEO beginning in October as Ken Joyce takes over from current company head James Kim. Kim, the company's ... Phoenix Business Journal Jobs back at Apple after 5 1/2-month leave After a 5 1/2-month medical leave, Apple CEO Steve Jobs resumed control of a company that hasn't skipped a beat in his absence, but faces more ... San Francisco Chronicle Semico projects five-fold netbook growth As many as 59 million netbooks will ship in 2013, nearly 22 percent of the mobile PC market and up almost five-fold from 2008, according to a ... EETimes Five enablers for future chip scaling IC scaling remains a challenge. To enable chip scaling, there is always brute-force lithography. During a presentation, chip-making consortium ... EETimes Nokia plots latest foray into North America The success of Nokia Corp.'s latest effort to build a stronger foothold in the U.S. hinges on how well the company exploits assets it plans to ... Market Watch Apple and Intel Share market in Chip market Apparently, Apple and Intel are investing a large sum of cash into a company in the United Kingdom that designs chips which are becoming ... Phones Review Singapore pumps S$16 million into training 150 integrated circuit designers over 5 years The Singapore Economic Development Board (EDB) is investing S$16 million into a new initiative to encourage postgraduate students to specialize ... Nanowerk LLC Alchimer's new TSV process: When less really is more Alchimer recently announced it had enhanced its eG ViaCoat process -- a wet deposition process for the copper seed metallization of through-silicon ... Solid State Technology Just When Will the Semiconductor Equipment Market Turn Around? SEMI reported last week that North America-based manufacturers of semiconductor equipment shipped about $391.9 worth of equipment in May ... Seeking Alpha Taiwan government launches program to strengthen MEMS supply chain Taiwan's Science Park Administration has proposed a program, the SoC Innovative Product Partnership (SIPP), inviting players from the local ... Digitimes FPCB shipments for LED light bars rising Flexium Interconnect and Career Technology have indicated that demand for flexible PCBs (FPCBs) used in LED light bars is increasing as almost ... Digitimes Intel urges SMEs: Don't delay PC refresh Chip giant Intel has urged small and medium-sized enterprises to avoid lengthening their PC refresh cycles as a cost-cutting measure during the ... ZDNet CopperGate Shipped Over 10 Million HomePNA Chips for Home Networking CopperGate Communications Ltd., the Everywire Home Networking Company™, has shipped over 10 million HomePNA chipsets. ... SYS-CON Silicon Labs Introduces the Highest Performance Single-Chip Hybrid TV Tuner Silicon Laboratories Inc. announced the Si2170, a complete, globally-compliant hybrid TV tuner with analog TV demodulator in a single CMOS ... Silicon Laboratories Inc. Exar Launches Industry’s Fastest Universal Asynchronous Receiver Transmitter (UART) Series with USB 2.0 Compliant Bus Interface Exar Corporation announced the industry’s fastest Full-Speed USB UART with up to 12Mbps serial data rate. The series is composed of three devices ... PressReleasePoint Silicon Labs' new TV chip could double company's revenue in five years Deep inside even the latest and greatest flat-screen television sets resides an electronic anachronism. In the industry, it's known as the ... Austin-American Statesman IDT Completes Acquisition of Tundra Semiconductor IDT® announced the closing of its acquisition of all of the shares of Tundra® Semiconductor Corporation for aggregate cash consideration ... EarthTimes Amkor Announces Management Succession Plan Amkor Technology, Inc. announced a succession plan for senior management. Under the plan, James Kim, Founder, Chairman and CEO will become Executive ... PressReleasePoint Percentage of semis consumed by top OEMs increased in 2008, expected to decrease in 2009 At 79%, the percentage of semiconductors bought by the top 100 OEMs was up in 2008 from 2007's 76%, but at $202 billion, total value of the units ... EDN Better Reflectivity Control with ShinEtsu GBARC ShinEtsu GBARC for high NA immersion lithography. Single layer reflectivity control for CD swing control and standing wave elimination. Straighter profiles with no footing; low LER. Eliminates dual barc coats saving process steps and chemicals. Learn more… ShinEtsu Technology News   New Silicon Run Film, MEMS: Making Micro Machines, Provides Inside Look at MEMS Manufacturing Filmmaker Ruth Carranza has done more to document semiconductor and computer manufacturing than almost anyone in the business. With a ... Centre Daily Times New solar airplane unveiled in Switzerland After a six-year effort, the prototype of a new solar-powered aircraft was unveiled at a Swiss airfield on Friday by its future pilots and ... CNet News Memcon panel explores readiness of DDR3 Chips are shipping, but questions remain about the ramp of the new DRAM standard. DDR3 DRAM is upon us, whether or not we—and it—are entirely ... EDN Webcast: Silicon Interposers with TSVs and Thin-Film Capacitors The evolution of silicon interposers without Through Silicon Vias (TSVs) to interposers with TSVs. Webcast on March 17, will discuss mechanical benefits of attaching ICs to silicon and electrical benefits of passive and active elements including Implementation & reliability data. Learn more… ALLVIA, Inc. Corporate News Submit Christopher Assoc. to introduce automated photovoltaic module soldering technology at Intersolar Christopher Associates Inc. will introduce the XE-1000 Series robotic soldering systems for attaching tabbing and bus ribbon to crystalline ... Christopher Associates Inc. Today's Sponsor PacTech's PacLine 300 Electroless Ni Plating System Mass-production solutions for 4- to 12-inch wafers at 150 wafers/hour. Ni/Au, Ni/Pd and Ni/Pd/Au plating for Flip-Chip UBM or top metal finish for wirebond or power device clip attach. Learn more… PacTech Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology F&K Delvotec receives two recognitions VLSI "highest rated wire bonder maker 2009" VLSI recognized F&K Delvotec with two major awards. Not only did F&K Delvotec make the VLSI's 10 Best List but they also stated "F&K Delvotec, the highest rated wire bonder maker." Learn more… F&K Delvotec Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. 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