We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers June 30, 2009 1µ Placement Accuracy TRESKY High Accuracy Bonder Advanced, highly accurate assembly solutions with an easy-to-use platform for micro-electronics assembly. Ideal for Flip-Chip, Thermosonic, MEMS, Optical Components. Learn more… Dr Tresky AG "Which valve do I use" answered by PCD Dispense Technology No matter the material the PCD dispense technology will deliver volumetric, repeatable results without calibration. Ease of setup and compatibility over a wide range of viscosities ensures repeatable day-to-day operations. Learn more… GPD Global Letters Submit F&K Delvotec introduces World's ONLY Rotary Head Ball Bonder F&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more… F&K Delvotec Top Story   Teardown reveals thin profit margin on Mac Mini Apple may rake in stunning profits on its iPods and iPhones, but as far as computers are concerned, the company cannot break out of the common ... TG Daily MEPTEC/SMTA Presents 2010 Medical Electronics Symposium Join MEPTEC & SMTA on September 22-23, 2010, at Arizona State University for Successful Strategies for the Medical Electronics Sector: Steady Growth Keeps the Momentum Moving Forward. Learn more… MEPTEC Industry News   Amkor’s James Kim to leave CEO role, Ken Joyce to take over Amkor Technology Inc. will have a new CEO beginning in October as Ken Joyce takes over from current company head James Kim. Kim, the company's ... Phoenix Business Journal Jobs back at Apple after 5 1/2-month leave After a 5 1/2-month medical leave, Apple CEO Steve Jobs resumed control of a company that hasn't skipped a beat in his absence, but faces more ... San Francisco Chronicle Semico projects five-fold netbook growth As many as 59 million netbooks will ship in 2013, nearly 22 percent of the mobile PC market and up almost five-fold from 2008, according to a ... EETimes Five enablers for future chip scaling IC scaling remains a challenge. To enable chip scaling, there is always brute-force lithography. During a presentation, chip-making consortium ... EETimes Nokia plots latest foray into North America The success of Nokia Corp.'s latest effort to build a stronger foothold in the U.S. hinges on how well the company exploits assets it plans to ... Market Watch Apple and Intel Share market in Chip market Apparently, Apple and Intel are investing a large sum of cash into a company in the United Kingdom that designs chips which are becoming ... Phones Review Singapore pumps S$16 million into training 150 integrated circuit designers over 5 years The Singapore Economic Development Board (EDB) is investing S$16 million into a new initiative to encourage postgraduate students to specialize ... Nanowerk LLC Alchimer's new TSV process: When less really is more Alchimer recently announced it had enhanced its eG ViaCoat process -- a wet deposition process for the copper seed metallization of through-silicon ... Solid State Technology Just When Will the Semiconductor Equipment Market Turn Around? SEMI reported last week that North America-based manufacturers of semiconductor equipment shipped about $391.9 worth of equipment in May ... Seeking Alpha Taiwan government launches program to strengthen MEMS supply chain Taiwan's Science Park Administration has proposed a program, the SoC Innovative Product Partnership (SIPP), inviting players from the local ... Digitimes FPCB shipments for LED light bars rising Flexium Interconnect and Career Technology have indicated that demand for flexible PCBs (FPCBs) used in LED light bars is increasing as almost ... Digitimes Intel urges SMEs: Don't delay PC refresh Chip giant Intel has urged small and medium-sized enterprises to avoid lengthening their PC refresh cycles as a cost-cutting measure during the ... ZDNet CopperGate Shipped Over 10 Million HomePNA Chips for Home Networking CopperGate Communications Ltd., the Everywire Home Networking Company™, has shipped over 10 million HomePNA chipsets. ... SYS-CON Silicon Labs Introduces the Highest Performance Single-Chip Hybrid TV Tuner Silicon Laboratories Inc. announced the Si2170, a complete, globally-compliant hybrid TV tuner with analog TV demodulator in a single CMOS ... Silicon Laboratories Inc. Exar Launches Industry’s Fastest Universal Asynchronous Receiver Transmitter (UART) Series with USB 2.0 Compliant Bus Interface Exar Corporation announced the industry’s fastest Full-Speed USB UART with up to 12Mbps serial data rate. The series is composed of three devices ... PressReleasePoint Silicon Labs' new TV chip could double company's revenue in five years Deep inside even the latest and greatest flat-screen television sets resides an electronic anachronism. In the industry, it's known as the ... Austin-American Statesman IDT Completes Acquisition of Tundra Semiconductor IDT® announced the closing of its acquisition of all of the shares of Tundra® Semiconductor Corporation for aggregate cash consideration ... EarthTimes Amkor Announces Management Succession Plan Amkor Technology, Inc. announced a succession plan for senior management. Under the plan, James Kim, Founder, Chairman and CEO will become Executive ... PressReleasePoint Percentage of semis consumed by top OEMs increased in 2008, expected to decrease in 2009 At 79%, the percentage of semiconductors bought by the top 100 OEMs was up in 2008 from 2007's 76%, but at $202 billion, total value of the units ... EDN Metallization Lines by ASYS Over 8 GW installed Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Visit us at Solar Power International, Booth # 421 or call us today at +1 866 GO 4 ASYS … ASYS Group Americas Inc. Technology News   New Silicon Run Film, MEMS: Making Micro Machines, Provides Inside Look at MEMS Manufacturing Filmmaker Ruth Carranza has done more to document semiconductor and computer manufacturing than almost anyone in the business. With a ... Centre Daily Times New solar airplane unveiled in Switzerland After a six-year effort, the prototype of a new solar-powered aircraft was unveiled at a Swiss airfield on Friday by its future pilots and ... CNet News Memcon panel explores readiness of DDR3 Chips are shipping, but questions remain about the ramp of the new DRAM standard. DDR3 DRAM is upon us, whether or not we—and it—are entirely ... EDN PacTech's Ultra-SB2 WLR Volume Solder Ball Placement Wafer level solder ball rework system for 6- to 12-inch wafers and substrates with solder ball sizes down to 60µm for flip-chip WLSCP applications. Integrated 2D-Inspection and reflow. Learn more … PacTech Corporate News Submit Christopher Assoc. to introduce automated photovoltaic module soldering technology at Intersolar Christopher Associates Inc. will introduce the XE-1000 Series robotic soldering systems for attaching tabbing and bus ribbon to crystalline ... Christopher Associates Inc. Today's Sponsor New Fully Automatic Heavy Wire Bonder Increases Productivity by 30% Process aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more… Hesse & Knipps, Inc. Microelectronics & Semiconductor Package AOI with Flexible Material Handling MVP's Ultra 850G platform provides 2D & 3D metrology capabilities for backend semiconductor & microelectronics devices to 1µm resolution. Tray, Strip, In-Line, Magazine and custom handling solutions are available for any module or package style. Learn more… Machine Vision Products, Inc. 5 Micron Placement Capable! Small Footprint, Low Cost The new ONYX500 Benchtop is the ultimate precision, multifunctional system with a wide range of applications including MEMS with automatic pick, place, dispense and assembly. Learn more… Air-Vac Engineering Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2009 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.