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  Micro Dispensing Technology
Technical white paper
imageThe trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. These requirements often call for tiny dot sizes of paste, epoxy & conductive adhesives. Learn more from this paper…
DL Technology
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PacTech's PacLine 300
Electroless Ni Plating System
PacTech's PacLine 300Mass-production solutions for 4- to 12-inch wafers at 150 wafers/hour. Ni/Au, Ni/Pd and Ni/Pd/Au plating for Flip-Chip UBM or top metal finish for wirebond or power device clip attach. Learn more…
PacTech




Ultra Precision Micro Assembly
and High Performance Dispensing
Air-Vac DRS24Unique Benchtop or Cell Systems with flexible design, can be configured to your specific application requirements, learn more…
Air-Vac Engineering
  Corporate News Index
June 30, 2009

Christopher Assoc. to introduce automated photovoltaic module soldering technology at Intersolar

Christopher Associates Inc. will introduce the XE-1000 Series robotic soldering systems for attaching tabbing and bus ribbon to crystalline silicon, amorphous silicon, CIGS, and CdTe solar cells at Intersolar North America at Booth 8053 from July 14-16, 2009.

The XE-1000 uses production proven technology and automates the soldering process to reduces labor substantially while improving the reliability of the interconnect and improving module efficiency.

Programmable control allows for exact, repeatable soldering over a wide range of format sizes. The system can be used for either tin/lead or lead free applications.

Contact:
Christopher Associates Inc.

Michael Moreau
http://www.christopherweb.com

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June 30, 2009
Christopher Assoc. to introduce automated photovoltaic module soldering technology at Intersolar
Christopher Associates Inc. will introduce the XE-1000 Series robotic soldering systems for attaching tabbing and bus ribbon to crystalline ...
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