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  White Paper: Photo Resist coating
Precision coating with Ultraspray Technology
Photo Resist WPOutlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper…
Ultrasonic Systems, Inc.
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PacTech's LAPLACE
Laser Flip-Chip Bonder
PacTech's LAPLACEStress-free laser reflow and high speed assembly with an accuracy down to ±2µm - ideal for RFID, capacitor attach, high-accuracy flip-chip bonding, 3D probe card bonding. Learn more…
PacTech




3 µm Automated Optical Inspection
The REVEAL MEMS Series
5K/7K SeriesProvide solutions for the Semiconductor industry with high reliability automated inspection capabilities at production speeds. These in-line inspection machines for MEMS packaging processes increase yield & reduce manufacturing costs. Learn more…
Vi TECHNOLOGY
  Industry and Technology News Index
June 30, 2009  -  Click the title to read the full article.

New solar airplane unveiled in Switzerland
After a six-year effort, the prototype of a new solar-powered aircraft was unveiled at a Swiss airfield on Friday by its future pilots and ...
CNet News
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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




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