We search for industry news, so you don't need to.   Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map Down to 2 µm Automated Optical Inspection The REVEAL IMAGER Series Provide solutions for CMOS Image Sensors inspection in Back-End of the Line environments allow to decrease Camera Modules assembly costs with flexible and automated equipment, in- or off-line before lens module attachment. Learn more… Vi TECHNOLOGY Viscom's new wafer inspection system High accuracy inspection of bare wafers & MEMS Viscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects… Viscom Inc.   Industry and Technology News Index June 30, 2009  -  Click the title to read the full article. Silicon Labs' new TV chip could double company's revenue in five years Deep inside even the latest and greatest flat-screen television sets resides an electronic anachronism. In the industry, it's known as the ... Austin-American Statesman We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Austin-American Statesman June 30, 2009 - Industry News Silicon Labs' new TV chip could double company's revenue in five years Deep inside even the latest and greatest flat-screen television sets resides an electronic anachronism. In the industry, it's known as the ... Austin-American Statesman To find more articles from Austin-American Statesman, use the search form below. Online Auction of Qimonda Portugal Back-End Equipment A large selection of Wafer Testers, Dicers, Die & Wire Bonders, Burn-in Ovens and more will be sold by Online Auction closing 04 August 2010 from Europe's largest Memory Chips Assembly & Test facility. Bid now… GoIndustry DoveBid Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2009 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.