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  mBGA Flux deposition
with ultrasonic coating technology
mBGAUSI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more...
Ultrasonic Systems, Inc.
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Down to 2 µm Automated Optical Inspection
The REVEAL IMAGER Series
5K/7K SeriesProvide solutions for CMOS Image Sensors inspection in Back-End of the Line environments allow to decrease Camera Modules assembly costs with flexible and automated equipment, in- or off-line before lens module attachment. Learn more…
Vi TECHNOLOGY




Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.
  Industry and Technology News Index
June 30, 2009  -  Click the title to read the full article.

IDT Completes Acquisition of Tundra Semiconductor
IDT® announced the closing of its acquisition of all of the shares of Tundra® Semiconductor Corporation for aggregate cash consideration ...
EarthTimes
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May 13, 2010 - Industry News
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Tango Systems, Inc. has joined the Micro-Electro-Mechanical-Systems (MEMS) Consortium launched by The Institute of Microelectronics (IME) ...
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August 10, 2009 - Industry News
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July 22, 2009 - Industry News
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Taiwan, the world's second-largest computer chip maker, unveiled guidelines for upgrading its chip industry by offering incentives to ...
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June 30, 2009 - Industry News
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IDT® announced the closing of its acquisition of all of the shares of Tundra® Semiconductor Corporation for aggregate cash consideration ...
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June 18, 2009 - Technology News
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June 2, 2009 - Industry News
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May 13, 2009 - Industry News
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April 21, 2009 - Technology News
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April 21, 2009 - Industry News
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Rudolph Technologies, Inc. (NASDAQ: RTEC) and SEMATECH, the global consortium of leading chipmakers, announced today that Rudolph has ...
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January 27, 2009 - Industry News
International Research Effort for Interconnect and Packaging to Slash Chip Footprint by 10X
Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductors and related technologies, today ...
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November 25, 2008 - Technology News
The First Domestic Built 130-Nanometer Microchip Photomask Cleaning Equipment Developed in China
China's Changzhou National Hi-tech District announced that the first domestic built 130-nanometer microchip photomask cleaning equipment ...
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November 19, 2008 - Industry News
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October 29, 2008 - Industry News
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June 6, 2008 - Industry News
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May 30, 2008 - Industry News
World Renowned MEMS, Nano and Semiconductor Technology Leaders Join WiSpry's Technical Advisory Board
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April 24, 2008 - Industry News
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Tan Lay Koon, President and Chief Executive Officer of STATS ChipPAC, said, "Revenue for the first quarter of 2008 of $427.2 million ...
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January 23, 2008 - Industry News
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December 14, 2007 - Industry News
Atheros Communications Acquires u-Nav Microelectronics
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December 4, 2007 - Technology News
Mechanical fatigue seen in bulk silicon
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November 29, 2007 - Technology News
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Mattson Technology, Inc. , a leading supplier of advanced process equipment used to manufacture semiconductors, today announced ...
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November 13, 2007 - Industry News
FlipChip International Announces Expansion of DSD Fab to 3 Million Die Weekly Capacity
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October 3, 2007 - Technology News
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September 26, 2007 - Technology News
GDA Technologies Announces Availability of HiGig IP
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September 20, 2007 - Technology News
TI Introduces 2.4 GHz and Sub-1 GHz RF System-on-Chip Solutions for Low-Power Wireless Applications
Texas Instruments Incorporated (TI) today introduced a pair of radio-frequency (RF) system-on- chip (SoC) solutions designed for low-power ...
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June 29, 2007 - Industry News
World's Largest Event for Semiconductor Memory and Storage Comes to San Jose
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Online Auction of Qimonda Portugal Back-End Equipment
PCD TechnologyA large selection of Wafer Testers, Dicers, Die & Wire Bonders, Burn-in Ovens and more will be sold by Online Auction closing 04 August 2010 from Europe's largest Memory Chips Assembly & Test facility. Bid now…
GoIndustry DoveBid




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