We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers June 29, 2009 Metallization Lines by ASYS Over 8 GW installed Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Visit us at Solar Power International, Booth # 421 or call us today at +1 866 GO 4 ASYS … ASYS Group Americas Inc. PacTech's Ultra-SB2 WLR Volume Solder Ball Placement Wafer level solder ball rework system for 6- to 12-inch wafers and substrates with solder ball sizes down to 60µm for flip-chip WLSCP applications. Integrated 2D-Inspection and reflow. Learn more … PacTech Letters Submit New Fully Automatic Heavy Wire Bonder Increases Productivity by 30% Process aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more… Hesse & Knipps, Inc. Top Story   Collaboration, manufacturing innovation vital for next-generation foundries As IC design, manufacturing costs and complexities continue to increase, collaboration with customers from the earliest stages of technology ... Solid State Technology Advances in Micro-electronics Inspection Provides High Resolution and High UPH, MVP's Ultra 850G platform provides high resolution inspection for backend semiconductor and microelectronics processes. Using 2D/3D inspection techniques, the Ultra 850G provides metrology capabilities for wire bond, die, surface damage, underfill, BGA/Bump and other processes. Learn more… Machine Vision Products, Inc. Industry News   PC Shipments Showing Signs of Recovery, Gartner Says The PC market is showing signs of recovery, with the freefall of PC shipments skidding to a halt thanks to competitive PC prices and a ... PC World Exec: Memory business model is broken The business model in the memory sector is broken, prompting the need for more rational behavior and consolidation in the industry, according to ... EETimes SMSC to outsource test operations Chip vendor SMSC said it plans to outsource some of its production test operations to Asian suppliers. The affected operations are currently ... EETimes Apple Increases Investment In British Chip Designer Apple has been on a chip-design spending spree, buying PA Semi, a vendor of low-power PowerPC processors, and hiring more than 100 people with ... Information Week Robust growth predicted for 193-nm resist The market for 193-nm photoresist is expected to grow at a compound annual rate of 27 percent over the next five years, reaching nearly $1.2 ... EETimes Sematech : Leading Ways to Continue Moore's Law During a presentation on June 26, 2009 chip-making consortium Sematech outlined ways to enable Moore's Law. Sematech also warned about a gap ... Next Big Future Five enablers for future chip scaling IC scaling remains a challenge. To enable chip scaling, there is always brute-force lithography. During a presentation on Friday (June 26), ... EETimes Sematech to set up 'test bed' for TSV production Chip-making consortium Sematech disclosed plans to set up a 300-mm R&D 'test bed' for the production of 3-D devices based on through-silicon-via ... EETimes Big contracts await Hemlock Semiconductor builders Some 400 contracts will be awarded in the construction of Clarksville's Hemlock Semiconductor LLC, ranging in value from the "hundreds of ... Clarksville Leaf Chronicle Advantest reshuffles management amid losses Amid losses and layoffs, ATE giant Advantest Corp. has reshuffled its management ranks. Haruo Matsuno was elected representative director and ... EETimes Foxconn lands AMD-based notebook orders from HP, says paper Foxconn Electronics has recently landed AMD-based 15-inch notebook orders from Hewlett-Packard (HP) and will ship around two million units over ... Digitimes SEH/HP deal sounds hopeful note for regional chip industry SEH's purchase of HP's Vancouver campus is a bright piece of news for the regional chip industry, a group that could really use some cheering ... Oregon Live HTC Changing the Look of All Its Future Smartphones TouchFLO's is HTC's alternate user interface with Windows phones. A new version is coming out soon, but the company is already saying that this ... Brighthand 5 Micron Placement Capable! Small Footprint, Low Cost The new ONYX500 Benchtop is the ultimate precision, multifunctional system with a wide range of applications including MEMS with automatic pick, place, dispense and assembly. Learn more… Air-Vac Engineering Technology News   Microsoft's Steve Ballmer: Traditional media will not bounce back Steve Ballmer, the Microsoft chief executive, said the global advertising economy has been permanently "reset" at a lower level, warning that ... Guardian News and Media Smaller, Faster and More Parasitic Consumers love ever-smaller electronic products that have longer battery life and more features. For the chip developer, these "loves" translate ... Chip Design Magazine Swiss adventurer unveils 'Solar Impulse' - prototype for sun-powered plane Underlining the potential of alternative energy sources, the solar-powered plane 'Solar Impulse' (HB-SIA) unveiled by Swiss adventurer Bertrand ... TopNews United States cyberTECHNOLOGIES extends lead in surface metrology for PV applications Expanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more… cyberTECHNOLOGIES Corporate News Submit 22% more throughput on existing metallization lines ASYS announces the availability of a high speed upgrade kit that allows existing users of ASYS metallization lines to increase throughput by ... ASYS Axus Technology Named as Distributor for Moog's Precision Positioning Products Moog and Axus Technology have signed an expanded distribution agreement that gives Axus responsibility for all OEM and end user support, ... Axus Technology Verigy’s Yield Learning Solution Helps Semiconductor Manufacturers Accelerate Time-to-Market and Maximize Entitlement Yield Verigy introduced its Yield Learning Solution, a comprehensive solution that integrates on-tester, real-time capture and statistical analysis ... Verigy Today's Sponsor 1µ Placement Accuracy TRESKY High Accuracy Bonder Advanced, highly accurate assembly solutions with an easy-to-use platform for micro-electronics assembly. Ideal for Flip-Chip, Thermosonic, MEMS, Optical Components. Learn more… Dr Tresky AG Microliter dispensing made easy with PCD Volumetric dispense valve Unmatched volumetric repeatability at 1microliter volumes. Viscosity from water to thick pastes, the value does not require day to day calibration. PCD controller for worktable or integration to system. Learn more… GPD Global F&K Delvotec introduces World's ONLY Rotary Head Ball Bonder F&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more… F&K Delvotec Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2009 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.