We search for industry news, so you don't need to.
  Lead-Free package level alloys
New White Paper
Full Wafer Die Attach White PaperNot all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications. A new breakthrough package level lead-free alloy addresses board-level alloy challenges. Click to download paper…
Henkel Corporation
Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map

Does your vapor phase reflow
offer guarantees? Ours Does
ATEK Reflow• Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more…
ATEK Systems Group




Jetting Systems Technology
New white paper
Dispensejet DJ-100 Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more…
Nordson ASYMTEK
  Corporate News Index
June 29, 2009

Axus Technology Named as Distributor for Moog's Precision Positioning Products

Axus to Expand Support for Moog's precision positioning products formerly branded as Berkeley Process Control

Chandler, AZ -- Moog and Axus Technology have signed an expanded distribution agreement that gives Axus responsibility for all OEM and end user support, including all sales and service activities, for a range of precision positioning products that Moog acquired via the Berkeley Process Control acquisition in October 2008. The agreement also gives Axus added responsibility for Moog's products installed on SCP wet benches.

"Axus Technology has proven to be an ideal partner for Moog," said Michiel Post van der Molen, Moog's Business Manager responsible for the precision positioning products. "This expanded agreement, including both CMP and wet bench automation products, will continue to capitalize on Axus' semiconductor equipment expertise as well as its worldwide sales and service presence."

"Moog products have demonstrated their superior technology and reliability in semiconductor applications," said Barrie Van Devender, Axus Technology Vice President of Sales and Marketing. "Our increased role in distributing Moog products will allow us to build additional value into the products and services that we provide. This new responsibility is the perfect solution for those customers that have requested product upgrades and improved support."

The above agreement also covers Axus Technology's support of the Moog systems used in the SpeedFam Auriga® product line.

Contact:
Axus Technology


http://www.AxusTech.com

This page has been viewed 104 times.
We search for industry news, so you don't need to.
You would be much better informed if you could read every
important article impacting the semiconductor packaging
market. But you can't spend all day searching for them.


Let us do the searching for you.

Get a Free Subscription to Semiconductor Packaging News

More from Axus Technology
July 27, 2009
Axus Technology Names New European Distributor
During SEMICON West 2009, Axus Technology named the S3 Alliance as its new European distributor. With operations based in Germany, Italy, and ...
Axus Technology
June 29, 2009
Axus Technology Named as Distributor for Moog's Precision Positioning Products
Moog and Axus Technology have signed an expanded distribution agreement that gives Axus responsibility for all OEM and end user support, ...
Axus Technology
April 21, 2009
Axus Technology Expands Foundry and Applications Lab
Axus Technology has expanded its existing CMP, substrate polishing, and wafer grinding services by adding an Applied Materials Mirra CMP tool ...
Axus Technology
To find more corporate news releases from Axus Technology , use the search form below.


PacTech's Low-Cost Wafer Bumping Services
Quick-turn prototyping and mass-production
PacTech's Low-Cost Wafer Bumping ServicesLow-cost electroless Ni/Au UBM, solder stencil or ball attach wafer bumping up to 300mm — Lead-free soldering for flip-chip, WLCSP, Ni/Pd/Au top metal for Au and Cu wire bonding. Learn more…
PacTech




Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News
Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers
Search Category       Search Term   
To search a phrase, place it in quotes.
Semiconductor Packaging News - A Circuitnet Publication
We search for industry news so you don't need to.

Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA
Copyright © 2009 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager


Visit Circuitnet for the latest electronics assembly news and information.