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Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




F&K Delvotec receives two recognitions
VLSI "highest rated wire bonder maker 2009"
Two AwardsVLSI recognized F&K Delvotec with two major awards. Not only did F&K Delvotec make the VLSI's 10 Best List but they also stated "F&K Delvotec, the highest rated wire bonder maker." Learn more…
F&K Delvotec
  Corporate News Index
June 29, 2009

22% more throughput on existing metallization lines

Atlanta, GA – ASYS announces the availability of a high speed upgrade kit that allows existing users of ASYS metallization lines to increase throughput by up to 22%

ASYS, a leading provider of metallization lines for the Solar Industry, is now offering its customers a line upgrade, that will increase the capacity by up to 22%. The upgrade kit, consisting of hardward and software changes, can be installed in only 3 days. Single lane users will see their capacity increase from approx. 1,200 cph to 1,440 cells per hour and for dual lane users the throughput will jump from approx. 2,200 cph to 2,700 cph.

For a lot of customers operating multiple ASYS lines this will have another huge advantage: upgrading multiple lines might allow them to postpone or cancel the investment for a new metallization line, which translates to big cost savings per Watt due to reduced operator count, capital invest, floorspace and utilities thus making them more competitive in the market.

The upgrade kits are available immediately for most existing ASYS lines.

Contact:
ASYS

Markus Wilkens
http://www.asys-group.com

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October 26, 2009
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Thermally Conductive Underfill Epoxy
Features 5–10 Minute Cure
Ultra-fast UV Curing Glob TopEP3RR-1 thermally conductive epoxy has excellent toughness. A one part epoxy, requiring oven curing at 250°–300°F, it is used in electronic packaging. Excellent flow, temperature range to 400°F. For more information…
Master Bond




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