September 2, 2009 - Technology News
Going green gives new life to reclaimed silicon
ATMI latest "green" product, RegenSi 74, released at SEMICON West, is an improved and more environmentally friendly extension of its advanced ...
Solid State Technology
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September 2, 2009 - Industry News
Semiconductor Survivor Awards
These are difficult times for the semiconductor industry. Many would say the most difficult ever. Earlier this year, we announced a contest in ...
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September 2, 2009 - Industry News
The end of innovation? Not possible.
Things are looking up for chipmakers. The top 20 semiconductor suppliers saw their sales surge 21% in 2Q09 from the prior quarter, and a 37 point ...
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September 1, 2009 - Technology News
Commercializing a WLCSP passivation layer solution
Russell Stapleton, senior staff scientist at Lord Corp., gave SST a summary of his Aug. 26 presentation at the Arizona chapter of IMAPS ...
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August 27, 2009 - Technology News
Crystalline Si solar cells and the microelectronics experience
A thin c-Si solar cell roadmap is expected to be instrumental for facilitating open innovation collaboration models, based on sharing of ...
Solid State Technology
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August 21, 2009 - Technology News
Double-patterning design challenges
Double-patterning (DP) is a method for breaking up a layout so that sub-resolution configurations are separated between two distinct masks. ...
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August 10, 2009 - Technology News
New SRP metrology system eyes small/mid-tier sweetspot
Semilab SSM, a division of Semilab, announced at SEMICON West the SRP Express 170, a new member of its NanoSRP family of metrology products. ...
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August 5, 2009 - Technology News
Nemotek Technologie Announces Availability of Ultra-Small Wafer-Level Packaging Solutions
Nemotek Technologie, a manufacturer of customized Wafer-Level Cameras for portable applications, today announced the availability of its ...
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July 30, 2009 - Industry News
Progress in open-architecture 3D/TSV
Hans Stork, Group VP & CTO at Applied Materials discusses the progress being made in developing cost-effective 3D/TSV solutions. ...
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July 29, 2009 - Industry News
Semitool's Fiscal Third Quarter Results Include 33% Sequential Improvement in Bookings
Semitool, Inc. reported financial financial results for its third fiscal quarter ended June 30. Third quarter revenue was up in this year's ...
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July 17, 2009 - Technology News
Stepping up to the 3D challenge
There is a major push with respect to 3D technology; Soitec is focusing on wafer-wafer integration and 3D packaging with its core technologies of ...
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July 16, 2009 - Technology News
Future bright for 3D consortium
Paul Siblerud of Semitool discusses 3D integration challenges and announces the latest news from the EMC-3D Consortium. The purpose of ...
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July 15, 2009 - Industry News
VLSI: Chip industry finally above parity
After nearly a year in the red, semiconductor equipment manufacturers finally broke back above the "parity" mark for bookings vs. billings an ...
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July 15, 2009 - Industry News
KLA-Tencor lines up trio of 3X-2X inspection systems
KLA-Tencor has taken the wraps off three new tools for defect wafer inspection and review: the 2830, the Puma 9500, and eDR-5210. ...
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July 9, 2009 - Technology News
Reliability of PoP devices manufactured using underfill methods
Though many studies have investigated the board-level reliability of package-on-package (PoP) devices in relation to drop test and thermal ...
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July 8, 2009 - Industry News
Nanotech and the Semiconductor Industry: Will Packaging Be Early Adopter?
The semiconductor industry’s position on nanotechnology has been interesting to observe over the last decade. The industry has not only ...
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July 8, 2009 - Industry News
Reliability of PoP devices manufactured using underfill methods
Though many studies have investigated the board-level reliability of package-on-package (PoP) devices in relation to drop test and thermal ...
Solid State Technology
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July 8, 2009 - Industry News
Gartner cancels doom alarm for chip sales, returns to gloom
The semiconductor industry seems to have avoided a worst-case scenario of a record sales dropoff in 2009, according to recently updated analysis ...
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July 7, 2009 - Technology News
Solid State Technology - semiconductors, chips, integrated circuits
Magma Partners With Orion Metrology to Improve Manufacturing Yields, Product Efficiency of Photovoltaic Solar Panels; Magma Expands Analysis ...
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June 30, 2009 - Industry News
Alchimer's new TSV process: When less really is more
Alchimer recently announced it had enhanced its eG ViaCoat process -- a wet deposition process for the copper seed metallization of through-silicon ...
Solid State Technology
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June 29, 2009 - Top Story News
Collaboration, manufacturing innovation vital for next-generation foundries
As IC design, manufacturing costs and complexities continue to increase, collaboration with customers from the earliest stages of technology ...
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June 22, 2009 - Industry News
Intel Research Day: Update on EUV, other projects
Research at Intel Labs covered at the chipmaker's annual event covered the major categories of eco-innovation, 3D graphics on the Internet, mobility ...
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June 19, 2009 - Industry News
Many LED patents set to expire in 2010
Research and Markets has announced the addition of the "Research Report of Global and Chinese Light-Emitting Diode Industry, 2009" report to ...
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June 18, 2009 - Industry News
Thin films for 3D: ALD for non-planar topographies
Extreme and non-planar substrate topographies that provide challenges for conventional thin film deposition techniques are abundant. Such ...
Solid State Technology
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June 17, 2009 - Industry News
Buckle up for double-digit growth again
It's increasingly clear that 2009 will be a tough year for the semiconductor industry, but if historic trends hold up we can expect ...
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