December 27, 2011 - Industry News
Apple Buying Anobit as it Builds IP Portfolio
Like most OEMs, Apple Inc. over the years procured its chips from outside sources. But more recently, Apple has become a major designer of chips ...
Chip Design Magazine
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December 20, 2011 - Industry News
Green Mould Compounds Can Be Sickening Your Design
The ongoing replacement of the mould compounds of plastic packaged IC components by green mould compounds significantly endangers the solder ...
Chip Design Magazine
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December 19, 2011 - Industry News
FPGA Giants See Supply Chain and Power Issues in 3D
The two major FPGA houses -- Altera Corp. and Xilinx Inc. -- are bitter rivals in the market. Altera and Xilinx have different design philosophies and ...
Chip Design Magazine
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December 14, 2011 - Industry News
Silicon Foundries to Expand into MEMS Business
The microelectromechanical systems (MEMS) foundry business is a paradox that is up for grabs -- and ripe for consolidation. For some time, the MEMS ...
Chip Design Magazine
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December 1, 2011 - Industry News
Synopsys To Buy Magma
Synopsys signed a definitive agreement to buy Magma Design Automation for $507 million, or $7.35 per Magma share, strengthening its hand in both the analog ...
Chip Design Magazine
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November 21, 2011 - Industry News
Leading-edge Foundries to Enter Interposer Fray
The IC industry is entering the 2.5D era, but not all chip makers can participate in the arena. There is still a lack of suppliers that can ...
Chip Design Magazine
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October 7, 2011 - Top Story News
Performance Plus Lower Power
A new race is beginning in the SoC world. While performance has been supplanted by battery life as the top goal for the next process node, that prioritization isn't going ...
Chip Design Magazine
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September 23, 2011 - Industry News
Finer Control, Same Ideas
Famed lawyer Clarence Darrow once said, "History repeats itself, and that's one of the things wrong with history." While that basic theme has been ...
Chip Design Magazine
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August 29, 2011 - Top Story News
The 3D Power Factor
In the move to stacked die, one of the biggest issues is power. While chips using leading-edge processes already address this issue effectively through a variety of advanced ...
Chip Design Magazine
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August 9, 2011 - Industry News
GSA: The Next Phase
In 1994, the Global Semiconductor Alliance (GSA) was founded as the Fabless Semiconductor Association. Its purpose was to establish the viability ...
Chip Design Magazine
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July 29, 2011 - Industry News
Stacks And Stacks
Talking about stacked die is sort of like describing Africa as a country. First of all, it's wrong--despite some politicians' statements to the ...
Chip Design Magazine
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June 17, 2011 - Industry News
Need To Know Basis
There's a great and often over-used line out of movie scripts when the hero stumbles upon something that doesn't make sense and he's told, "That's ...
Chip Design Magazine
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May 26, 2011 - Industry News
Why Did My Design Fail Verification, Dude?
The tremendous growth of the semiconductor industry over the past 40 years is in part attributed to advancements of the EDA industry that ...
Chip Design Magazine
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April 18, 2011 - Industry News
R&D Focuses on Low Power and Stacked Die
Atrenta collaborated with the French laboratory CEA/LETI in a research and development effort to advance power reduction and 3D stacked die ...
Chip Design Magazine
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April 11, 2011 - Industry News
Behind The Analog Frenzy
Analog is suddenly very hot again, and much of it appears to be due to the promise of 2.5D and 3D stacking. Texas Instruments pulled out its ...
Chip Design Magazine
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April 11, 2011 - Industry News
Listening First For Effective Collaboration
It has been awhile since my last blog, as I have been "touring" across numerous countries in Asia, Europe, and the U.S. This annual "tour" of ...
Chip Design Magazine
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March 21, 2011 - Industry News
The Great Unknowns
Across the semiconductor industry--as well as many other end-product industries--there have been some well-documented and sober assessments ...
Chip Design Magazine
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March 18, 2011 - Industry News
Regenerative Economics
Emulation, which has been used for developing low-power chips, is now being viewed by large chipmakers at as a way of reducing costs in simulation ...
Chip Design Magazine
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February 25, 2011 - Industry News
The New Multicore Approach
It's probably too harsh to say that multicore has been a failure, but it's flat-out wrong to say it has been successful. Multicore was an ...
Chip Design Magazine
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February 25, 2011 - Industry News
STATS ChipPAC Enhances Flip Chip Packaging
STATS ChipPAC Ltd. launched the innovative fcCuBE technology, an advanced flip chip packaging technology that features copper (Cu) column bumps ...
Chip Design Magazine
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January 28, 2011 - Industry News
Deja Vu All Over Again
Every now and then you get the feeling you've been here before, and with technology this is a persistent theme. Virtualization looks remarkably ...
Chip Design Magazine
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January 20, 2011 - Industry News
Power Model Complexity Grows
The number of factors required for an effective power model has far surpassed the capabilities of even the most detailed spreadsheet at ...
Chip Design Magazine
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July 19, 2010 - Industry News
Semiconductor Equipment Vendor Sees Growth in 32nm and Below
Consumer markets are driving the need to high-k metal gate technology, through-silicon vias (TSVs) and advance packaging systems. ...
Chip Design Magazine
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May 6, 2010 - Industry News
MEMS Is Poised to Cross the Chasm
Microelectromechanical systems (MEMS) are micro-scale or nano-scale devices. Typically, they’re fabricated in a manner similar to integrated ...
Chip Design Magazine
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April 5, 2010 - Industry News
EDA Consortium Reports Sequential Fourth Quarter Gains
The EDA Consortium Market Statistics Service announced that the Electronic Design Automation industry revenue for Q4 was up 8.1% sequential ...
Chip Design Magazine
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