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  White Paper: Photo Resist coating
Precision coating with Ultraspray Technology
Photo Resist WPOutlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper…
Ultrasonic Systems, Inc.
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PacTech's PacLine 300
Electroless Ni Plating System
PacTech's PacLine 300Mass-production solutions for 4- to 12-inch wafers at 150 wafers/hour. Ni/Au, Ni/Pd and Ni/Pd/Au plating for Flip-Chip UBM or top metal finish for wirebond or power device clip attach. Learn more…
PacTech




3 µm Automated Optical Inspection
The REVEAL MEMS Series
5K/7K SeriesProvide solutions for the Semiconductor industry with high reliability automated inspection capabilities at production speeds. These in-line inspection machines for MEMS packaging processes increase yield & reduce manufacturing costs. Learn more…
Vi TECHNOLOGY
  Industry and Technology News Index
June 29, 2009  -  Click the title to read the full article.

Apple Increases Investment In British Chip Designer
Apple has been on a chip-design spending spree, buying PA Semi, a vendor of low-power PowerPC processors, and hiring more than 100 people with ...
Information Week
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July 30, 2010 - Industry News
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July 29, 2010 - Industry News
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March 16, 2010 - Technology News
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August 20, 2009 - Industry News
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June 29, 2009 - Industry News
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March 27, 2009 - Technology News
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December 10, 2008 - Technology News
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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




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