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June 26, 2009


PCD Technology Improves Dispensing
PCD TechnologyVolumetric dispensing improves throughput and dispense quality. PCD technology is compatible with a wide range of viscosities from water to thick pastes. Increase throughput 2–4 times with this new technology, learn more…
GPD Global

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F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
F&K Delvotec
Letters Submit

MEPTEC/SMTA Presents
2010 Medical Electronics Symposium
Medical Electronics SymposiumJoin MEPTEC & SMTA on September 22-23, 2010, at Arizona State University for Successful Strategies for the Medical Electronics Sector: Steady Growth Keeps the Momentum Moving Forward. Learn more…
MEPTEC
Top Story  
Semiconductor Equipment Market Bogged Down By Used Equipment
Rises in the book-to-bill ratio by North American and Japanese semiconductor equipment manufacturers is giving hope that the downturn ...
Seeking Alpha

Metallization Lines by ASYS
Metallization LinesOver 8 GW installed
Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Visit us at Solar Power International, Booth # 421 or call us today at +1 866 GO 4 ASYS …
ASYS Group Americas Inc.
Industry News  
Intel/Foxconn alliance could cripple Asus
An interesting chess game seems to be taking place between Intel and motherboard makers, with speculation that Intel will be handing over the ...
The Inquirer
Micron earnings beat view but revenues disappoint
Micron Technology Inc reported lower-than-expected revenues as part of its 10th straight quarterly loss and shares of the top U.S. maker of ...
Reuters
Qualcomm guns for Intel
Telco Chip supremo Qualcomm wants a slice of the portable computing market, so expect handbags at dawn with Chipzilla. Qualcomm, which made ...
The Inquirer
Competition intensifies in MEMS foundry market
At least 50 companies are now playing in the MEMS foundry market, a highly fragmented and competitive segment that has become critical to the MEMS ...
EETimes
Singapore's IME, Bell Labs boost silicon photonics
Alcatel-Lucent Bell Labs and Singapore's Institute of Microelectronics (IME) have forged a collaboration to develop advanced photonics technology ...
EETimes Asia
NAND flash contract prices to turn soft in July, says DRAMeXchange
Contract prices for mainstream 8Gb and 16Gb MLC NAND flash chips have stayed flat at an average of US$3.52 and US$4.06, respectively, in the ...
Digitimes
In An Evolving Market, Femtocell Manufacturers Need To Stay Flexible
The goal of wireless operators is to provide full mobility and seamless roaming to ensure permanent access to broadband connectivity for the ...
Mobile Dev & Design
Novellus Rated a Top Semiconductor Equipment Supplier by VLSI Research
As testimony to the company's ongoing commitment to customer satisfaction, Novellus Systems (Nasdaq: NVLS) announced today that it has been ...
ZIBB
Amkor Technology Up 66.2% Since SmarTrend's Buy Recommendation
SmarTrend, our proprietary pattern recognition system, called an Uptrend for Amkor Technology Inc. Since then, Amkor Technology has returned ...
FOX Business

PacTech's SB2-Jet
Laser Solder Jetting System
PacTech's SB2Sequential high speed soldering using laser-reflow with high substrate design and solder ball size flexibility. Fluxless, contactless at low thermal stress—ideal for flip-chip, MEMS, 3D-packaging and CSP/BGA's re-balling. Learn more…
PacTech
Technology News  
Is 1-Gbit phase-change memory schedule slipping?
Is nonvolatile memory supplier Numonyx BV set to miss its previous timetable for the introduction of a 1-Gbit phase-change memory implemented ...
EETimes
Avnet's Jeff Ittel: Think board to go broad
Avnet's Jeff Ittel discusses designing across the board and its benefits to distributors and engineers. Jeff Ittel serves as senior vice president ...
EDN
Tool bundles target FPGAs
Xilinx this year introduced two families of Virtex-6 and Spartan-6 FPGAs that enable targeted-design platforms. The company is now adding ...
EDN
Little-known flash-memory features protect data and IP
Features from block locking to encrypted-password-access mechanisms can prevent unintentional disruption, malicious damage, or copying. ...
EDN
Decoding Battery Life for Laptops
Oh, and also laptop battery-life benchmarks. Two things about battery-life measurements for laptops: First, they usually bear little relationship ...
New York Times
ON Semiconductor Introduces 10 A Supercapacitor-Based LED Flash Driver
The new NCP5680 is an integrated LED flash and power management solution offered in a 0.55 mm low-profile package that extends battery life and ...
ON Semiconductor
Diagnostic ultrasound gets smaller, faster, and more useful
The signal path in ultrasound machines is a multichannel transmitter-receiver system with blazingly fast data rates. Engineers need to ...
EDN
MEMSIC uncrates tri-axis magnetic sensor
MEMSIC, Inc. announced the release of its new Tri-Axis Magnetic Sensor, the MMC3120XM, which will enable the integration of digital compass ...
Small Times
ATI and Nvidia have troubling 40nm yields from TSMC
Two articles have appeared recently citing sub-30% yields from TSMC’s 40nm process technology. This has the potential to impact you and I, the ...
Geek

Exceeding Productivity Demands
for Heavy Wire Bonding
PiQCNew white paper focuses on the cycle time for wedge bonding. To achieve an increase in productivity, each element of the wire bonding equipment in relation to optimizing the wire bonding process must be questioned. Learn more…
Hesse & Knipps, Inc.

Corporate News Submit
Virtual Industries to Exhibit Advanced Equipment at SEMICON West
Virtual Industries Inc. announces that it will display several advanced systems in booth 817 at the upcoming SEMICON West exhibition, scheduled ...
Virtual Industries Inc.
Dassault Systemes Launches V6R2010
Dassault Systèmes (DS) launched V6R2010, the latest release of its new platform. Today’s announcement introduces 42 new V6 products supporting ...
Dassault Systemes
Applied Materials, Dainippon Screen Revise Ownership Structure of Sokudo
Applied Materials, Inc. and Dainippon Screen Mfg. Co. Ltd. announced that they have signed an agreement to revise the ownership structure ...
Applied Materials
Today's Sponsor

Microelectronics & Semiconductor Package
AOI with Flexible Material Handling
Machine Vision ProductsMVP's Ultra 850G platform provides 2D & 3D metrology capabilities for backend semiconductor & microelectronics devices to 1µm resolution. Tray, Strip, In-Line, Magazine and custom handling solutions are available for any module or package style. Learn more…
Machine Vision Products, Inc.

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Ultra Precision Micro Assembly
and High Performance Dispensing
Air-Vac DRS24Unique Benchtop or Cell Systems with flexible design, can be configured to your specific application requirements, learn more…
Air-Vac Engineering

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cyberTECHNOLOGIES extends lead in surface metrology for PV applications
Track JobExpanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more…
cyberTECHNOLOGIES


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