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Metallization Lines by ASYS
 Over 8 GW installed
Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Visit us at Solar Power International, Booth # 421 or call us today at +1 866 GO 4 ASYS …
ASYS Group Americas Inc.
Intel/Foxconn alliance could cripple Asus
An interesting chess game seems to be taking place between Intel and motherboard makers, with speculation that Intel will be handing over the ...
The Inquirer
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Micron earnings beat view but revenues disappoint
Micron Technology Inc reported lower-than-expected revenues as part of its 10th straight quarterly loss and shares of the top U.S. maker of ...
Reuters
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Qualcomm guns for Intel
Telco Chip supremo Qualcomm wants a slice of the portable computing market, so expect handbags at dawn with Chipzilla. Qualcomm, which made ...
The Inquirer
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Competition intensifies in MEMS foundry market
At least 50 companies are now playing in the MEMS foundry market, a highly fragmented and competitive segment that has become critical to the MEMS ...
EETimes
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Singapore's IME, Bell Labs boost silicon photonics
Alcatel-Lucent Bell Labs and Singapore's Institute of Microelectronics (IME) have forged a collaboration to develop advanced photonics technology ...
EETimes Asia
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NAND flash contract prices to turn soft in July, says DRAMeXchange
Contract prices for mainstream 8Gb and 16Gb MLC NAND flash chips have stayed flat at an average of US$3.52 and US$4.06, respectively, in the ...
Digitimes
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In An Evolving Market, Femtocell Manufacturers Need To Stay Flexible
The goal of wireless operators is to provide full mobility and seamless roaming to ensure permanent access to broadband connectivity for the ...
Mobile Dev & Design
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Novellus Rated a Top Semiconductor Equipment Supplier by VLSI Research
As testimony to the company's ongoing commitment to customer satisfaction, Novellus Systems (Nasdaq: NVLS) announced today that it has been ...
ZIBB
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Amkor Technology Up 66.2% Since SmarTrend's Buy Recommendation
SmarTrend, our proprietary pattern recognition system, called an Uptrend for Amkor Technology Inc. Since then, Amkor Technology has returned ...
FOX Business
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PacTech's SB2-Jet
Laser Solder Jetting System
 Sequential high speed soldering using laser-reflow with high substrate design and solder ball size flexibility. Fluxless, contactless at low thermal stress—ideal for flip-chip, MEMS, 3D-packaging and CSP/BGA's re-balling. Learn more…
PacTech
Is 1-Gbit phase-change memory schedule slipping?
Is nonvolatile memory supplier Numonyx BV set to miss its previous timetable for the introduction of a 1-Gbit phase-change memory implemented ...
EETimes
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Avnet's Jeff Ittel: Think board to go broad
Avnet's Jeff Ittel discusses designing across the board and its benefits to distributors and engineers. Jeff Ittel serves as senior vice president ...
EDN
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Tool bundles target FPGAs
Xilinx this year introduced two families of Virtex-6 and Spartan-6 FPGAs that enable targeted-design platforms. The company is now adding ...
EDN
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Little-known flash-memory features protect data and IP
Features from block locking to encrypted-password-access mechanisms can prevent unintentional disruption, malicious damage, or copying. ...
EDN
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Decoding Battery Life for Laptops
Oh, and also laptop battery-life benchmarks. Two things about battery-life measurements for laptops: First, they usually bear little relationship ...
New York Times
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ON Semiconductor Introduces 10 A Supercapacitor-Based LED Flash Driver
The new NCP5680 is an integrated LED flash and power management solution offered in a 0.55 mm low-profile package that extends battery life and ...
ON Semiconductor
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Diagnostic ultrasound gets smaller, faster, and more useful
The signal path in ultrasound machines is a multichannel transmitter-receiver system with blazingly fast data rates. Engineers need to ...
EDN
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MEMSIC uncrates tri-axis magnetic sensor
MEMSIC, Inc. announced the release of its new Tri-Axis Magnetic Sensor, the MMC3120XM, which will enable the integration of digital compass ...
Small Times
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ATI and Nvidia have troubling 40nm yields from TSMC
Two articles have appeared recently citing sub-30% yields from TSMC’s 40nm process technology. This has the potential to impact you and I, the ...
Geek
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Exceeding Productivity Demands
for Heavy Wire Bonding
 New white paper focuses on the cycle time for wedge bonding. To achieve an increase in productivity, each element of the wire bonding equipment in relation to optimizing the wire bonding process must be questioned. Learn more…
Hesse & Knipps, Inc.
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