We search for industry news, so you don't need to.   New Photovoltaic Coating System Precision coating of solar wafers To apply a thin, uniform layer of phosphoric acid or phosphoric oxide based dopants and other proprietary coatings for the production of solar cells, USI has Technology for every application. Learn more… Ultrasonic Systems, Inc. Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map Preventing Solar Cell Micro Cracks Solar Soldering Application Note Stringing and bussing soldering can cause thermal stress and micro cracking of solar cells. A process to prevent damage and produce 1-2µm inter-metallic bonds between ribbon and cells must be identified & maintained. Learn more… OK International Exceeding Productivity Demands for Heavy Wire Bonding New white paper focuses on the cycle time for wedge bonding. To achieve an increase in productivity, each element of the wire bonding equipment in relation to optimizing the wire bonding process must be questioned. Learn more… Hesse & Knipps, Inc.   Corporate News Index June 26, 2009  -  Click the title to read the full article. Applied Materials, Dainippon Screen Revise Ownership Structure of Sokudo Applied Materials, Inc. and Dainippon Screen Mfg. Co. Ltd. announced that they have signed an agreement to revise the ownership structure ... Applied Materials This page has been viewed 70 times. We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Applied Materials July 27, 2010 Applied Materials Restructures Energy and Environmental Solutions Applied Materials, Inc. announced plans to restructure its Energy and Environmental Solutions (EES) segment to put a primary emphasis on ... Applied Materials July 19, 2010 Applied Materials Celebrates 20-Year Success of Endura System Applied Materials, Inc. celebrates the 20th year of its Applied Endura® platform, the most successful metallization system in the history of ... Applied Materials July 16, 2010 NXP and Applied Materials Sign Comprehensive Service Contract Applied Materials, Inc. announced that it has signed a comprehensive, five-year contract to service all Applied Materials chip production ... Applied Materials July 15, 2010 Applied Materials to Highlight Innovations for Enabling Future Electronic Devices Applied Materials, Inc. will showcase its leadership and innovation for producing future generations of microchips and clean energy solutions ... Applied Materials July 14, 2010 Applied Materials Leads the Way to Enable TSV Interconnects for 3D Chip Stacking Applied Materials, Inc. is leading the next technology inflection to advance through-silicon via (TSV) technology for high-volume manufacturing ... Applied Materials July 13, 2010 Applied Materials Sees Record Adoption of New AdvantEdge Silicon Etch Technology Applied Materials, Inc. unveiled its new Applied Centura® AdvantEdge™ Mesa™ system for creating nano-scale circuit features with angstrom-level ... Applied Materials June 23, 2010 Survey Shows Consumers Want More Solar Energy A new survey conducted by Applied Materials, Inc. reveals that two-thirds of Americans believe solar technology should play a greater role in ... Applied Materials June 1, 2010 Applied Materials and CECEP to Collaborate on Advancing Solar PV Applied Materials, Inc. and China Energy Conservation and Environmental Protection Group (CECEP) announced that they have signed a memorandum of ... Applied Materials May 25, 2010 Applied Introduces Automation for Solar, LED, Chip Pkg Factories Applied Materials, Inc. launched its Applied SmartFactory software – an affordable, out-of-the-box, factory automation solution to track and ... Applied Materials May 6, 2010 Applied Materials Sees Strong Demand for Esatto Double Print Technology Applied Materials, Inc. announced at the SNEC 2010 PV Power Expo* that its Esatto Technology™ is expected to be used in more than 2 gigawatts ... Applied Materials April 15, 2010 Applied Opens Global Hub in Singapore for Mfg Semi Equipment Applied Materials, Inc. opened its new Singapore Operations Center, Applied’s first facility in Asia for manufacturing its advanced ... Applied Materials April 1, 2010 Applied Materials Enables Defect Inspection at 22nm and Below Applied Materials, Inc. unveiled its Applied UVision® 4 wafer inspection system, enabling chipmakers to detect yield-limiting defects in the ... Applied Materials March 31, 2010 Applied Materials Introduces Critical Via Liner Technology Applied Materials, Inc. added to its extensive line of 3D chip packaging solutions with the launch of its Applied Producer® InVia™ dielectric ... Applied Materials March 30, 2010 Applied Materials Extends Epi Leadership with Innovative Technology Applied Materials, Inc. announced the semiconductor industry's first integrated low temperature pre-clean for epitaxial (epi) applications ... Applied Materials March 12, 2010 Applied Materials Expands Display, Solar Equipment Mfg Capability Applied Materials, Inc. announced the opening of its newly expanded Tainan Manufacturing Center in Tainan, Taiwan. The nearly 15,000 square ... Applied Materials, Inc. December 22, 2009 Applied Materials Completes Acquisition of Semitool Applied Materials, Inc. announced it has completed its acquisition of Semitool, Inc. This acquisition expands Applied's capability to address ... Applied Materials December 9, 2009 Applieds' High-k/Metal Gate Tech Selected by STMicroelectronics Applied Materials, Inc. announced that STMicroelectronics (ST) has selected Applied Materials’ high-k/metal gate (HKMG) technology for the ... Applied Materials December 3, 2009 Applied Materials' Smart Emissions Control Solution Cuts Energy Use Applied Materials, Inc. unveiled its Applied iSYS™ platform, the industry's first fully-integrated abatement and vacuum pumping solution ... Applied Materials, Inc. December 2, 2009 Applied Materials Releases the Reflexion GT Applied Materials, Inc. raised CMP* technology to a new level while lowering system cost of ownership (CoO) with the launch of its Applied ... Applied Materials December 1, 2009 Applied Materials Solves Critical Transistor Scaling Challenge Applied Materials, Inc. announced its new Applied Vantage® Astra™ millisecond anneal system, an important breakthrough in transistor ... Applied Materials November 18, 2009 Applied Materials to Acquire Semitool Applied Materials, Inc. and Semitool, Inc. announced a definitive agreement for Applied to acquire the outstanding shares of Semitool ... Applied Materials, Inc. October 29, 2009 Applied Materials' SunFab Module Technology Cuts Customers' Cost Applied Materials, Inc. announced it has significantly lowered the cost for customers to manufacture solar photovoltaic (PV) panels on its ... Applied Materials, Inc. October 19, 2009 ITRI and Applied Materials Collaborate to Advance 3D IC Technology Taiwan’s Industrial Technology Research Institute and Applied Materials, Inc. announced a collaboration to accelerate the development and ... Applied Materials September 30, 2009 Applied Materials Awarded Key Service Contract by Fujitsu Microelectronics Applied Materials, Inc. announced it has been awarded an integrated service contract by Fujitsu Microelectronics Ltd. to support its ... Applied Materials September 29, 2009 Applied Materials Begins Shipments of World's Largest, Fastest, Roll-to-Roll Vacuum Coating Systems Applied Materials, Inc. announced it has begun shipping multiple Applied Topmet™ 4450 systems, the world's largest and fastest, roll-to-roll ... Applied Materials, Inc. To find more corporate news releases from Applied Materials, use the search form below. Jetting Systems Technology New white paper Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more… Nordson ASYMTEK Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2009 Circuitnet.    All rights reserved. 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