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  mBGA Flux deposition
with ultrasonic coating technology
mBGAUSI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more...
Ultrasonic Systems, Inc.
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Preventing Solar Cell Micro Cracks
Solar Soldering Application Note
Preventing Solar Cell Micro CracksStringing and bussing soldering can cause thermal stress and micro cracking of solar cells. A process to prevent damage and produce 1-2µm inter-metallic bonds between ribbon and cells must be identified & maintained. Learn more…
OK International




See wire bonding in action
Wire bonding demonstration videos
wire bonding in actionExperts demonstrate programming for consistent loop height and wire length, 45° and 89° deep access, loop and wire deformation parameters and ribbon bonding on one platform. Learn more…
Hesse & Knipps, Inc.
  Industry and Technology News Index
June 26, 2009  -  Click the title to read the full article.

Singapore's IME, Bell Labs boost silicon photonics
Alcatel-Lucent Bell Labs and Singapore's Institute of Microelectronics (IME) have forged a collaboration to develop advanced photonics technology ...
EETimes Asia
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More from EETimes Asia
September 18, 2009 - Industry News
Fairchild delays fab closures due to demand surge
Fairchild Semiconductor has delayed shutting down two fabs due to strong demand, according to an analyst. In March, Fairchild said it planned to ...
EETimes Asia
September 15, 2009 - Industry News
Survey: Singapore IC firms see recovery underway
Singapore's semiconductor industry association MIDAS said that the chip market in Singapore is on its way to recovery. A survey of leading ...
EETimes Asia
August 20, 2009 - Industry News
Infineon stays on top of power IC market
IMS Research's latest analysis hailed Infineon Technologies the largest supplier to the global power semiconductor (discrete and module) market ...
EETimes Asia
July 15, 2009 - Technology News
Duo works on bonding solution for 3D packaging
SUSS MicroTec and Thin Materials AG are cooperating on a temporary bonding solution to be used for challenging thin wafer-handling technologies ...
EETimes Asia
July 1, 2009 - Technology News
MEMS oscillators set frequencies
Discera's programmable DSC8002 MEMS oscillators can now be programmed easily anywhere, as the company unveils the Dragonfly portable ...
EETimes Asia
June 26, 2009 - Industry News
Singapore's IME, Bell Labs boost silicon photonics
Alcatel-Lucent Bell Labs and Singapore's Institute of Microelectronics (IME) have forged a collaboration to develop advanced photonics technology ...
EETimes Asia
February 10, 2009 - Industry News
Smart phones keep IC suppliers afloat
As the economic crisis bleeds the electronics markets and suppliers dry, the relative strength of the smart phone market is helping some ...
EETimes Asia
May 20, 2008 - Technology News
IBM touts efficiency 'breakthrough' in solar cells
IBM Corp. researchers have managed to squeeze 230W of power onto a centimeter square of solar panel using concentrator photovoltaics. ...
EETimes Asia
April 18, 2008 - Technology News
Digital ChipCorder designed for multilanguage voice apps
Winbond Electronics Corp. America (Winbond America) has extended its ChipCorder family with the introduction of the ISD15000, a single- ...
EETimes Asia
April 14, 2008 - Technology News
BJTs with ultrafast switching save on energy
Fairchild Semiconductor Corp.'s 3A and 5A bipolar junction transistors (BJTs) contribute to energy-savings in electronic ballast, power ...
EETimes Asia
April 11, 2008 - Technology News
Biometric chipset promises size, cost advantages
Atmel Corp. has announced the availability of its FingerChip Security Chipset that promises a highly secure, high-performance, small and ...
EETimes Asia
April 7, 2008 - Industry News
India IC policy pulls in $16B manufacturing proposals
Electronics and chipmakers in India are looking to work with the government to pull together proposals for establishing a chip fab, an ...
EETimes Asia
February 26, 2008 - Technology News
Yole sees increasing WLP adoption in ICs
Yole Dveloppement released an analysis on the adoption of wafer-level packaging (WLP) in semiconductors based on the idea that WLP ...
EETimes Asia
February 25, 2008 - Industry News
Freescale stays on top of auto IC market
Freescale Semiconductor has maintained its position as the biggest supplier of automotive processors, claiming 45 percent of the market ...
EETimes Asia
October 16, 2007 - Industry News
Brazil, too, wants to be IC design hub
There is a saying among suppliers of semiconductors and other electronic products to the booming Brazilian market: "Miami is Brazil." The reference ...
EETimes Asia
October 1, 2007 - Industry News
Flash makers position for NAND surge
Seeking to gain ground on Samsung Electronics Co. Ltd—especially after a disruption in the market leader's fab production earlier this month—NAND ...
EETimes Asia
To find more articles from EETimes Asia, use the search form below.


Jetting Systems Technology
New white paper
Dispensejet DJ-100 Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more…
Nordson ASYMTEK




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