We search for industry news, so you don't need to.
  Improve Your Uptime
High Precision Dispense Tips
Precision needlesThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology
Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map

Dynaloy Solutions for WLP
Advanced Packaging Applications
Dynaloy Solutions for WLPDynaloy offers Dynastrip™ DL88 for improved safety and better cleaning in Wafer Level CSP applications. See Dynaloy's advanced solutions for Flip Chip Bumping, Cu Pillar, Micro Pillar, Fan-out, WLCSP, and other challenging packaging cleaning processes. Learn more…
Dynaloy LLC




Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
  Corporate News Index
January 30, 2009

Cree Announces Sample Release of Two New GaN HEMT Microwave Transistors

DURHAM, N.C. -- Cree, Inc (Nasdaq: CREE) announces the sample release of two 120W, highly efficient GaN HEMT microwave transistors for telecommunication applications such as W-CDMA, LTE and WiMAX. Due to the unique combination of high RF power density, low capacitance and high thermal conductivity silicon carbide (SiC) substrates, these transistors provide superior performance compared to other technologies such as GaAs MESFET or Si LDMOSFET. Two demonstration amplifiers--one for each device--are available for transistor evaluation.

The new transistors consist of single, input-pre-matched GaN HEMT devices providing more than 120 watts of saturated power in small, industry-standard ceramic-metal packages. These transistors provide convenient values of input and output impedances to allow device matching over greater than 30% instantaneous bandwidths.

The CGH21120F is designed to be used primarily in the 1800 - 2300 MHz frequency range, while the CGH25120F is optimized for the 2300 - 2700 MHz range. This allows the two transistors to be used for DCS (GSM), PCS (GSM and CDMA), W-CDMA, and LTE.

As an example, the CGH21120F provides more than 110 watts of peak CW power at 70% efficiency with a gain of 16 dB when operated at 28 volts. Under W-CDMA 3GPP stimulus, the transistor provides 25 watts average power with 40% efficiency in Class A/B operation. This is the highest known W-CDMA efficiency from any commercially available transistor at this power level.

"We are pleased to add these transistors to our growing family of GaN HEMT products. Each has demonstrated the extraordinary performance needed for today's demanding 3G and 4G telecommunication networks," said Jim Milligan, Cree director of RF and microwave products. "High efficiency is becoming a driving factor, along with increased emphasis on higher average powers, for multi-channel/carrier applications. These transistors also allow a high degree of digital pre-distortion correction so that ACLRs (Adjacent Channel Level Ratios) of -60 dBc can be routinely achieved. In a recent demonstration, two CGH21120F transistors, in a Doherty amplifier configuration, generated 80 watts of average power under W-CDMA with a record efficiency of 52%."

The CGH21120F and CGH25120F complement the range of Cree's RoHS-compliant HEMT microwave transistors for WiMAX applications available for 802.11x OFDM average power levels of 2W, 4W and 8W.

Contact:
Cree, Inc.


http://www.cree.com

This page has been viewed 203 times.
We search for industry news, so you don't need to.
You would be much better informed if you could read every
important article impacting the semiconductor packaging
market. But you can't spend all day searching for them.


Let us do the searching for you.

Get a Free Subscription to Semiconductor Packaging News

More from Cree, Inc.
January 30, 2009
Cree Announces Sample Release of Two New GaN HEMT Microwave Transistors
Cree, Inc announces the sample release of two 120W, highly efficient GaN HEMT microwave transistors for telecommunication applications such as ...
Cree, Inc.
July 10, 2008
Cree Delivers GaN Process Design Kit
Cree, Inc. announces the availability of a leading edge process design kit (PDK) for GaN HEMT process technology. The Cree PDK, developed for ...
Cree, Inc.
October 17, 2007
Cree Releases Commercial Production of 100-mm ZMPTM
Cree, Inc. announced commercial release of its Zero Micropipe (ZMPTM) 100-mm, n-type silicon carbide ((SiC) substrates. With this achievement ...
Cree, Inc.
October 15, 2007
Zero Recovery Rectifier Boosts Efficiency in Computer Servers
Cree, Inc. announced release of a new 8-, Zero RecoveryŽ rectifier that significantly increases power-supply efficiency in computer servers ...
Cree, Inc.
To find more corporate news releases from Cree, Inc., use the search form below.


Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News
Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers
Search Category       Search Term   
To search a phrase, place it in quotes.
Semiconductor Packaging News - A Circuitnet Publication
We search for industry news so you don't need to.

Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA
Copyright © 2009 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager


Visit Circuitnet for the latest electronics assembly news and information.