Laura A. Smoliar, Ph.D., CEO, Mobius Photonics, Inc.
Laura A. Smoliar, Ph.D., CEO, Mobius Photonics, Inc.
Given current global economic challenges, we expect 2009 to be a time where strong equipment makers focus on development of next-generation products with new technologies so that they can capture market share when the economy rebounds. We also expect to see consolidation in established market areas and more entrants in growing market sectors, such as solar. Lasers will have many opportunities for design wins in the 2009 development cycle, especially if they can outpace the reliability and performance of current offerings.
This means that lasers for semiconductor, solar, and other electronics materials processing must address increasing demands for efficiency and lower cost of ownership while providing better value in terms of enabling higher throughput. Scalable platforms with flexibility and field serviceability will be essential to high-volume manufacturers looking to keep production costs in check while shaving time to market entry.
Mobius Photonics will work with strategic clients in the equipment space to develop new material processing capabilities, new applications, and new markets. By working closely, processing equipment can be designed to take full advantage of the new capabilities that lasers afford. Although it will take some time for the economics of certain business sectors to gain full momentum, we will continue to build our business in applications where Mobius’ products are now qualified. This will enable us to be ready to meet customer demand as it occurs.
Laura A. Smoliar, Ph.D., CEO Mobius Photonics, Inc.
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Throughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ... 
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Driven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ... 
2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ... 
The ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ... 
