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  Jetting Systems Technology
New white paper
Dispensejet DJ-100 Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more…
Nordson ASYMTEK
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Semicon West:
Infinite Possibilities
Semicon EuropaImportant decisions on the future of microelectronics will be made at SEMICON West this July. Don't watch from the sidelines—get in the action. Plan now to be at SEMICON West 2009! Learn more…
SEMI




PacTech's Ultra-SB2
Volume Solder Ball Placement
PacTech's SB2Volume solder ball placement solutions for 6- to 12-inch wafers and substrates with solder ball sizes down to 60µm for flip-chip applications and 200µm and higher for WLCSP. Learn more …
PacTech
Viewpoint Index
January 8, 2009

Laura A. Smoliar, Ph.D., CEO, Mobius Photonics, Inc.

image
Laura A. Smoliar, Ph.D., CEO, Mobius Photonics, Inc.
Given current global economic challenges, we expect 2009 to be a time where strong equipment makers focus on development of next-generation products with new technologies so that they can capture market share when the economy rebounds. We also expect to see consolidation in established market areas and more entrants in growing market sectors, such as solar. Lasers will have many opportunities for design wins in the 2009 development cycle, especially if they can outpace the reliability and performance of current offerings.

This means that lasers for semiconductor, solar, and other electronics materials processing must address increasing demands for efficiency and lower cost of ownership while providing better value in terms of enabling higher throughput. Scalable platforms with flexibility and field serviceability will be essential to high-volume manufacturers looking to keep production costs in check while shaving time to market entry.

Mobius Photonics will work with strategic clients in the equipment space to develop new material processing capabilities, new applications, and new markets. By working closely, processing equipment can be designed to take full advantage of the new capabilities that lasers afford. Although it will take some time for the economics of certain business sectors to gain full momentum, we will continue to build our business in applications where Mobius’ products are now qualified. This will enable us to be ready to meet customer demand as it occurs.

Laura A. Smoliar, Ph.D. , CEO
Mobius Photonics, Inc.

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Laura A. Smoliar, Ph.D., CEO, Mobius Photonics, Inc.


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February 8, 2010
Bob Sykes, CTO, XYZTEC
imageAlthough the market was slow in 2009, XYZTEC took the initiative to invest in long term projects, one of them being new products to address green technology, like solar, and semiconductor trends such as 3D and ever reducing geometry! In addition, we experienced a 30% increase in personnel; not common during a recession. These efforts provide the ...
February 4, 2010
Ardy Johnson, Vice President of Marketing, Rudolph Technologies, Inc.
imageIncreased order rates and customer activity in general points to a continuing industry turnaround that we have all been hoping for. The back-end book to bill ratio is now above one, and we are increasingly confident that the industry is entering a sustainable recovery. There are many new developments on a variety of fronts such as the technology advances driven primarily by demand for more connections in less ...
February 3, 2010
Dr. Farhad Farassat, President and CEO, F&K Delvotec Bondtechnik
imageHaving emerged from a year which made even the abysmal period after 2000 look good by comparison, everybody in the industry is understandably cautious for the coming year. One of the trends we see firming up is the continued rise of power electronics. Regulating power instead of just switching it on or off is still attractive in a huge number of industrial, consumer and automotive applications, with the added appeal that energy ...
February 1, 2010
Dayton Bishop, Stratus Vision
imageStratus Vision expects a good year where smaller structures on larger substrates with increasing requirements demand the unique abilities of powerful AOI systems. Stratus new thin film inspection systems have been delivered inspecting substrates up to 600mm x 600mm with resolutions down to 2.5µm. The Stratus advantage includes Image acquisition. The patented AOI uses multiple lighting ...
January 28, 2010
Craig C. Ramsey, Ph.D., General Manager, CyberOptics Semiconductor, Inc.
imageIn 2010, both the economy and chip demand will be driven by various forces: growth of the smartphone and netbook markets; adoption of Windows 7; growth in the display market and the emerging markets for alternative energy and hybrid vehicles. At a time when manufacturers face margin pressure, shrinking tolerances and reduced infrastructure, we'll see our industry leverage the recovering ...
More Viewpoint Comments Index


Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




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