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  Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
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Better Reflectivity Control
with ShinEtsu GBARC
GBARCShinEtsu GBARC for high NA immersion lithography. Single layer reflectivity control for CD swing control and standing wave elimination. Straighter profiles with no footing; low LER. Eliminates dual barc coats saving process steps and chemicals. Learn more…
ShinEtsu




Does your vapor phase reflow
offer guarantees? Ours Does
ATEK Reflow• Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more…
ATEK Systems Group
Viewpoint Index
January 8, 2009

Laura A. Smoliar, Ph.D., CEO, Mobius Photonics, Inc.

image
Laura A. Smoliar, Ph.D., CEO, Mobius Photonics, Inc.
Given current global economic challenges, we expect 2009 to be a time where strong equipment makers focus on development of next-generation products with new technologies so that they can capture market share when the economy rebounds. We also expect to see consolidation in established market areas and more entrants in growing market sectors, such as solar. Lasers will have many opportunities for design wins in the 2009 development cycle, especially if they can outpace the reliability and performance of current offerings.

This means that lasers for semiconductor, solar, and other electronics materials processing must address increasing demands for efficiency and lower cost of ownership while providing better value in terms of enabling higher throughput. Scalable platforms with flexibility and field serviceability will be essential to high-volume manufacturers looking to keep production costs in check while shaving time to market entry.

Mobius Photonics will work with strategic clients in the equipment space to develop new material processing capabilities, new applications, and new markets. By working closely, processing equipment can be designed to take full advantage of the new capabilities that lasers afford. Although it will take some time for the economics of certain business sectors to gain full momentum, we will continue to build our business in applications where Mobius’ products are now qualified. This will enable us to be ready to meet customer demand as it occurs.

Laura A. Smoliar, Ph.D. , CEO
Mobius Photonics, Inc.

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Laura A. Smoliar, Ph.D., CEO, Mobius Photonics, Inc.


More Viewpoint Comments Index
March 2, 2010
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
imageThroughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ...
February 25, 2010
Mark Brawley, National Sales Manager Americas, DEK
imageIn all DEK's market sectors, the actions needed to prepare for 2010, and the much anticipated upturn, were taken in 2009. Principally these included improving lines of communication with customers and channel responsiveness. We know from experience that agility is essential in an upturn. Manufacturers tend to ramp up much faster than they scaled down. Sure, we pursue key product developments in the meantime to address current and emerging semiconductor ...
February 24, 2010
Michel Villemain, Ph.D., Founder and CEO, Presto Engineering
imageDriven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ...
February 23, 2010
Daniel F. Baldwin, Ph.D., Founder, Engent
image2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ...
February 22, 2010
Markus Wilkens, President, ASYS Group Americas, Inc.
imageThe ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ...
More Viewpoint Comments Index


Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




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