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Die Bonding Made Easy
Precision X-Form Needles
 The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
China continues to dominate Asia/Pac semi industry growth, but India, Vietnam gaining
As Gartner lowers its forecast for Asia/Pacific semiconductor growth, it notes the China/Hong Kong market is expected to continue to experience ...
EDN
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Credit Crisis Crunches DRAM Suppliers
Already reeling from a major downturn in business conditions, DRAM suppliers now face another challenge: raising money for servicing debt ...
iSuppli Corporation
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FBM could leave DRAM in the dust
Dynamic random access memory (DRAM) has been the memory device of choice for design engineers worldwide for more than 30 years. While the ...
EETimes
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Chip package choices abound
When creating a new IC, all of the initial focus is naturally on the design. When it comes to tape-out, then fabrication, multi-project ...
EETimes India
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Flip Chip and WLP Use Growing
The growth of flip chip and wafer level packaging is a bright spot in the industry, says researcher TechSearch International. The firm projects ...
Printed Circuit Design & Fab
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Samsung investing heavily despite economic climate
Samsung Electronics' Woosik Chu likes to say the Korean electronic giant is "a cut above the competition." It's a boast Chu, Samsung executive ...
EETimes
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Freescale wants to bail out of mobile chip market
Freescale Semiconductor is mulling the sale of its mobile chip operations as Motorola’s obligation to buy its chips runs out. The vendor this ...
Telecom TV
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Industry proposes creation of institute to boost electronics sector
The Philippines’ stakeholders in semiconductor and electronics sectors are recommending the creation of a research and development (R&D) ...
GMA news
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Nintendo ramps up Wii for the holidays
With the start of the holiday shopping season only weeks away, Nintendo said it was increasing shipments of its popular Wii video-game machine ...
Seattle Times
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Elpida leverages architecture to achieve chip shrink
Elpida’s chip size shrink was made possible by leveraging a new architecture on first-generation 65-nm process products, and estimates ...
EDN
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Tech stocks plunge as Nasdaq hits four-year low
Technology stocks cut their losses in late trading Monday, but it wasn't enough to keep the sector from closing with wide declines amid a ...
Market Watch
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Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
 Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
Red-E-Set Universal Boards Supports
ROI CALCULATOR
 Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more…
Production Solutions, Inc.
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