We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers September 30, 2008 Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu Letters Submit Joe Fjelstad update on solderless technology I just finished reading this interesting article, and although this new solderless ... Dr. Brett D Robinson EMI Solutions Inc. White Paper: Photo Resist coating Precision coating with Ultraspray Technology Outlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper… Ultrasonic Systems, Inc. Top Story   IC Insights cautious, but still sees 2008 growth IC Insights has lowered its forecast for 2008 total worldwide IC market growth, noting shrinking demand from fabless suppliers, a weak memory ... EDN Control Costs and Maximize Yield Discover the XD7600NT If you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more… Dage Precision Industries Exclusive   Thermal Management and EMI Shielding should not be a problem If like me, you have been concerned or have wondered why large EMS and OEM manufacturing companies have had recalls due to thermal failures that have created millions of dollars in loss and upset consumers. If you have seen the recent U Tube controversial cell phone popcorn ... Steve DeCollibus, Managing Editor Semiconductor Packaging News Industry News   Semiconductor industry can learn from financial industry melt-down, says Penn While July's results in the market showed that the semiconductor market continued the first half year trend of exceeding expectations, the ... DigiTimes Chipmaker Rambus wins battles, but faces bigger war Craig Hampel has spent the last two years trying to design the next leap in memory chip technology, one that will allow computers to display more ... CNet News Aggressive scaling of NAND flash fails profitability goals According to The Korean Times, Samsung is to accelerate the migration of NAND flash devices to its 42nm node process in an effort to improve ... Fabtech Spot prices of solar cells drop as old government incentives expire in Spain In the global spot market for solar cells, prices have slipped by 5-10% from US$3.6-3.8/watt to US$3.2-3.4/watt in the past two weeks because ... DigiTimes Govt urged to energize solar power industry Solar cell manufacturing is also on the priority list of a state panel set up at the instance of Prime Minister Manmohan Singh to frame a ... Livemint TSMC offers 28nm process this year TSMC is taking a big jump ahead of the rest of the foundry industry in offering prototype 28nm chips by the end of the year. The company's ... Electronics Weekly Imbera Launches Next Generation Embedded Packaging Solution Integrated module board (IMB) technology offers OEMs/ODMs a fast and cost effective route to enhanced miniaturisation and electrical performance ... Market Watch Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Technology News   New nanotechnology to speed up computers University of California at Santa Barbara (UCSB) researchers have developed new nanoscale structures that will help to speed up ... ZDNet IBM, ARM Join On Mobile-Device Chip Technology The results of the partnership will be used in logic, memory, and interface products for the customers of IBM's Common Platform ... Information Week IQE provides epitaxy for US graphene project Innovative molecular beam epitaxy and chemical vapor deposition processes are central to the development of graphene transistors in a DARPA ... Compound Semiconductor Nvidia GPU solder joints at a disadvantage over ATI, scientist says A tiny material issue in Nvidia’s GPUs has cost Nvidia $200 million so far: The problem boils down to the solder bump material, in Nvidia’s ... TG Daily Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Corporate News Submit Virage Logic and TSMC Expand Agreement to Provide Process-Optimized IP Virage Logic Corporation and TSMC have extended their agreement to provide end-market process optimized intellectual property for System ... Virage Logic Corporation Today's Sponsor Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.