We search for industry news, so you don't need to.
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Die Bonding Made Easy
Precision X-Form Needles
 The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
Foundry wafer starts in 'free fall,' says analyst
Silicon foundries are experiencing a significant decline in wafer starts that is likely to result in sub-75 percent capacity utilization rates ...
EETimes
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Toshiba Cuts Forecast as Semicon Biz Slumps
Toshiba Corp lowered its earnings forecasts for fiscal 2008. An operating loss of ¥30 billion (approx US$282 million) will be logged in the ...
Tech-On
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Ambitious Plan for N.Y. Packaging Center
Plans for an advanced packaging R&D center in New York state call for a public-private partnership, with packaging infrastructure companies ...
Semiconductor International
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Nvidia turns from games to industrial imaging
Figuring out the best way to transform a frozen pizza into a perfectly warmed pie, gooey on top and crispy on the bottom, is as much a ...
International Herald Tribune
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Hostility stalks the semiconductor industry
Hostile takeovers have never been common in the high-tech industry, but they’ve become more frequent since Oracle was able to roll up ...
Bizmology
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Using the Technological Capability We Have
Embedded systems will soon be improving everything from the automotive industry to the electric grid. Lisa Su, senior vice president and ...
MIT Technology Review
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DRAM, NAND prices continue to slip
Spot pricing is down again for DRAM and NAND flash devices, according to market research firm Gartner Inc. Average spot prices across all DRAM ...
EETimes
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GPU will continue to grow for another 15 years: Q&A with Jen-Hsun Huang, president and CEO of Nvidia
Digitimes recently had a chance to talk to Jen-Hsun Huang, president and CEO of Nvidia to discuss recent issues surrounding the chip design ...
DigiTimes
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Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
 Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
Red-E-Set Universal Boards Supports
ROI CALCULATOR
 Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more…
Production Solutions, Inc.
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Today's Sponsor
ShinEtsu Resists - Perfect for 3D packaging,
WLP, TSV and wafer bonding
 For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion.
ShinEtsu
Solar wafer coating - White paper
USI has developed Nozzle-less
 Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more…
Ultrasonic Systems, Inc.
Checking for Brittle Fracture Failures?
Replace drop testing with high strain rate bondtesting
 Detecting brittle fracture failures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more…
Dage Precision Industries
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