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High Precision Dispense Tips
Precision needlesThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology
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NEW Hesse & Knipps BONDJET BJ915L
for your leadframe applications
Bond Jet BJ920Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more…
Hesse & Knipps




Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
  Industry and Technology News Index
September 24, 2008  -  Click the title to read the full article.

Recovery Rectifier Yields High Switching Speed
Coming in the GPR-4AM voidless glass-bead axial-leaded case, Central Semiconductor’s CPR5U-040 5 A 400 V recovery rectifier exhibits a ...
ECN Magazine
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More from ECN Magazine
December 16, 2008 - Technology News
MEMS Oscillator Exhibits ±10-ppm Frequency Stability
Presenting randon rms phase jitter of <1 ps, SiTime's SiT9102 differential output MEMS oscillator demonstrates frequency stability ...
ECN Magazine
November 25, 2008 - Technology News
S-Band VCO Operates to 2,450 MHz
Offering a tuning voltage range from 0.50 VDC to 4.50 VDC, Z-Communications' V804ME14-LF S-band VCO performs from 2,300 MHz to ...
ECN Magazine
November 21, 2008 - Technology News
Transistors Demonstrate Low VCE(SAT)
Coming in a SMT SOT-883L TLP leadless package, Central Semiconductor’s CET3904E (NPN) and CET3906E (PNP) 40-V general-purpose transistors ...
ECN Magazine
October 28, 2008 - Technology News
DC/DC Converters Produce 1 A Output Current
Providing regulated output voltages from 3.30 VDC to 12 VDC, Aimtec’s AMSR1-78-NZ Series non-isolated DC/DC switching regulator converters ...
ECN Magazine
October 24, 2008 - Technology News
GPS Chip Antenna Exhibits Small Footprint
Having a ground clearance area of 4 mm × 4.250 mm, Pulse’s W3011 SMT ceramic GPS chip antenna measures 1.600 mm × 3.200 mm × 1.100 mm ...
ECN Magazine
September 24, 2008 - Technology News
Recovery Rectifier Yields High Switching Speed
Coming in the GPR-4AM voidless glass-bead axial-leaded case, Central Semiconductor’s CPR5U-040 5 A 400 V recovery rectifier exhibits a ...
ECN Magazine
September 19, 2008 - Technology News
Voltage Translator Yields Wide Voltage Range
Performing in Bluetooth and display screens, Fairchild Semiconductor’s FXM2IC102 I²C voltage translator operates over a voltage range from ...
ECN Magazine
September 16, 2008 - Technology News
Power Resistors Exhibit High Tolerances
Possessing a temperature coefficient of resistance or 25 or 50 ppm, Thin Film Technology’s line of chip power resistors present resistance ...
ECN Magazine
September 16, 2008 - Technology News
Linear Positioning Stage Offers Micron Bidirectional Repeatability
Featuring micron bidirectional repeatability, the SMS 12 positioning stage from Equipment Solutions, combines a cross roller bearing stage ...
ECN Magazine
August 27, 2008 - Technology News
Evaluation Platform Enables Prototyping
Allowing DSP or processor aggregation, Tundra Semiconductor’s Tsi620 multi-standard RapidIO switch evaluation platform enables prototyping ...
ECN Magazine
July 14, 2008 - Technology News
Converter ICs Eliminate Secondary Feedback
Reducing Power Supply Component Count by 30%, Power Integrations' LinkSwitch II Series AC/DC switched-mode power conversion ICs ...
ECN Magazine
June 17, 2008 - Industry News
FlipChip Partners with Unisem in Wafer Bumping, Wafer Level Packaging
Unisem Berhad and its subsidiary Unisem-Advanpack Technologies Sdn Bhd have entered into an agreement with FlipChip International, LLC (FCI) ...
ECN Magazine
June 13, 2008 - Technology News
MEMS Sensor Provides 3D Orientation Info
Consolidating multiple sensor functions in a single 14-pin LGA ECOPACK SMT package, STMicroelectronics’ FC30 sensor provides 3D orientation ...
ECN Magazine
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Full Wafer Die Attach
Deposition in a Single Stroke
Full Wafer Die Attach White PaperLearn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download…
Henkel Corporation




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