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  Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
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MEPTEC Presents Semiconductor Packaging
Impacting the Age of Consumer Electronics
Medical Electronics SymposiumJoin MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more…
MEPTEC




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Asymtek
  Industry and Technology News Index
September 24, 2008  -  Click the title to read the full article.

GPU will continue to grow for another 15 years: Q&A with Jen-Hsun Huang, president and CEO of Nvidia
Digitimes recently had a chance to talk to Jen-Hsun Huang, president and CEO of Nvidia to discuss recent issues surrounding the chip design ...
DigiTimes
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More from DigiTimes
January 8, 2009 - Industry News
Taiwan wafer maker SAS hit record revenues for 41 months straight
Sino-American Silicon Products, a Taiwan-based maker of solar-grade crystalline silicon wafers, reported the record monthly level for the ...
DigiTimes
January 7, 2009 - Industry News
Wafer foundries expected to see 20-30% revenue drops in December
Taiwan-based foundry service providers may each suffer a revenue drop of 20-30% sequentially in December, as a result of the gloomy economic ...
DigiTimes
January 7, 2009 - Industry News
China semiconductor growth slower-than-expected in 2008, says CSIA
A recent survey by the China Semiconductor Industry Association (CSIA) has shown that China's semiconductor industry only had a 5% sale ...
DigiTimes
January 7, 2009 - Industry News
DRAM contract price slump to end in 1H January
The downward contract pricing trend of DRAM chips is expected to end in the first half of January as a result of production cutbacks, industry ...
DigiTimes
December 31, 2008 - Industry News
Global demand for handset solutions to decline over 30% in 1Q09
Demand for handset solutions from global handset vendors is likely to decline at least 30% in the first quarter of 2009 as gauged by current ...
DigiTimes
December 31, 2008 - Industry News
Chip inductor suppliers have no capacity expansion plans; will continue to develop new products
Both King Core Electronics and Cyntec are pessimistic about their fourth-quarter performances and currently have no plans to expand capacity ...
DigiTimes
December 30, 2008 - Industry News
Netbooks to boost webcam module shipments next year
With webcam module becoming a standard feature for netbooks, the forecast shipments of 20 million units next year will help boost the ...
DigiTimes
December 30, 2008 - Industry News
Thin-film PV modules have better long-term business potential than crystalline silicon type, says Auria Solar
While the global market of crystalline silicon solar cells is developing toward saturation with product prices unlikely to significantly ...
DigiTimes
December 30, 2008 - Industry News
VIA platform accounts for 10-15% of netbook shipments in 2008
VIA's platform will account for 10-15% of the total netbook shipments this year, according to a Chinese language Apply Daily report cited ...
DigiTimes
December 29, 2008 - Industry News
TSMC expands workforce in MEMS department
Taiwan Semiconductor Manufacturing Company (TSMC) is taking the advantage of low foundry utilization by transferring more engineers ...
DigiTimes
December 23, 2008 - Industry News
Micron Enterprise NAND
Micron has introduce a new range of NAND flash targeting the enterprise market. Enterprise NAND is a high-endurance SLC NAND device that's ...
DigiTimes
December 23, 2008 - Industry News
LCD driver IC sales continue to drop in December
LCD driver IC companies saw sales in November drop over 30%, and December sales are expected to continue to fall. Novatek Microelectronics ...
DigiTimes
December 23, 2008 - Industry News
IC distributors eye niche markets
In order to avoid too much sales decline in 2009, IC distributors have made more deployments outside the consumer electronics, ...
DigiTimes
December 23, 2008 - Industry News
CCL demand sags amid weak PCB industry
The PCB industry has remained sluggish during the second half of 2008, resulting in copper clad laminate (CCL) suppliers slowing down their ...
DigiTimes
December 22, 2008 - Industry News
LG Display said to suspend some LCD panel lines for 12 days to control inventory
According to a Chinese-language cnYes.com report, LG Display (LGD) is going to suspend some of its LCD panel lines for 12 days from December ...
DigiTimes
December 18, 2008 - Industry News
NXP to maintain R&D investment in 2009; cutting into MEMS
NXP Semiconductors will not reduce R&D investment in 2009, equivalent to about 17-18% of total sales, and continues to consolidate to ...
DigiTimes
December 15, 2008 - Industry News
PCB makers to freeze capacity expansions next year
PCB companies are being forced to freeze capacity expansion plans next year due to sagging end market demand and the China government's ...
DigiTimes
December 9, 2008 - Industry News
Driver IC suppliers see sharp sales declines in November
Driver IC designers Novatek Microelectronics, Orise Technology and Raydium Semiconductor all have reported sharp sequential declines in ...
DigiTimes
December 9, 2008 - Technology News
Nanomaterial demand will grow 40% in 2009, says The Information Network
Despite a sluggish forecast for the overall high-tech industry in 2009, nanomaterials consumption for electronics applications will grow 40% ...
DigiTimes
December 9, 2008 - Industry News
Packaging and testing houses see weaker NOR flash sales in 4Q
Memory packaging and testing houses ChipMOS Technologies and King Yuan Electronics Company (KYEC) have estimated that sales contributions ...
DigiTimes
December 9, 2008 - Industry News
More than 50% of PV module makers in China stop production, claim sources
There were originally about 350 photovoltaic (PV) module makers in China, but approximately 200 of them have stopped production or shut ...
DigiTimes
December 4, 2008 - Top Story News
Players in packaging and testing may lower 4Q forecasts
With Advanced Semiconductor Engineering (ASE) lowering its fourth-quarter guidance closely on the heels of a grimmer outlook offered by Taiwan ...
DigiTimes
December 4, 2008 - Industry News
AMD updates chipset schedule for next year
AMD plans to launch a new entry-level IGP chipset, the 760G based on RS780 architecture, in January 2009. The chipset will support DirectX ...
DigiTimes
December 4, 2008 - Industry News
LED leadframe maker I-Chiun sees 48% drop in November revenues
Taiwan-based LED leadframe maker I-Chiun Precision Industry has reported November consolidated revenues down 48% in October and down 53% ...
DigiTimes
December 3, 2008 - Industry News
Foxconn investment in AMPI to benefit IC designer APEC
With Foxconn Electronics taking a 16% stake in second-tier foundry Advanced Microelectronic Products through a private placement earlier ...
DigiTimes
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White Paper: Photo Resist coating
Precision coating with Ultraspray Technology
Photo Resist WPOutlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper…
Ultrasonic Systems, Inc.




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