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September 23, 2008


Case Study & Application Note
How flat are your substrates?
Substrates White Paper Packaging coplanarity issues begin with the flatness of your substrates. Learn more…
Cyber Technologies

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Semicon Korea: The largest exposition
dedicated to semiconductor and FPD manufacturing
Semicon KoreaJoin Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more…
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Semiconductor Packaging News
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Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more…
Semiconductor Packaging News
Top Story  
Is China growing weary of the chip business?
Chinese companies stormed into the silicon foundry market in the early part of the decade with the support—financial and otherwise—of a ...
EETimes

Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation

Exclusive Interview
 
Joe Fjelstad update on solder less technology
imageVerdant Technologies Joe Fjelstad has spent the last year developing and promoting their solder less OCCAM process. We caught up with him last week to see how things were going. Joe, now that the hoopla around solder less technology seems to ...
Steve DeCollibus, Managing Editor
Semiconductor Packaging News
Industry News  
Computer chip market feeling global pinch
Yasuhiro Takizawa and Ayuhiko Sasaki Yomiuri Shimbun Staff Writers. The world's semiconductor market is tumbling due to the slowdown in the ...
The Daily Yomiuri
Tessera expands IP core business to VGA camera lenses
Tessera Technologies Inc.'s new Product Launch Services will provide early access to its OptiML wafer-level camera technology. Tessera said ...
EETimes
Some second-tier suppliers may cut DRAM output
After Elpida/PSC's 10-15 percent output cut, Hynix Semiconductor Inc. (Hynix) announced operation stoppage of total production output will ...
CyberMedia India Online
UK cracks GaN-on-silicon LED issues
A government-backed LED project produces crack-free GaN-on-silicon epiwafers with an internal quantum efficiency of 40 percent. ...
Compound Semiconductor
Group forms SSD initiative
Seeking to accelerate a new technology in the marketplace, the Storage Networking Industry Association (SNIA) has announced the formation of ...
EETimes
SoC 'will shatter' $100 barrier for WiMax femtocells
Fabless wireless chip designer DesignArt Networks has introduced the second chip in its SoC "platform architecture", a part targeted at WiMAX ...
EETimes
Computer chip market feeling global pinch
The world's semiconductor market is tumbling due to the slowdown in the global economy, and prices show no sign of hitting bottom. These woes ...
TMCnet

Photo Resist Coating System
Featuring Ultrasonic Technology
Photo Resist Coating SystemUSI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more…
Ultrasonic Systems, Inc.
Technology News  
More advertisers seek to block Yahoo-Google pact
An international network of advertisers publicly criticized the proposed search-advertising partnership between Yahoo Inc. and Google Inc. on ...
Market Watch
Image capture and processing challenges--and solutions--in portable designs
Here is Part II of a four-part article series looking at the trends and design challenges of image acquisition and processing on cell phones ...
Embedded
Albany NanoTech primes 300-mm R&D fab
Albany NanoTech is opening a massive new operation called NanoFab 300 East, which will focus on 22-nm R&D technology, post-CMOS processes ...
EETimes India
Solar cell makers awaiting new government policies in Spain
The enforcement of the Electricity Feed-in Bill in Spain, the incentive offered by the Spanish government for adoption of solar and other ...
DigiTimes
Imbera Launches Integrated Module Board Embedded Packaging Solution
Imbera Electronics has launched integrated module board (IMB) technology, which enables integration of both active and passive components inside ...
TMCNet
Delta high definition display solutions
Taiwan-based switching power supplies and DC brushless fans provider Delta rolled out a variety of high performance lighting applications ...
DigiTimes
Agilent Technologies to Work with Delft University of Technology on Large-Signal, Sub-mm-Wave Characterization Techniques
Agilent Technologies (NYSE: A) announced today that it will collaborate with the Delft University of Technology in the Netherlands to ...
EDU Bourse
Linear's IC to enable hybrids, electric cars
Analog specialist Linear Technology Corp. today is expected to roll out the first in a family of monitoring chips that could help enable long- ...
EETimes

Solve your Counterfeit Component Problem
New white paper
Dage Precision Industries CTThis paper examines recommended techniques for identifying counterfeit components within the supply chain, and describes methodologies that minimize the risk of using these devices on production circuit boards in the assembly process. Learn more…
Dage Precision Industries

Corporate News Submit
Inspecting small wire diameters at high speeds is now possible
Viscom's S6053BO-V brings the newest generation of fully automatic wire bond inspection systems to market. The inspection system was conceived ...
Viscom
Orchid Technologies Completes Development of High-speed AdvancedTCA Carrier Blade Design
Orchid Technologies Engineering & Consulting Completes the Development of a High-speed AdvancedTCA Carrier Blade Design based on a Freescale ...
Orchid Technologies Engineering & Consulting
MosChip Launches SoC Processor for Digital Content Mgmt
MosChip's MCS60C80 Digital Content Management Processor is the Only AV 1394 Secure Storage Controller with a Flash Card Interface and Support ...
MosChip
Broadcom Announces 10 Gigabit Physical Layer Devices
New Multi-rate 10G Physical Layer Devices Reduce Power Consumption by 50% Compared to Competing Solutions. Broadcom Corporationa global ...
Broadcom
Today's Sponsor

YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech

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Better Reflectivity Control
with ShinEtsu GBARC
GBARCShinEtsu GBARC for high NA immersion lithography. Single layer reflectivity control for CD swing control and standing wave elimination. Straighter profiles with no footing; low LER. Eliminates dual barc coats saving process steps and chemicals. Learn more…
ShinEtsu

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MEPTEC Presents Semiconductor Packaging
Impacting the Age of Consumer Electronics
Medical Electronics SymposiumJoin MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more…
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