We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers September 18, 2008 Case Study & Application Note Measure transparent materials Control the height and volume of your clear flux, epoxy or adhesive deposits with sub-micron precision. Learn more... Cyber Technologies Semicon Korea: The largest exposition dedicated to semiconductor and FPD manufacturing Join Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more… SEMI Letters Submit Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Top Story   iSuppli: Chip biz has lost 'money-making touch' The semiconductor industry now has a lower profit percentage than the historically low-margin PC business, something that occurred only once ... EETimes Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Industry News   5 reasons why SanDisk is an acquisition target The portion of SanDisk revenue generated from royalty and licensing fees has been increasing steadily even as weak pricing conditions hurt ... EETimes X-Ray Inspection Identifies Flip Chip Detects The basic, straightforward design of a flip-chip device calls for the conductive bumps of the silicon chip to be placed directly on the ... Advanced Packaging GSA and China Semi Form Partnership The Global Semiconductor Alliance (GSA), an organization focused on accelerating the growth of the global semiconductor industry, and the ... Market Watch Spansion close to 40 percent NOR flash market share Market share figures from iSuppli Corp, show that Spansion has seen NOR flash growth of 7.5 percent in the second quarter of 2008, reaching ... Fabtech IBM rolls 'computational scaling' for litho at 22-nm Amid probable delays with extreme ultraviolet (EUV) lithography, IBM Corp. plans to extend 193-nm immersion and move towards what the ... EETimes Who should buy SanDisk? First things first: SanDisk Corp. will most likely be acquired by a rival. The only outstanding question is which of its NAND memory ... EETimes SanDisk rejects Samsung's $5.85bn takeover bid SanDisk has rejected an unsolicited takeover bid from Samsung Electronics. Samsung went public with its bid for the flash memory company ... Electronics Weekly MEMS equipment maker STS eyes 20-30% revenues growth in the coming year Despite the impact of the ongoing worldwide economic slowdown, Surface Technology Systems (STS) still expects its business to grow 20-30% on ... DigiTimes mBGA Flux deposition with ultrasonic coating technology USI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more... Ultrasonic Systems, Inc. Technology News   Carbon Breakthrough Promises Better Solar, Wind Storage While the continual progress of efficiencies in solar and wind seem to make these technologies ideal candidates to eventually replace fossil ... DailyTech Embedded component approach frees board space Finnish embedded packaging developer Imbera has licensed its integrated module board (IMB) technology to Ibiden, the world’s largest pcb ... New Electronics Storing Daylight Indulge me in a bit of science fiction for a moment, for a very simple product that could revolutionize all lighting. Today, if you wanted ... World Changing A Cautionary Note In The Use Of Carbon Nanotubes As Interconnects Researchers at the University of Surrey's Advanced Technology Institute (UK) have used scanning tunnelling microscopy to confirm remarkable ... RF Globalnet mPhase Platform Technology Breakthrough May Enable Self-Cleaning Surfaces mPhase Technologies, Inc. said its breakthrough research in microfluidics on understanding how micro- and nanostructured surfaces could be ... Market Watch Rochester Cube's chips are stacked—in a prototype fashion You have to admire the effectiveness of the University of Rochester's PR team, because this "First 3-D processor runs at 1.4GHz on new ... ars technica X-Ray Inspection Identifies Flip Chip Detects The basic, straightforward design of a flip-chip device calls for the conductive bumps of the silicon chip to be placed directly on the ... Advanced Packaging Unlock the Advantages of High-Speed Bondtesting New white paper The paper examines the interrelationship between bond strength, force displacement and energy measurement which is critical for the detection of brittle fracture failures of solder ball bonds within semiconductor packages. Learn more… Dage Precision Industries Corporate News Submit iSuppli Fast Facts on the Proposed Samsung/SanDisk Deal To support your coverage of today’s announcement of the proposed takeover of SanDisk by Samsung, iSuppli Corp. is providing the following ... iSuppli Corporation IBM and Mentor Graphics to Develop 22nm Computational Lithography Solution for the Integrated Circuit Industry IBM and Mentor Graphics Corporation announced an agreement to jointly develop and distribute next-generation computational lithography ... IBM and Mentor Graphics Corporation NEC Electronics and ELMOS to Enter Strategic Partnership NEC Electronics Corporation and ELMOS Semiconductor AG are going to join forces demonstrated by entering into a worldwide long-term partnership ... ELMOS Semiconductor AG Today's Sponsor YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu MEPTEC Presents Semiconductor Packaging Impacting the Age of Consumer Electronics Join MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more… MEPTEC Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.