We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers September 15, 2008 Case Study & Application Note How flat are your substrates? Packaging coplanarity issues begin with the flatness of your substrates. Learn more… Cyber Technologies Semicon Korea: The largest exposition dedicated to semiconductor and FPD manufacturing Join Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more… SEMI Letters Submit Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Top Story   Outlook for Semiconductor Component Companies The Wall Street Transcript recently interviewed Tristan Gerra, the Senior Semiconductor Component Analyst and a Director at Robert W. Baird & ... Seeking Alpha Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Industry News   NXP's Credit Rating Cut at S&P on Concern About Liquidity NXP BV had its credit rating reduced by Standard & Poor's on concern about its liquidity. The company's rating was cut by two grades to ... Bloomberg China's manufacturing wages: The Olympic hangover A recent newspaper article reported in early July that a Japanese manufacturing company in Guangdong Providence China received a formal ... Venture Outsource Embedded SD Card Standard Announced The SD Card Association has announced its Embedded SD Card standard, enabling phones and CE devices to use one interface for removable and ... Digital Trends China's DRAM market tries to shake off Olympic blues China was hoping for an economic boost from the Summer Olympic Games, but for the nation's DRAM market, the event actually had the opposite ... Cybermedia India Online Joint Ventures Sought for Fujitsu Chip Unit Japanese chipmakers like Fujitsu Microelectronics dominated the semiconductor industry in the late 1980s, but they have seen their ... Top Tech News Outlook for Semiconductor Component Companies The Wall Street Transcript recently interviewed Tristan Gerra, the Senior Semiconductor Component Analyst and a Director at Robert W. Baird & ... Seeking Alpha Solar firm to open factory in Tucson A Tucson subsidiary of a German solar manufacturing company says it will open a 105,000-square-foot factory in the southern Arizona city next ... Arizona Republic Broadcast RF power semicon doubles up The global market for RF power semiconductors used in broadcasting is much larger than years of "conventional wisdom" have suggested, ... Cybermedia India Online Opinion: It's a Chinese thing. You wouldn't understand It's not often that you go to a broadcast convention -- in this case, the International Broadcast Conference (IBC) -- and find yourself ... EETimes Worldwide TV IC market grows 21% on year in 2Q08, says DisplaySearch The worldwide market for TV ICs was 29.8 million units in the second quarter, up 21% on year. Shipments were up 7.8% on quarter, as TV ... DigiTimes A chip prediction: In the end, three will dominate R&D Taiwan Semiconductor founder foresees his foundry, Intel and Samsung having resources to forge ahead. As Morris Chang looks to the future ... Austin American-Statesman Photo Resist Coating System Featuring Ultrasonic Technology USI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more… Ultrasonic Systems, Inc. Technology News   Ultra-Compact MEMS Gyroscope from STMicroelectronics Provides Analog and Digital Outputs for Design Flexibility and System Partitioning Ultra-Compact MEMS Gyroscope from STMicroelectronics Provides Analog and Digital Outputs for Design Flexibility and System Partitioning ... Nanotechwire Advantest Develops New Optical-Electrical Printed Circuit Board Technology for Up to 160 Gigabit per Advantest Corporation announces its newly-developed optical-electrical printed circuit board technology, which enables up to 160 gigabit per ... PR-Canada QPAC Polyalkylene Carbonate as a Binder in Nanoparticle Applications by Empower Materials Empower Materials Inc. is the producer of QPAC®, the world's cleanest thermally decomposable binder. QPAC® cleanly decomposes into CO2 and ... The A to Z of Manufacturing Radical New Digital SLR Camera Revealed A radical new digital SLR camera that comes with two micro lenses and based on the recently announced Micro Four Thirds standard has been ... Smart House Photovoltaics: The Future Energy Source The term photovoltaic comes from the Greek word “phos” meaning light and the word “voltiac” meaning electricity, the combined word means, ... Glass on Web Control Costs and Maximize Yield Discover the XD7600NT If you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more… Dage Precision Industries Corporate News Submit Asymtek Expands in Singapore to Meet Increasing Demand for its Fluid Dispensing Equipment Asymtek announced it has expanded and moved to a new location in Singapore. This new, larger facility includes a modern lab with a full ... Asymtek Today's Sponsor YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Better Reflectivity Control with ShinEtsu GBARC ShinEtsu GBARC for high NA immersion lithography. Single layer reflectivity control for CD swing control and standing wave elimination. Straighter profiles with no footing; low LER. Eliminates dual barc coats saving process steps and chemicals. Learn more… ShinEtsu MEPTEC Presents Semiconductor Packaging Impacting the Age of Consumer Electronics Join MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. 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