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September 10, 2008


Cyber Technologies is leader in
laser-based, high-resolution 3D inspection for microelectronics
3D Inspection Our world-class clients rely on our CyberScan Vantage Systems for inspection of: Substrate Flatness, Bump and Ball Coplanarity, Wire Bond Loop Height, Film and Paste Thickness & Volume and Transparent Materials Deposition. Learn more...
Cyber Technologies

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Semicon Korea: The largest exposition
dedicated to semiconductor and FPD manufacturing
Semicon KoreaJoin Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more…
SEMI
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Semiconductor Packaging News
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Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more…
Semiconductor Packaging News
Top Story  
Venture capital is losing patience with the fabless
Just as Europe was starting to get the hang of entrepreneurial risk-taking with a handful of promising chip startups the prospects for ...
EETimes

Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
Industry News  
TI narrows estimates for 3Q profit, revenue
Investors breathed a sigh of relief as chipmaker Texas Instruments Inc. narrowed – but did not lower – its third-quarter sales and profit ...
The Dallas Morning News
Stormy Day For Solar Stocks; Too Many Panel Makers?
Solar stocks are having another rough day, one which looks all that much worse with the Dow Jones Industrial Average up well over 200 points ...
Barrons
Intel Launches Halogen-Free Processors
Intel has introduced expanded its 45nm manufacturing chip portfolio with the addition of four halogen-free Xeon processors. Intel said its Quad ...
RedOrbit
Tegal seeks "DRIE" land in MEMS
Tom Mika, CEO of Tegal, gives SST some further insights into his company's proposed acquisition of Alcatel Micro Machining Systems' ...
Wafer News
Virtus, Acutronic developing MEMS inertial testing tools
Virtus Advanced Sensors and Acutronic USA announced a collaboration to develop advanced tools for the testing of 5- and 6-axis MEMS inertial ...
Small Times
Newport Media Unveils 65nm SoC for Japan/Brazilian ISDB-T Mobile TV
Newport Media unveiled the world's first complete 65nm CMOS single-chip solution for the mobile version of Japan's Integrated Services Digital ...
Market Watch
API Nanotronics to Develop Key Component for Next Generation Lithography
API Nanotronics Corp., a leading supplier of electronic components and nanotechnology research and development to the defense and ...
Nanowerk LLC

White Paper: Photo Resist coating
Precision coating with Ultraspray Technology
Photo Resist WPOutlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper…
Ultrasonic Systems, Inc.
Technology News  
Better Organic Semiconductors For Printable Electronics
Researchers from the National Institute of Standards and Technology and Seoul National University (SNU) have learned how to tweak a new class ...
Science Daily
Thin Film Solar Will Grow Eightfold By 2010
Thin-film solar production is expected to double in each of the next three years to reach 4.18 gigawatts worth of equipment in 2010, ...
Seeking Alpha
Skyworks and Ember partner to develop ZigBee FEMs
Skyworks Solutions Inc of Woburn, Mass, USA, in partnership with Ember Corp, is developing the industry's first portfolio of ZigBee front-end ...
Semiconductor Today
China's Godson 3 Processor To Take on Intel, AMD
When China launched its first microprocessor, the Godson 1 in 2002, it wasn't much of a competitor to what Intel and AMD had to offer. The ...
OS News
Possible new semiconductors based on carbon fullerenes
Chemistry professor Harry Dorn from Virginia Tech said he developed reliable ways to manufacture and construct 80-atom fullerene molecules ...
TG Daily
Physicists Harness Disorder in Magnetic Sensors
University of Chicago scientists have discovered how to make magnetic sensors capable of operating at the high temperatures that ceramic ...
The University of Chicago
Nanotechnology for Data Memories
IBM's recent nanotechnology data storage news reads, "IBM set to supercede Flash with superfast, high capacity, low cost Racetrack ...
NewsBlaze
Super-collider enabled by EEs
The world's most powerful particle accelerator, the Large Hadron Collider (LHC), will attempt to form its first particle beam on Wednesday, ...
EETimes
E-Step Xeons prove more efficient
Intel released five new Xeons, collectively known as the E-step parts, all of which promise greater efficiency than their predecessors. There ...
The Inquirer
AMD pushes out three more triple-core chips
Advanced Micro Devices Monday unveiled more triple-core processors, adding to several models released earlier this year. The announcement ...
Digital Arts

Control Costs and Maximize Yield
Discover the XD7600NT
Dage Precision Industries CTIf you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more…
Dage Precision Industries

Corporate News Submit
Kulicke & Soffa Launches Relmax Gold Bonding Wire
Kulicke & Soffa Industries, Inc. announced the launch of RelMax -- a new 2N gold ball bonding wire developed in response to market demand for ...
Kulicke & Soffa
SUSS MicroTec Introduces New Production Wafer Bonder for CMOS Image Sensor Market
At this year's Semicon Taiwan, SUSS MicroTec introduces the XBC300 Production Wafer Bonder for the CMOS Image Sensor (CIS) market. Visitors ...
SUSS MicroTec
DuPont Microcircuit Materials Features Enabling Technologies at the FISITA World Automotive Conference
DuPont Microcircuit Materials will exhibit the latest innovations in automotive electronic ceramic circuits using DuPont thick film ...
DuPont
Today's Sponsor

YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech

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Run Cooler
with Thermal Interface Materials from Shin Etsu
Run CoolerThermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more…
ShinEtsu

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MEPTEC Presents Semiconductor Packaging
Impacting the Age of Consumer Electronics
Medical Electronics SymposiumJoin MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more…
MEPTEC


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