We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers September 5, 2008 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   Pentagon Worries About Chinese Chips At a conference in Washington, D.C., this week, a Department of Defense official sounded a startling alarm. "The defense community is ... Forbes Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Industry News   Taiwan Ships 27.99 M. Notebook PCs in Q2: IDC Taiwan Taiwan companies shipped 27.99 million notebook PCs in the second quarter, up 42% from a year earlier and up 4.5% from previous quarter, ... China Economic News Service Tegal Acquires Alcatel Micro Machining Systems in DRIE Move Aimed at TSVs With 3-D wafer-level interconnects as a major target, Tegal Corp. said it will acquire the deep reactive ion etch (DRIE) and plasma enhanced ... Semiconductor International Multi-Core Chip Research to Lead to Performance Gains Power Reduction for High- and Low-End Computing with $6 Million Support from NSF, SRC; Joint research by Semiconductor Research Corporation ... infoZine German government funds 32-nm mask litho project With the aim of giving the Dresden region of Germany a competitive edge in advanced photomask development and manufacturing, the German ... EDN Despite Solar Excitement, Novellus Chief Focused On Chips Building a presence in solar power has been the growing trend among companies with experience making and manufacturing semiconductors, ... CNN Money Analyst: NAND flash market has 'fallen apart' The NAND flash memory market was on track to post growth for 2008, but now appears ticketed for a 10 percent decline, according to Bryan ... EETimes Details finally due from AMD on 'fab-lite' AMD could announce later this month a significant advance towards its long-touted fab-lite strategy that involves spinning out its Dresden, ... EETimes LDK Solar signs $32M contract with GT Solar LDK Solar Co. said Thursday it has inked a $32 million contract with GT Solar International Inc. for polysilicon CVD reactors to install ... Forbes Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Technology News   Six Ways to Track Your Competitors Online Who needs industrial espionage these days? Keeping tabs on your main competitors has never been so easy. You can use the Web in a variety ... Inc. Technology The Key to Smaller, More Powerful Gadgets Gadget buyers today can purchase PCs, cell phones and mp3 players with significantly more memory than their predecessors for just a few ... Scientific American Polycrystalline price affects thin film solar growth During the time through 2015, the global solar cell market will exhibit a breathtaking growth — from a market volume of 5.6 GW in 2008 to 79.5 ... EETimes When atoms count In my previous blog, Reading the tea leaves, I stated that: "it is impossible to divide an atom in two while maintaining a non-explosive ... EETimes On-the-fly circular substrate centering for robotized vacuum systems A new method for on-the-fly detection and correction of substrate-centering inaccuracies of a circular substrate is presented. ... Solid State Technology Using FPGAs in consumer electronics It may seem odd to be reading about analog-audio and -video processing when the industry is currently focusing on the analog transmission ... EDN Ultrasonic Sensor The UC4 ultrasonic sensor from Sick Inc. offers detection of optically difficult targets and provides performance in optically challenging ... Photonics Module targets embedded-system design Building on its popular FPGA-based PXI (PCI extensions for instrumentation), PC, and CompactRIO (reconfigurable-input/output) ... EDN Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit CIMAC Introduces Packaged Service Solution for MES Migration CIMAC announced they are now offering a new MES (Manufacturing Execution Systems) migration packaged service solution for semiconductor ... CIMAC Agilents' New 10 MHz Function/Arbitrary Waveform Generator Agilent Technologies Inc. introduced a new member of the function/arbitrary waveform family that delivers high-quality waveforms ... Agilent Technologies IMEC and CEA-LETI gear up cost-effective silicon photonics prototyping service IMEC and CEA-LETI launch ePIXfab, the continuation of their successful multi-project wafer silicon photonics prototyping service started in ... IMEC Today's Sponsor ShinEtsu Resists - Perfect for 3D packaging, WLP, TSV and wafer bonding For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. ShinEtsu Photo Resist Coating System Featuring Ultrasonic Technology USI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more… Ultrasonic Systems, Inc. Control Costs and Maximize Yield Discover the XD7600NT If you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. 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