We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers September 2, 2008 Case Study & Application Note Measure solder bump coplanarity Does your Bumping Process Maintain the Same Plane? Ensuring the height and coplanarity of conductive bumps improves yields. Learn more... Cyber Technologies Semicon Korea: The largest exposition dedicated to semiconductor and FPD manufacturing Join Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more… SEMI Letters Submit Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Top Story   Semiconductor industry heading into 'era of profitless prosperity' The semiconductor industry may be heading into an "era of profitless prosperity," according to Stephen Newberry, president and CEO of Lam ... Semiconductor International Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Industry News   Solar Conference Chair Makes Call for Scientists At the opening session of the European Photovoltaic Solar Energy Conference (EU PVSEC) this morning in Valencia, Spain, Daniel Lincot, ... Semiconductor International How 'reorganized' is AMD? It's not a mirage. Really. Advanced Micro Devices Inc.'s financial results have not reflected this but the microprocessor and graphics IC ... Elelctronics Supply & Manufacturing Hynix Completes Construction of 300mm Fabrication Plant in Cheongju Hynix Semiconductor Inc has completed construction of its third factory in Cheongju, Korea. The two-storey factory has 300mm wafer fabrication ... Tech-On Still not direct shipping? – What a waste It was a novel idea in the late 1980s, when TFI started consulting to the electronics contract manufacturing industry: Have your contract ... Technology Forecasters, Inc. Asian chip market to hit US$160B The semiconductor industry is set to enjoy a year-on-year growth of 6.4 percent to reach US$160 billion in 2008, according to new forecast ... ZDNet Asia Global semi sales up 2.8% in July Sales of semiconductors in Europe in July grew by 0.7 percent to reach $3.39 bn according to the World Semiconductor Trade Statistics (WSTS) ... EETimes Sensors to drive global MEMS market to $8.8 billion in 2012 The global market for MEMS (microelectromechanical systems) will expand to $8.8 billion in 2012, up from $6.1 billion in 2006, iSuppli Corp ... EDN E2v buys US military chip company for $65m UK microwave and senior firm e2v Technologies has conditionally agreed to buy QP Semiconductor, a California end-of-life semiconductor supplier ... ElectronicsWeekly Sino-American Silicon, SILFAB Ink Multibillion Silicon Supply Contract Silicon-wafer maker Sino-American Silicon Products Inc. of Taiwan recently signed a five-year contract to buy NT$7.23 billion (US$233 ... China Economic News Service Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Technology News   Sun Makes History: First Spotless Month in a Century Drop in solar activity has potential effect for climate on earth. The sun has reached a milestone not seen for nearly 100 years: an entire month ... Daily Tech Fine-Tuning CMP With each new technology node, all process windows become progressively smaller, and the window for overpolishing is no exception. Shrinking ... Semiconductor International Will memristors prove irresistible? The transistor was invented in 1925 but lay dormant until finding a corporate champion in Bell Labs during the 1950s. Now another ... EETimes Dow Corning aims to decrease cost of solar power with manufacturing process Aimed at significantly increases the production rate of solar panels to lower the cost per watt of solar power, Midland, Mich-based Dow ... Semiconductor International Test Ideas: DPGA conditions signals with negative time constant With two op amps and three analog switches, you can build a programmable amplifier that conditions signals prior to digitizing. Digitally ... Test & Measurement World New analog, mixed-signal standard Accellera, the electronics industry organization focused on Electronic Design Automation (EDA) standards, recently announced that its Board ... CyberMedia India Online Control Costs and Maximize Yield Discover the XD7600NT If you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more… Dage Precision Industries Corporate News Submit IMEC and Plextronics collaborate on high-efficiency reproducible organic solar cells IMEC, and Plextronics, Inc. signed an agreement to collaborate on state-of-the-art materials and inks for organic solar cells. With this ... IMEC and Plextronics JPSA Appoints Mojo Solar Industry Rep for U.S. J. P. Sercel Associates (JPSA) announces the appointment of Maurice G. Covino and Joan M. Bickmann, partners in Mojo Solar LLP, as sales ... JPSA Today's Sponsor YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Better Reflectivity Control with ShinEtsu GBARC ShinEtsu GBARC for high NA immersion lithography. Single layer reflectivity control for CD swing control and standing wave elimination. Straighter profiles with no footing; low LER. Eliminates dual barc coats saving process steps and chemicals. Learn more… ShinEtsu MEPTEC Presents Semiconductor Packaging Impacting the Age of Consumer Electronics Join MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more… MEPTEC Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.