We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers August 28, 2008 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   Demand for MEMS will rise Don't be surprised if more microelectromechanical systems (MEMS) appear on bills of materials. The MEMS market will grow from about $6.1 ... Purchasing Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Industry News   PC related IC design houses turn conservative over 3Q outlook on falling demand from motherboards PC related IC design houses Realtek Semiconductor, Anpec Electronics and Integrated Technology Express (ITE) have all reduced their sales ... DigiTimes Sitronics Plans 300 mm Fab at Zelenograd Sitronics Inc. (Moscow) will receive more than a billion dollars from a Russian governmental investment fund to build a 300 mm wafer fab at ... Semiconductor International IEC Announces New Miniaturized, Secure GPS Receiver Module L-3 Interstate Electronics Corporation (IEC), based in Anaheim, California, has announced its latest miniaturized GPS receiver, the ... Inside GNSS Channel cautious over LCD price recovery talk Middle East resellers trading in LCD displays remain doubtful of seeing a stabilisation in prices over the coming months despite indications ... Arabian Business Taiwan Prosecutors Probe Contract Chipmaker UMC Taiwan-based contract chip maker United Microelectronics (UMC) confirmed that Taiwanese prosecutors have been to its offices as part of an ... Barron's Blogs Amtech Announces $7.5 Million Solar Order Amtech Systems, Inc. announced that its solar subsidiary, Tempress Systems, Inc., has received a $7.5 million follow-on solar order for ... Market Watch Photovoltaics underestimated, says SunPower co-founder If the growth of photovoltaic (PV) solar cell installations were to continue at the current rate, they would be able to satisfy all U.S. ... EETimes STATS ChipPAC Announces Manufacturing Agreement With Infineon on First Generation eWLB Technology STATS ChipPAC Ltd. announced it has entered into an agreement with Infineon Technologies AG (FSE/NYSE: IFX) to provide manufacturing ... Market Watch Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Technology News   Novaled achieves break through in organic CMOS-type tec The success of today's digital electronics is based on the CMOS technology. Novaled found a way to translate the classical inorganic ... Printed Electronics World Bell Labs Kills Fundamental Physics Research After six Nobel Prizes, the invention of the transistor, laser and countless contributions to computer science and technology, it is the ... Wired Finding a new way to ease microscopic friction When you're working on a machine that is smaller in size than a width of a hair -- such as the launch sensor in your car's airbag or ... St. Olaf College News Chip design firms develop tools for solar cell production To improve conversion efficiency, increase yield and reduce the manufacturing costs of solar cells, chip design software supplier ... Electronics Weekly Green energy research targets hydrogen, photosynthesis Green energy initiatives are striving to replace fossil fuels with renewable resources like hydrogen and photosynthesis. The U.S. Energy ... EETimes Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit PEEK-energized Seal Launched by Trelleborg Trelleborg Sealing Solutions launches the patent-pending Turcon® Variseal® PS, a PEEK-energized seal with extremely low leach-out in ... Trelleborg Sealing Solutions JPSA Appoints Mojo Solar Industry Rep for U.S. J. P. Sercel Associates announces the appointment of Maurice G. Covino and Joan M. Bickmann, partners in Mojo Solar LLP, as sales ... J. P. Sercel Associates Machine Vision Products announces partnership with Rubröder Machine Vision Products, Inc. is pleased to announce its new partnership with Rubröder GmbH Factory Automation. Rubröder GmbH Factory ... Machine Vision Products, Inc. Agilent Presents Web Seminar on Logic Analyzer Basics Join Agilent Engineer Joel Birch as he presents this complimentary webcast. During this event, Joel will explain why logic analyzers are ... Agilent Technologies Today's Sponsor Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Having Trouble Inspecting 3D Packages? CT offers virtual micro-sectioning In today's competitive world, quality is everything. Computerized tomography completely examines features that otherwise remain hidden. The Dage XD7600NT provides the fastest CT reconstruction in the industry and can be easily switched from 2D to 3D modes. Learn more… Dage Precision Industries Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. 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