We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers August 27, 2008 Cyber Technologies is leader in laser-based, high-resolution 3D inspection for microelectronics Our world-class clients rely on our CyberScan Vantage Systems for inspection of: Substrate Flatness, Bump and Ball Coplanarity, Wire Bond Loop Height, Film and Paste Thickness & Volume and Transparent Materials Deposition. Learn more... Cyber Technologies Semicon Korea: The largest exposition dedicated to semiconductor and FPD manufacturing Join Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more… SEMI Letters Submit Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Top Story   Semi Fab Projects Brighten 2009 Industry Outlook According to the World Fab Forecast report, recently released by SEMI, a projected decline in world semiconductor fab equipment spending of 20 ... SEMI Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Industry News   Micron said to be upping its packaging orders to Taiwan With Micron Technology having reporting losses for five consecutive quarters, the memory maker is expected to outsources more NAND flash ... DigiTimes Sensors Take the Growth Baton in the Global MEMS Market Driven by new demand from consumer electronics and wireless applications, the global market for Microelectromechanical Systems (MEMS) will expand ... iSuppli Corporation MEMSCAP: First Half 2008: 24% Growth in Dollars MEMSCAP announced its earnings for the first half 2008, ending June 30, 2008. In accordance with the figures given in the first and second ... Business Wire Worldwide WLAN and Bluetooth Semiconductor markets present high growth opportunities for wireless chip suppliers The WLAN and the Bluetooth semiconductor markets continued to post double digit growth in 2007, driven by strong demand for connected ... RF Design Keithley Receives Industry Award for Semiconductor Measurement System Keithley Instruments, Inc. announces that it has been awarded the prestigious Editor's Choice Best Product Award from Semiconductor ... Market Watch Intel invests in WAN accelerator firm Expand Networks Inc., a supplier of application acceleration solutions over the wide area network (WAN), has secured $8.5 million of funding ... EETimes UTAC sales growth to beat rivals in 3Q By projecting its third-quarter sales will grow by more than 10% on quarter, United Test and Assembly Center (UTAC) may take a lead over ... DigiTimes Glut of PC chips hurting Qimonda The plummeting price of computer memory chips has forced cutbacks at Qimonda, a once-fast-growing company that earlier this year withdrew ... News & Observer GSMC likely to source 8" wafer fab tools from STMicroelectronics After seeing its discussions for a potential purchase of 8-inch wafer fabrication tools from fellow foundries fail, China-based foundry ... DigiTimes Japan ministry to seek $1.2 billion for new energy A Japanese ministry is seeking $1.2 billion next year to speed up alternative energy use -- a 50 percent hike from 2008 -- as the ... EETimes MEMC Electronic Materials: Solar Channel Checks Solid, Semis Weak FBR previews MEMC Electronic Material's (WFR) mid-quarter update and says that despite strength in the company's solar wafer shipments, weak ... Cluster Stock Photo Resist Coating System Featuring Ultrasonic Technology USI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more… Ultrasonic Systems, Inc. Technology News   Evaluation Platform Enables Prototyping Allowing DSP or processor aggregation, Tundra Semiconductor’s Tsi620 multi-standard RapidIO switch evaluation platform enables prototyping ... ECN Magazine Northeastern University Physicists Develop Nano-Optical Lens Using semiconductor nanotechnology, Srinivas Sridhar, Ph.D., Distinguished Professor and Chair of Physics at Northeastern ... PhysOrg Layout guidelines help manage video equalizer's return loss A brief examination of the exercise performed to optimize the design of the Cypress Video Equalizer evaluation board demonstrates how the ... Embedded Congress must renew R&D credit For most politicians, job growth is a top priority. Yet as Congress wrestles with many complex issues, a simple measure that helps create ... Arizona Daily Star Magma to Develop Yield Enhancement Software for Solar Cell Fabs Magma(r) Design Automation Inc. announced development of a new yield enhancement software system customized for solar fabs to improve ... Semiconductor International Control Costs and Maximize Yield Discover the XD7600NT If you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more… Dage Precision Industries Corporate News Submit DuPont Air Products with Interim Ruling in Patent Infringement Case DuPont Air Products NanoMaterials L.L.C. remains confident in its legal positions following a Markman ruling as part of the patent ... DuPont Air Products NanoMaterials L.L.C. Datapaq's Solar Cell Thermal Profiling System at Photovoltaic Datapaq, Inc. will showcase its long proven Solar Cell thermal profiling system and newest analysis software at the 23rd European Photovoltaic ... Datapaq Pac Tech USA Announces Grand Opening Celebration Pac Tech Packaging Technologies is planning a grand opening celebration on September 18 at its new 55,000 square foot facility in Penang, ... Pac Tech USA Today's Sponsor YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu MEPTEC Presents Semiconductor Packaging Impacting the Age of Consumer Electronics Join MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. 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