We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers August 26, 2008 Cyber Technologies is leader in laser-based, high-resolution 3D inspection for microelectronics Our world-class clients rely on our CyberScan Vantage Systems for inspection of: Substrate Flatness, Bump and Ball Coplanarity, Wire Bond Loop Height, Film and Paste Thickness & Volume and Transparent Materials Deposition. Learn more... Cyber Technologies Semicon Korea: The largest exposition dedicated to semiconductor and FPD manufacturing Join Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more… SEMI Letters Submit Intel teases shape-shifting programmable matter The thumb-size cell phone is almost small enough for what I see as the ultimate design: the rectal phone ... George Riley FlipChips Dot Com Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Top Story   SEMI's Forum Considers Slow Growth, Memory Pains, Design Capability Decline At SEMI’s Silicon Valley Lunch Forum, held in Santa Clara, Calif., three leading analysts shared their views on the state of the industry over ... Semiconductor International Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Exclusive   Where Electronics and Alternative Energy Merge The solar industry has a bright future, no pun intended. The worlds increasing demand for energy, sky high oil prices and concern over the environmental impact of fossil fuels is pushing solar energies incredible growth. The process of manufacturing ... Steve DeCollibus, Managing Editor Semiconductor Packaging News Industry News   Nvidia GPU failures caused by material problem, sources claim When Nvidia announced in early July that it has noticed a higher than normal failure rate in some of its notebook chips, investors reacted ... TG Daily July book-to-bill ratio climbs to 0.83 According to the World Fab Forecast report, recently released by SEMI, a projected decline in world semiconductor fab equipment spending of 20 ... SEMI Seventy Fab Projects Brighten Industry Outlook in 2009 According to the World Fab Forecast report, recently released by SEMI, a projected decline in world semiconductor fab equipment spending of 20 ... Market Watch Chip makers get moving with motion sensing chips Chip makers are convinced of the potential for motion sensing chips in portable gadgets, thanks to the success of Nintendo's Wii game ... Reuters Bhaskar Silicon plans $1.27 billion solar facility in India The country's first integrated polysilicon plant plans to be capable of producing silicon for 250 megawatts of cells a year. Singapore-based ... Clean Tech AMD Is Gaining Share Against Intel An analyst said in a research note that struggling chip maker Advanced Micro Devices appeared to be gaining some ground on rivals including ... Trading Markets Industrial motors power chip market shows 9% annual growth The market for power semiconductors in industrial motor drives is set to grow from $1 billion in 2007 to $1.3 billion in 2010, with the growth ... EETimes Photo Resist Coating System Featuring Ultrasonic Technology USI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more… Ultrasonic Systems, Inc. Technology News   IBM Claims Breakthrough in Carbon Nanotube Research In a new paper, IBM researchers are detailing what IBM calls a significant breakthrough in the field of nanotechnology that could ... eWeek Easing the challenge of RF design: Wireless Links and Antennas The very mention of RF design is usually enough to scare all but the most confident designer. However, wireless specialists such as the company ... Embedded Improving AFM Data Reliability Negative-stiffness vibration isolation technology improves data set integrity. It was not until long after 1977 that the name ... R & D Magazine Control Costs and Maximize Yield Discover the XD7600NT If you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more… Dage Precision Industries Corporate News Submit eHealth closer to reality thanks to real-time relevant medical data extraction In the framework of Holst Centre, IMEC has broadened the functionality and scope of its wireless health monitoring technology by linking it ... IMEC BTU Receives Multi-Million Dollar Order for Thin Film Solar Equipment BTU International announced the receipt of an order from a major thin film solar customer. The order, exceeding two million dollars in value ... BTU International Seica Inc. & Corelis Ally to Create More Versatile Test Solution Seica Inc. and Corelis, Inc. announced formation of a partnership to deliver and support an integrated system based on Seica’s Pilot flying ... Seica Inc. Today's Sponsor YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech ShinEtsu Resists - Perfect for 3D packaging, WLP, TSV and wafer bonding For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. ShinEtsu MEPTEC Presents Semiconductor Packaging Impacting the Age of Consumer Electronics Join MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more… MEPTEC Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. 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