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  Photo Resist Coating System
Featuring Ultrasonic Technology
Photo Resist Coating SystemUSI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more…
Ultrasonic Systems, Inc.
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Die attach, flip chip placement, & SMT in one machine
CX-1The CX-1 placement machine is capable of handling a wide range of components, including SiP and MCM doing the work of two machines, saving capital investment and simplifying operations & maintenance. Learn more…
Juki Automation Systems




Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
  Letter to the Editor Index
Aug 26, 2008

Intel teases shape-shifting programmable matter

The thumb-size cell phone is almost small enough for what I see as the ultimate design: the rectal phone.

It will be a totally hands-off phone. It will also let all of the obnoxious public mobil phone A.H.s communicate directly with other A.H.s without annoying innocent bystanders.

See: Intel teases shape-shifting programmable matter.


George Riley
FlipChips Dot Com

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5 Micron Placement Capable!
Small Footprint, Low Cost
Air-Vac Onyx500The new ONYX500 Benchtop is the ultimate precision, multifunctional system with a wide range of applications including MEMS with automatic pick, place, dispense and assembly. Learn more…
Air-Vac Engineering




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