We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers August 21, 2008 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   Orders for semi equipment at lowest level since Nov. 2003, SEMI reports Reflecting the pronounced cutback in capital expenditures this year, North America-based semiconductor manufacturing equipment providers ... EDN Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Industry News   UMC said to also have MEMS devices production in-house While most industry watchers regard Asia Pacific Microsystems (APM), an United Microelectronics Corporation (UMC) affiliate, as the pure-play ... DigiTimes Moto clings to 3rd place, handset IC industry consolidates, Jha settles in: Signs of Qualcomm, Moto mobile merger? When Sanjay Jah left Qualcomm to join Motorola as Co-CEO and CEO of its mobile devices business earlier this month, you knew more executive ... EDN Storage system semiconductor market to reach $1.3 billion in 4 years The global market for enterprise storage system semiconductors will reach $1.3 billion by 2012, growing at a CAGR of 6 percent, according to IDC ... Electronic Components Growth seen in auto MCU market In 2008, the worldwide automotive microcontroller unit (MCU) market is on pace to total $5.3 billion, according to Gartner Inc. The world ... EETimes Board biz no stretch for Stretch Making chips and developing reference designs may no longer be enough to sustain traditional semiconductor companies, especially Application ... EETimes The Next Revolution for Semiconductor Packaging and Circuit Assembly Industries Electronics.ca Publications, the electronics industry market research and knowledge network, announces the availability of a new market study ... PR.com Big LCDs Set For Comeback, iSuppli Says Although the slow economy has hurt sales of larger LCD panels in recent months, the sector is primed for a comeback. That’s according to a ... Dealerscope Skyworks to supply chips to Lockheed Martin for 5 years Skyworks Solutions Inc. reports it has signed a five-year, multi-million dollar contract with Lockheed Martin to supply semiconductors for ... Mass High Tech Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Technology News   Digital home closer to reality, but obstacles remain Imagine being able to watch a show any time from any room, listen to a radio station hundreds of miles away or view new photos instantly on ... Market Watch Finer lines for next generation microchips The ability to draw finer lithographic patterns determines the semiconductor industry's ability to move into lower process nodes. ... Dataweek Fast Quantum Computer Building Block Created The fastest quantum computer bit that exploits the main advantage of the qubit over the conventional bit has been demonstrated by researchers ... Science Daily Intel slips details of dual-core Atom chip Intel at its Developer Forum is quietly providing new details of its widely reported dual-core Atom processor. Although not providing all ... Electronista Netcrystal Stretches the Limits of Solar Performance and YHN's Credulity Could Netcrystal's MEMS-style solar tech exceed that of SunPower while also beat Nanosolar's prices? Senior Analyst Eric Wesoff checks it out ... Greentech Media Intel pitches getting inside cheap processors The chipmaker that became a household name with its "Intel Inside" campaign now hopes to leverage its dominance of the PC to win a share ... San Francisco Chronicle Researchers use viruses to make microbatteries for mini devices As devices shrink to microscopic proportions they need similarly-sized batteries to make them run. Although no such batteries exist today, a ... Scientific American Novaled Achieves Break Through in Organic CMOS-type Technology The success of today's digital electronics is based on the CMOS technology. Novaled found a way to translate the classical inorganic ... PR-Inside.com Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit AZ Electronic Materials announces product price increase AZ Electronic Materials (AZ-EM) announced that it has raised prices globally by up to 15% across its product range from August 1, 2008, in ... AZ Electronic Materials MacDermid Forms Photovoltaics (Solar Cell) Business MacDermid, Incorporated has announced the formation of Photovoltaics, a new business unit. This new group lead by Don Cullen is being formed ... MacDermid, Incorporated Today's Sponsor Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu mBGA Flux deposition with ultrasonic coating technology USI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more... Ultrasonic Systems, Inc. Checking for Brittle Fracture Failures? Replace drop testing with high strain rate bondtesting Detecting brittle fracture failures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more… Dage Precision Industries Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.